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Disco Corp Patents
What Disco Corp has filed at the patent office — applications as well as grants, because a filing is on the record eighteen months before anyone has to say what it was for.
DSCSY on carbonthat →Filings on file
61
Granted
0
Still pending
61
Filed under
2 names
61 filings
Newest filing first. A pending application has no patent number yet, and most never get one.
| Invention | Patent |
|---|---|
| METHOD FOR PROVIDING A WORKPIECE SUPPORT UNIT FOR SUPPORTING A WORKPIECEH10P 72/74, B23Q 1/03, H10P 72/7416, H10P 72/0442, H10P 72/18, H10P 72/7448, H10P 72/70, H10P 72/745Filed as DISCO CORPORATION2026-05-11Karl Heinz PRIEWASSER | pending |
| SUBSTRATE PRODUCTION METHOD AND CHIP PRODUCTION METHODH10P 90/123, B23K 26/53, H10P 74/203, H10P 58/00, B28D 5/0011Filed as DISCO CORPORATION2026-04-03Nobuki Kakiuchi | pending |
| BASE FILM AGENT AND PROCESSING METHOD FOR WORKPIECEH10P 50/692, B23K 26/364, B23K2101/40, H10P 14/683, H10P 50/695, H10P 58/00, H10P 70/30, H10P 50/242Filed as DISCO CORPORATION2026-04-02Yu ZHAO | pending |
| PROTECTIVE FILM FORMING METHOD AND CHIP MANUFACTURING METHODH10W 72/01215, H10P 58/00Filed as DISCO CORPORATION2026-03-03Akihiro Hirata | pending |
| WAFER PROCESSING METHOD AND DEVICE CHIP MANUFACTURING METHODH10P 90/128, H10P 58/00, H10P 10/128Filed as DISCO CORPORATION2026-03-03Kokichi MINATO | pending |
| STOCK ROLL FOR PROTECTIVE FILM TRANSFER, PROTECTIVE FILM ARRANGING METHOD, AND CHIP MANUFACTURING METHODH10P 54/92, C08J 7/0427, H10P 54/94, H10P 54/20, H10P 54/40, H10P 58/00, C08J 5/18, C08J2329/04Filed as DISCO CORPORATION2026-03-02Tomohiro Kaneko | pending |
| WAFER PROCESSING METHODH10P 58/22, H10P 70/30Filed as DISCO CORPORATION2026-02-27Makiko Ohmae | pending |
| PROCESSING METHOD FOR PLATE-SHAPED OBJECT, MANUFACTURING METHOD FOR CHIP, FORMING APPARATUS FOR PROTECTIVE MEMBER, AND PROCESSING APPARATUS FOR PLATE-SHAPED OBJECTH10P 90/00, H10P 74/203, H10P 72/0428, H10P 58/00Filed as DISCO CORPORATION2026-02-27Takaya OUCHI | pending |
| CHIP MANUFACTURING METHOD, CHIP DISTANCE INCREASING METHOD, AND PROCESSING APPARATUSH10P 54/00, H10P 58/00, H10P 72/7416, H10P 72/7422, H10P 72/742, H10P 72/7402, H10P 72/7442Filed as DISCO CORPORATION2026-02-20Chisato YAMADA | pending |
| GRINDING WHEEL, METHOD FOR GRINDING WORKPIECE, AND METHOD FOR MANUFACTURING CHIPB24B 27/0675, H10P 58/00Filed as DISCO CORPORATION2026-02-19Koji Shiono | pending |
| PROTECTIVE FILM AGENT, PROTECTIVE FILM FORMING METHOD, AND CHIP MANUFACTURING METHODC09D 5/32, C09D 7/48, C09D 7/63, H10F 71/136, H10P 58/00, C09D 101/284, C09D 129/04, C09D 139/06Filed as DISCO CORPORATION2026-02-19Senichi Ryo | pending |
| SHAPE MEASUREMENT SYSTEM, PROCESSING APPARATUS, SHAPE MEASUREMENT METHOD, PROCESSING METHOD, AND CHIP MANUFACTURING METHODG01B 9/0209, G01B 11/2441Filed as DISCO CORPORATION2026-02-17Shuichiro TSUKIJI | pending |
