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Sandisk Corp Patents
What Sandisk Corp has filed at the patent office — applications as well as grants, because a filing is on the record eighteen months before anyone has to say what it was for.
SNDK on carbonthat →Filings on file
65
Granted
1
Still pending
64
Filed under
3 names
65 filings
Newest filing first. A pending application has no patent number yet, and most never get one.
| Invention | Patent |
|---|---|
| THREE-DIMENSIONAL MEMORY DEVICE CONTAINING PERIPHERAL CIRCUIT WITH FIN FIELD EFFECT TRANSISTORS AND METHOD OF MAKING THE SAMEH10B 43/20, H10B 43/10, H10D 80/30, H10D 84/834, H10D 84/8311, H10D 84/8312, H10W 90/792Filed as Sandisk Technologies, Inc.2026-06-22Satoru MAYUZUMI | pending |
| THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LOW OXYGEN DENSITY DIPOLE-CONTAINING BLOCKING DIELECTRIC LAYERH10W 90/792, H10B 80/00, H10B 43/30, H10B 43/40, H10B 43/10, H10B 43/27, H10D 64/691, H10D 80/30, H10D 64/685, H10D 30/693, H10D 30/0413, H10D 64/693, H10D 62/83, H10W 80/312, H10W 90/724, H10W 80/327, H10W 90/722Filed as Sandisk Technologies, Inc.2026-06-08Wei CAO | pending |
| MULTI-WAFER BONDING FOR NAND SCALINGH10W 70/685, G11C 16/28, H10B 43/35, H10B 43/27, H10W 74/10, H10W 72/07253, H10W 80/732, H10W 90/701, H10W 90/732, H10W 72/232, H10W 72/932, H10W 90/00, H10W 72/90, H10W 72/20, H10W 90/297, H10W 72/30, H10W 90/722, H10W 90/792, G11C 7/18, G11C 16/0483Filed as Sandisk Technologies, Inc.2026-06-08Hiroki Yabe | pending |
| SEMICONDUCTOR DEVICE INCLUDING LASER BEAM ABSORPTION ENHANCEMENT STRUCTURES AND METHODS FOR FORMING THE SAMEH10B 80/00, H10B 43/50, H10B 43/30, H10B 43/40, H10B 43/10, H10B 43/27, H10D 80/30, H10D 30/693, H10D 62/292, H10D 62/832, H10D 30/0413, H10D 62/83, H10W 72/952, H10W 80/312, H10W 80/338, H10W 90/792Filed as Sandisk Technologies, Inc.2026-05-22Kento ISERI | pending |
| Video Processing in a Memory DeviceH04N 19/176, H04N 19/51, H04N 19/103, H04N 19/159, H04N 19/433, H04N 19/436, H04N 19/513, H04N 19/52, H04N 19/58, G06F 9/30032, G06F 9/30036, G06F 11/1048, G11C 16/0483Filed as Sandisk Technologies, Inc.2026-05-20Alon MARCU | pending |
| Data Storage Device and Method for Selectively Performing a Program-Verify OperationG06F 12/0246Filed as Sandisk Technologies, Inc.2026-04-21Ankan Mukhopadhyay | pending |
| THREE-DIMENSIONAL MEMORY DEVICE WITH INTEGRATED WORD LINE AND CONTACT VIA STRUCTURES AND METHOD OF MAKING THEREOFFiled as SANDISK TECHNOLOGIES, INC.2026-03-25RUOGU MATTHEW ZHU | pending |
| Method for Implementation of Batched I/O CommandsG06F 3/061, G06F 3/0659, G06F 3/0679Filed as Sandisk Technologies, Inc.2026-03-09Judah Gamliel HAHN | pending |
| BONDED ASSEMBLIES WITH TEST PADS AND METHODS FOR FORMING THE SAMEH10P 74/273, G11C 16/0483, H10B 43/35, H10B 80/00, H10B 43/40, H10B 43/10, H10B 43/27, H10W 72/967, H10P 72/743, H10W 90/00, H10W 90/297, H10P 72/7432, H10P 72/7424, H10P 72/7426, H10W 80/314, H10W 80/327, H10W 90/722, H10W 90/792Filed as Sandisk Technologies, Inc.2026-02-12Akio NISHIDA | pending |
| SEMICONDUCTOR DEVICE INCLUDING MIRRORED DIE PAIRSH10B 80/00, H10W 90/00, H10W 42/121, H10W 90/291, H10W 90/701, H10W 90/732, H10W 70/099, H10W 72/823, H10W 90/28, H10W 90/26, H10W 70/65, H10W 72/834, H10W 90/20, H10W 72/20, H10W 99/00, H10W 90/22, H10W 90/271, H10W 90/297, H10W 90/724, H10W 90/754, H10W 70/614, H10W 90/722, H10W 90/734, H10W 90/752, H10W 70/09, H10W 90/792, H10W 70/60, H10W 90/24, H10W 70/611, H10W 70/62Filed as Sandisk Technologies, Inc.2026-02-03Choong Keat Loh | pending |
| Adaptive Host Memory Buffer Traffic ControlG06F 3/0635, G06F 9/4408, G06F 3/0613, G06F 3/0656, G06F 3/0673, G06F 3/0679, G06F 21/575Filed as Sandisk Technologies, Inc.2025-12-10Michael IONIN | pending |
| Converting DIX to DIF for Host DeviceG06F 3/0661, G06F 3/0673, G06F 3/0604, G06F 3/064, G06F 3/0656, G06F 3/0658, G06F 3/0679Filed as Sandisk Technologies, Inc.2025-12-10Amir SEGEV | pending |
| Intelligent Data Duplication/BackupG06F 3/0607, G06V 20/40, G06F 3/065, G06F 3/0673, G10L 15/08, G10L 15/16Filed as Sandisk Technologies, Inc.2025-12-10Wei Hong TEW | pending |
| Apparatus for Persistent Memory ManagementG06F 16/2365, G06F 11/1441, G06F 11/1666, G06F 11/20, G06F 12/0238, G06F 12/0804, G06F2212/202Filed as Sandisk Technologies, Inc.2025-12-10Nisha TALAGALA | pending |
| BIFACIAL SEMICONDUCTOR WAFERH10W 90/00, H10W 20/20, H10D 88/101, H10W 80/00, H10W 70/65, H10W 90/297, H10W 90/722, H10W 70/60Filed as Sandisk Technologies, Inc.2025-12-03Lei Shi | pending |
| THREE-DIMENSIONAL MEMORY DEVICE WITH INTEGRATED WORD LINE AND CONTACT VIA STRUCTURES AND NON-LINEAR DIELECTRIC ISOLATION STRUCTURESH10B 43/27, H10B 43/35, H10B 43/10Filed as Sandisk Technologies, Inc.2025-11-20Ryota SUZUKI | pending |
| GATE-INDUCED DRAIN LEAKAGE PRE-CHARGE IN SUB-BLOCK MODE FOR THREE OR MORE TIER NON-VOLATILE MEMORY STRUCTUREG11C 16/0483, G11C 16/3459, G11C 11/5628, G11C 16/08, G11C 16/10, G11C 16/24, G11C 16/28Filed as Sandisk Technologies, Inc.2025-11-05Peng Zhang | pending |
| TRIPLE PLUG UNIVERSAL SERIAL BUS (USB) CABLE FOR USE WITH DATA STORAGE DEVICE WITH DUAL MEMORY SPACESG06F 13/382, G06F 13/4282, G06F 13/1668, G06F 13/385, G06F 13/4022, G06F 13/4027, G06F 13/4068, G06F 13/409, G06F2213/0042Filed as Sandisk Technologies, Inc.2025-10-17Ankur Agrawal | pending |
| PROCESSING CORE INCLUDING INTEGRATED HIGH CAPACITY HIGH BANDWIDTH STORAGE MEMORYG06F 13/1663, G06F 13/4068, G06F 13/1689Filed as Sandisk Technologies, Inc.2025-09-29Nagesh Vodrahalli | pending |
| Multiple Key Index List MaintenanceG06F 3/0604, G06F 3/0659, G06F 3/0673, G06F 3/0679Filed as Sandisk Technologies, Inc.2025-09-24Amir SEGEV | pending |
| Bandwidth Averaging Using Credit CountersH04L 43/0882, H04L 47/527Filed as Sandisk Technologies, Inc.2025-09-22Amir SEGEV | pending |