| PROCESSING APPARATUS AND CHIP MANUFACTURING METHODB24B 7/228, C25D 7/123, H10P 72/0428, H10P 72/3314, H10P 72/0462, H10P 72/3402, B24B 41/06, B24B 41/068Filed as DISCO CORPORATION2026-02-13Takahiro NAKAGAWA | pending |
| SYSTEM AND METHOD FOR TENANT SPECIFIC DATA MODELING FOR FIELD VERSIONING AND DOMAIN INTERCONNECTIONG06F 16/211, H04L 67/63, G06F 16/907, G06F 16/93, G06F 16/256, G06F 8/65, H04L 67/10Filed as CS Disco, Inc.2026-02-10Brian M. Carr | pending |
| METHOD FOR MANUFACTURING A WAFER AND METHOD FOR MANUFACTURING A BONDED WAFERH10P 52/00, H10P 54/30, H10P 54/00, H10P 90/128, H10P 10/12Filed as DISCO CORPORATION2026-01-26Kazuya Hirata | pending |
| POLISHING APPARATUS AND METHOD FOR POLISHING A WORKPIECEB24B 7/04, B24B 7/228, B24B 37/042, B24B 37/005, B24B 37/10, B24B 37/105, B24B 37/107, B24B 37/30, B24B 41/06, B24B 51/00Filed as DISCO CORPORATION2026-01-21Ryosuke NAKAJI | pending |
| METHOD FOR PROCESSING A BONDED WAFER AND PROCESSING APPARATUSH10P 56/00, H10P 90/1914, H10P 34/42, H10W 10/181Filed as DISCO CORPORATION2026-01-21Hiroshi MORIKAZU | pending |
| METHOD FOR PROCESSING WORKPIECE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICEH10P 54/92, H10P 70/30, H10P 52/00, H10P 54/00, H10P 70/20, H10P 95/00, H10P 54/40, H10P 50/00Filed as DISCO CORPORATION2026-01-20Yosuke Aoyagi | pending |
| WAFER PRODUCTION METHODB23K 26/53, B23K2101/40Filed as DISCO CORPORATION2026-01-14Ryosuke SAKURAI | pending |
| PROCESSING APPARATUS, CHIP MANUFACTURING METHOD, AND PROCESSING METHODH10P 72/0442, H10P 72/7618, H10P 54/00, H10P 72/78, H10P 72/0428, H10P 72/0408, H10P 54/20Filed as DISCO CORPORATION2026-01-09Naoko Yamamoto | pending |
| PICKUP METHOD, TEST METHOD, PICKUP DEVICE, AND TEST APPARATUSG01N 3/02, G01N 3/08, H10P 72/0442, B25J 11/0095Filed as DISCO CORPORATION2026-01-09Yuya Matsuoka | pending |
| SUBSTRATE PROCESSING METHOD, PROCESSED SUBSTRATE MANUFACTURING METHOD, AND CHIP MANUFACTURING METHODB23K 26/53, H10P 72/0428, B23K2103/56, H10P 52/00, H10P 54/00, H10P 90/00, H10P 58/20, H10P 10/12Filed as DISCO CORPORATION2026-01-06Yoshinobu SAITO | pending |
| CALCULATING METHOD, DETECTING APPARATUS, AND CHIP MANUFACTURING METHODB23K 26/364, G01B 11/0608, G01B 11/24, G01S 17/42Filed as DISCO CORPORATION2025-12-23Yutaro NOMURA | pending |
| CHIP PRODUCTION METHOD AND CUTTING DEVICEH10P 54/52, H10P 52/00, H10P 54/00, H10P 72/7402, H10P 58/20Filed as DISCO CORPORATION2025-12-23Suguru HIRAIWA | pending |
| PROCESSING METHOD FOR PROCESSING WORKPIECE BY PROCESSING TOOLG05B 19/41875, G05B2219/32368Filed as DISCO CORPORATION2025-12-18Wenhua LIANG | pending |