| Address Translation Following Invalidate RequestG06F 12/0891, G06F 12/1027, G06F 12/0246, G06F 12/10, G06F2212/7201Filed as Sandisk Technologies, Inc.2025-09-18Shay BENISTY | pending |
| Write Command with a Write Protect Attribute ExecutionG06F 12/023, G06F 13/1668, G06F 3/061, G06F 3/0619, G06F 3/0659, G06F 3/0679, G06F 12/0246, G06F 13/28, G06F2212/1032, G06F2212/1041, G06F2212/7204Filed as Sandisk Technologies, Inc.2025-09-11Amir SEGEV | pending |
| Small Device Testing Using ThermesthesiometerG01N 25/18, G01R 31/2875, G01K 3/005, G01K 7/02, G01M 99/002, G01R 31/2601, G01R 31/2862Filed as Sandisk Technologies, Inc.2025-09-09Rohan SHIRSAT | 12742815 |
| SYSTEMS AND METHODS FOR USE WITH RECURRENT NEURAL NETWORKSG06N 3/063, G11C 11/54, G06N 3/09, G06N 3/044, G06N 3/0442, G06N 3/08, G11C 11/40Filed as Sandisk Technologies, Inc.2025-08-20Alexander Bazarsky | pending |
| SELF-LOCKING DATA STORAGE DEVICEFiled as SANDISK TECHNOLOGIES, INC.2025-08-18JUDAH GAMLIEL HAHN | pending |
| ECO-FRIENDLY PRINTED CIRCUIT BOARD FOR HIGH TEMPERATURE AND LOW TEMPERATURE APPLICATIONSH05K 1/0298, H05K 1/0366, H05K 1/0373, H05K 3/4644Filed as Sandisk Technologies, Inc.2025-07-31Vigneshwarram Kumaresan | pending |
| Adaptive Use of Multiple Channels and Memory Cell Conversion in a Storage DeviceG06F 3/0604, G06F 3/0631, Y02D 10/00, G06F 3/0679, G06F2212/1016Filed as Sandisk Technologies, Inc.2025-07-24Shay BENISTY | pending |
| 2D Barcodes for Access AutherizationG06F 13/4282, G06F 21/6218, G06F 13/382, G06F2213/0042, G06K 19/06037Filed as Sandisk Technologies, Inc.2025-07-24Ankit RAJANI | pending |
| CMB Caching Mechanism Using Hybrid SRAM/DRAM Data Path To Store CommandsG06F 12/0868, G06F 12/0875, G06F 3/061, G06F 3/0656, G06F 3/0659, G06F 3/0679, G06F 12/0804, G06F 12/0888, G06F 12/0897, G06F2212/1016, G06F2212/1024, G06F2212/214, G06F2212/221, G06F2212/312, G06F2212/313, G06F2212/7203Filed as Sandisk Technologies, Inc.2025-07-15Stephen GOLD | pending |
| Write Amplification Reduction with Sub-Indirection Unit (IU) HintingG06F 12/0884, G06F 13/1673, G06F 12/0868, G06F 12/0888, G06F 12/123, G06F2212/1008, G06F2212/214, G06F2212/312, G06F2212/313, G06F2212/466, G06F2212/502, G06F2212/7201, G06F2212/7203Filed as Sandisk Technologies, Inc.2025-07-11Karin INBAR | pending |
| I/O Prioritization During Model LoadG06F 3/0611, G06F 3/061, G06F 3/0659, G06F 3/0679Filed as Sandisk Technologies, Inc.2025-07-10Judah Gamliel HAHN | pending |
| INTEGRATED CIRCUIT TEST SOCKET WITH INTEGRATED DEVICE PICKING MECHANISMG01R 1/0466, G01R 1/0433, G01R 1/0458, G01R 1/0483, G01R 31/2893Filed as Sandisk Technologies, Inc.2025-07-02Yalaj Goyal | pending |
| STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THE SAME BY FORMING REPLACEMENT WORD LINESH10B 43/27Filed as Sandisk Technologies, Inc.2025-06-26Akihiro TOBIOKA | pending |
| THREE-DIMENSIONAL MEMORY DEVICE WITH INTEGRATED WORD LINE AND CONTACT VIA STRUCTURES AND METHOD OF MAKING THEREOFFiled as SANDISK TECHNOLOGIES, INC.2025-06-26RUOGU MATTHEW ZHU | pending |
| NON-VOLATILE MEMORY WITH EFFICIENT FAST READFiled as SANDISK TECHNOLOGIES, INC.2025-06-26JIAHUI YUAN | pending |
| STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THE SAME BY FORMING REPLACEMENT WORD LINESH10B 43/10, H10B 43/27, H10B 43/50, H10B 41/10, H10B 41/27Filed as Sandisk Technologies, Inc.2025-06-26Akihiro TOBIOKA | pending |
| READ FOR NON-VOLATILE MEMORY WITH REDUCED CURRENT LEVELSFiled as SANDISK TECHNOLOGIES, INC.2025-06-26SUJJATUL ISLAM | pending |
| NON-VOLATILE MEMORY WITH DYNAMIC SOURCE VOLTAGEFiled as SANDISK TECHNOLOGIES, INC.2025-06-25WEI CAO | pending |
| THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY SPLIT STAIRCASE REGIONSFiled as SANDISK TECHNOLOGIES, INC.2025-06-25HIROFUMI TOKITA | pending |
| BONDED ASSEMBLIES INCLUDING THROUGH-DIE VIA STRUCTURES AND METHODS FOR FORMING THE SAMEFiled as SANDISK TECHNOLOGIES, INC.2025-06-25MITSUTERU MUSHIGA | pending |
| THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SILICON OXYCARBIDE LINERS AND METHODS OF FORMING THE SAMEG11C 5/063, H10B 43/10, H10B 43/27, H10D 64/037, H10D 64/035, G11C 16/0483Filed as Sandisk Technologies, Inc.2025-06-25Jo SATO | pending |
| THREE-DIMENSIONAL MEMORY DEVICE INCLUDING COAXIAL DOUBLE CONTACT VIA STRUCTURES AND METHODS FOR FORMING THE SAMEG11C 5/063, G11C 16/0483, H10B 43/50, H10B 41/10, H10B 43/35, H10B 41/35, H10B 43/10, H10B 41/27, H10B 43/27, H10W 90/26, H10W 20/421, H10W 20/083, H10W 90/792, H10W 20/089Filed as Sandisk Technologies, Inc.2025-06-25Koichi MATSUNO | pending |
| FAST DUO-READ MODE FOR BIT FLIPS DETECTIONFiled as SANDISK TECHNOLOGIES, INC.2025-06-25XUAN TIAN | pending |
| THREE-DIMENSIONAL MEMORY DEVICE WITH SPLIT DIELECTRIC WALL STRUCTURES AND METHODS FOR FORMING THE SAMEFiled as SANDISK TECHNOLOGIES, INC.2025-06-25AKIHIRO TOBIOKA | pending |
| NON-VOLATILE MEMORY WITH DISTRIBUTED WRITEFiled as SANDISK TECHNOLOGIES, INC.2025-06-25XIANG YANG | pending |
| NON-VOLATILE MEMORY WITH INTEGRATED ARTIFICIAL INTELLIGENCE AND UPDATING MODELFiled as SANDISK TECHNOLOGIES, INC.2025-06-25SIXIANG ZHAO | pending |
| BONDED ASSEMBLY WITH LATERLLY SHIFTED CONNECTIONS AND METHODS FOR FORMING THE SAMEFiled as SANDISK TECHNOLOGIES, INC.2025-06-25JANG WOO LEE | pending |
| SELF-HEATING NAND FOR RECOVERY AT END OF LIFEFiled as SANDISK TECHNOLOGIES, INC.2025-06-25ALBERT BOR KAI CHEN | pending |
| BONDED ASSEMBLIES WITH TEST PADS CONNECTED TO THROUGH OXIDE VIA STRUCTURES AND METHODS FOR FORMING THE SAMEH10B 43/35, H10B 43/27, H10B 80/00, H10B 43/40, H10B 43/10, H10W 90/00, H10W 90/722, G11C 16/0483Filed as Sandisk Technologies, Inc.2025-06-24Yohei MASAMORI | pending |
| MULTIPLE READ BANDWIDTH FOR NON- VOLATILE MEMORYFiled as SANDISK TECHNOLOGIES, INC.2025-06-19XIANG YANG | pending |
| THREE-DIMENSIONAL MEMORY DEVICE WITH THROUGH-VIA CONTACT STRUCTURES AND DUMMY WORD LINES IN CONTACT REGION AND METHODS FOR FORMING THE SAMEFiled as SANDISK TECHNOLOGIES, INC.2025-06-19MASANORI TSUTSUMI | pending |