| WAFER MANUFACTURING APPARATUSH10P 72/0428, H10P 72/0472, B24B 7/228, B24B 19/22, B23K 26/037, B23K 26/0622, B23K 26/53, B23K 26/702, B23K2101/36, B23K2103/56, B23K2101/40, H04N 23/57, H10P 72/0456, H10P 72/3202, H10P 72/7442, H10P 72/3222, B23K 26/0006, B23K 26/032, B23K 26/0823, B23K 26/083, B23K 26/16, B23K 26/36, B23K 37/04, B24B 7/005, B24B 7/04, B24B 27/0069, B24B 41/005, B24B 41/04, B24B 41/06, B24B 47/12, B24B 47/22, B24B 49/12, B28D 5/04, G01N 21/9501Filed as DISCO CORPORATION2025-12-17Ryohei Yamamoto | pending |
| WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHODH10P 52/00, H10P 54/20, H10P 72/78, H10P 72/0428Filed as DISCO CORPORATION2025-12-09Akira MIZUTANI | pending |
| SUBSTRATE MANUFACTURING METHOD AND LASER PROCESSING METHODB23K 26/53, B23K2101/40Filed as DISCO CORPORATION2025-12-08Ryosuke SAKURAI | pending |
| METHOD OF MANUFACTURING CHIP AND DIVIDING DEVICEH10P 54/00, H10P 72/7402, H10P 52/00, H10P 72/7416Filed as DISCO CORPORATION2025-12-03Fumiya SATO | pending |
| PROCESSING APPARATUS AND METHOD FOR MANUFACTURING A WAFERB24B 7/228, B24B 49/16, B24B 7/04, B24B 37/005, B24B 37/345Filed as DISCO CORPORATION2025-12-01Wenhua Liang | pending |
| PROCESSING METHOD, PROCESSING DEVICE, AND SUBSTRATE MANUFACTURING METHODB24B 37/005, H10P 52/00, H10P 74/203, H10P 74/207, H10P 95/02, H10P 90/123, H10P 90/129, B24B 7/228, B24B 37/042, B24B 49/12Filed as DISCO CORPORATION2025-11-26Nobuki Kakiuchi | pending |
| LASER PROCESSING APPARATUS AND LASER PROCESSING METHODB23K 26/0604, B23K 26/042, B23K2101/40, B23K 26/0648Filed as DISCO CORPORATION2025-11-21Yasushi TANNO | pending |
| WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHODH10P 34/42, H10P 72/0428, H10P 52/00, H10P 72/78, H10P 72/0402Filed as DISCO CORPORATION2025-11-13Akira MIZUTANI | pending |
| METHOD FOR PROCESSING A WORKPIECEH10P 52/00, H10P 34/42, H10P 90/00Filed as DISCO CORPORATION2025-11-11Akira MIZUTANI | pending |
| METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARDH05K 3/0044, H05K 3/0052, H05K 1/0306, H05K2201/0909, H05K2201/09154, H05K2203/0207, H05K2203/0228Filed as DISCO CORPORATION2025-11-11Ken IKIGAKI | pending |
| METHOD FOR PROCESSING A BONDED WAFERH10P 72/7402, H10P 52/00, H10P 54/00, H10P 72/744, H10P 90/00, H10P 95/11, H10W 72/0198, H10W 80/211, H10W 46/00, H10P 72/7412Filed as DISCO CORPORATION2025-11-11Hayato Tanaka | pending |
| WAFER-PROCESSING SHEET AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICEH10P 72/74, H10P 52/00, H10P 72/7416, H10P 72/7422, H10P 54/00, H10P 70/237, H10P 90/124, H10P 72/7402, H10P 90/123, H10P 72/7442, H10P 72/7412Filed as DISCO CORPORATION2025-11-11Masamitsu Kimura | pending |
| METHOD FOR PROCESSING A WAFER AND METHOD FOR DIVIDING A WAFERB23K 26/364, H10P 54/00, B23K2101/40, H10P 52/00, H10P 72/7416, H10P 72/7402, B23K 26/40Filed as DISCO CORPORATION2025-11-07Junichi KUKI | pending |