| THREE-DIMENSIONAL FLAT CELL MEMORY DEVICE WITH LATERAL ACCESS TRANSISTORS AND METHOD OF MAKING THE SAMEFiled as SANDISK TECHNOLOGIES, INC.2025-06-18RUOGU MATTHEW ZHU | pending |
| THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY-UNDULATING LATERAL ISOLATION TRENCHES AND METHOD OF MAKING THEREOF USING AT LEAST THREE ROWS OF ISOLATION OPENINGSFiled as SANDISK TECHNOLOGIES, INC.2025-06-18BING ZHOU | pending |
| Using Excess CMB Allocated to a Host for Storage Controller UtilizationG06F 3/0656, G06F 3/0604, G06F 3/0673Filed as Sandisk Technologies, Inc.2025-06-17Michael IONIN | pending |
| THREE-DIMENSIONAL MEMORY DEVICE CONTAINING DIELECTRIC STRUCTURAL SUPPORT ELEMENTS BETWEEN DIELECTRIC WALL STRUCTURES AND METHODS FOR FORMING THE SAMEFiled as SANDISK TECHNOLOGIES, INC.2025-06-12AKIHIRO TOBIOKA | pending |
| THREE-DIMENSIONAL MEMORY DEVICE WITH STACKED STAIRCASE REGIONS AND METHODS FOR FORMING THE SAMEFiled as SANDISK TECHNOLOGIES, INC.2025-06-12SHINSUKE YADA | pending |
| EARLY PROGRAM TERMINATION FOR NAND SLC PROGRAMFiled as SANDISK TECHNOLOGIES, INC.2025-06-12XUAN TIAN | pending |
| Data Storage Device with Efficient Decoder Pool and Method for On-the-Fly Decoder InitializationG06F 11/1048, H03M 13/1128, G06F 11/1064, G11C 29/26, G11C 29/42, G11C2029/2602, H03M 13/015, H03M 13/1575Filed as Sandisk Technologies, Inc.2025-06-10Eran Sharon | pending |
| OVONIC THRESHOLD SWITCH DEVICES WITH ASYMMETRIC ELECTRODES AND METHODS FOR FORMING THE SAMEFiled as SANDISK TECHNOLOGIES, INC.2025-06-09LEI WAN | pending |
| TRANSISTORS INCLUDING OFFSET SPACERS AND METHODS OF MAKING THE SAMEH10D 84/83138, H10D 62/60, H10D 84/013, H10D 64/661, H10D 62/102, H10D 84/8314, H10D 84/83135, H10D 84/0142, H10D 64/675, H10D 84/8312, H10D 84/014, H10D 64/514Filed as Sandisk Technologies, Inc.,2025-05-30Kazutaka YOSHIZAWA | pending |
| DATA STORAGE DEVICE WITH DUAL MEMORY SPACES ACCESSIBLE CONCURRENTLY BY A HOST USING DIFFERENT COMMUNICATION PROTOCOLSG06F 13/4068, G06F 13/4282, G06F 13/387, G06F 13/409Filed as Sandisk Technologies, Inc.2025-05-30Nihilesh K B | pending |
| Submission Queue Release Based on Command IdentifiersG06F 9/5016, G06F 9/4498, G06F 9/5022, G06F 9/546, G06F 11/0772, G06F 11/3027, G06F 13/1668, G06F 13/4221Filed as Sandisk Technologies, Inc.2025-05-13Amir SEGEV | pending |
| DATA STORAGE DEVICES WITH DUAL MEMORY SPACESG06F 12/0246, G06F 13/1694, G06F 13/4022, G06F 13/4282, G06F2212/7206, G06F2213/0042Filed as Sandisk Technologies, Inc.2025-05-12Ankur Agrawal | pending |
| DIE LEVEL FAILURE RECOVERYFiled as SANDISK TECHNOLOGIES, INC.2025-04-30XUAN TIAN | pending |
Filings are matched to the company by applicant name, so a subsidiary filing under its own name is only here if that name resolves to this company. The applicant is printed as filed, which makes a wrong match visible. A patent is not a product: most applications are never granted, and most grants are never built.
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