| SUBSTRATE MANUFACTURING METHOD AND SUBSTRATEH10P 90/128, H10P 52/00, H10P 90/129Filed as DISCO CORPORATION2025-11-06Maho HIRAKAWA | pending |
| PROCESSING METHOD, PROCESSING DEVICE, AND WAFER MANUFACTURING METHODB23K 26/53, H10P 72/0428, B23K2101/40, H10P 72/53, B24B 7/228Filed as DISCO CORPORATION2025-11-03Maho HIRAKAWA | pending |
| WAFER PROCESSING METHODB23K 26/53, H10P 90/128, B23K2101/40, H10P 52/00, H10P 72/0428, H10P 90/00, H10P 90/124, H10P 95/11, H10P 90/1914Filed as DISCO CORPORATION2025-11-03Akira MIZUTANI | pending |
| POLISHING APPARATUS AND METHOD OF POLISHING WORKPIECEB24B 7/07Filed as DISCO CORPORATION2025-10-31Hiroki ABE | pending |
| SHEET FIXING METHODH10P 72/7402, H10P 72/7416, H10P 54/00Filed as DISCO CORPORATION2025-10-30Yoshinobu Saito | pending |
| SUBSTRATE MANUFACTURING METHODB23K 26/53, B23K2101/40, B23K 26/0853Filed as DISCO CORPORATION2025-10-29Haruna YANO | pending |
| LASER PROCESSING METHOD AND MANUFACTURING METHOD FOR CHIPSB23K 26/0821, B23K 26/60, B23K 26/082, B23K 26/359, B23K 26/364, B23K 26/382, B23K 26/702, B23K2101/40, H10P 54/00, B23K 26/032, B23K 26/0853Filed as DISCO CORPORATION2025-10-28Yuki IKEDA | pending |
| TRANSFER DEVICE, TRANSFER METHOD, AND PROCESSING METHODH10P 72/3411, B65G 47/90, H10P 72/0604, H10P 72/7602, H10P 72/0608Filed as DISCO CORPORATION2025-10-24Yusuke FUJII | pending |
| SEMICONDUCTOR PROCESSING GRINDSTONE, SEMICONDUCTOR PROCESSING TOOL, PROCESSING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR PARTSH10P 52/00, B24B 7/228, H10P 90/129Filed as DISCO CORPORATION2025-10-24Mitsuhiro Nomura | pending |
| LAMINATED SHEET, METHOD FOR MANUFACTURING LAMINATED SHEET, METHOD FOR PROCESSING WORKPIECE, AND METHOD FOR MANUFACTURING DEVICE CHIPH10P 72/7402, B32B 7/022, H10P 52/00, H10P 54/00, H10P 72/0442, H10P 58/22, H10P 54/20, H10P 54/40, H10P 58/20, B32B 9/04, B32B 27/08, B32B2250/02, B32B2307/54, B32B2457/14Filed as DISCO CORPORATION2025-10-21Norihisa ARIFUKU | pending |
| METHOD FOR FORMING A STACKED WAFERB23K 26/53, H10P 90/00, B23K2101/40, H10P 52/00, H10P 72/0428Filed as DISCO CORPORATION2025-10-16Hiroshi Morikazu | pending |
| METHOD OF MANUFACTURING WAFER AND WAFER MANUFACTURING SYSTEMB23K 26/53, B23K 26/083, B23K2101/40, B23K 26/0006, B23K 26/0869Filed as DISCO CORPORATION2025-10-15Nobuki KAKIUCHI | pending |
| LASER PROCESSING APPARATUS AND LASER PROCESSING METHODB23K 26/361, B23K 26/0665, B23K 26/53, B23K2103/56, H10P 90/128, H10P 90/14, B23K 26/03, B23K 26/032, B23K 26/0823, B23K 26/083, B23K 26/0853, B23K 26/402, G01N 23/2055Filed as DISCO CORPORATION2025-10-10Haruna YANO | pending |
| METHOD OF PROCESSING WAFER AND METHOD OF MANUFACTURING PROCESSED WAFERH10P 52/00, B24B 9/065, H10P 90/128Filed as DISCO CORPORATION2025-10-08Koichi MAKINO | pending |
| SHEET AFFIXING APPARATUSH10P 72/78, H10P 54/00, B23K 37/04Filed as DISCO CORPORATION2025-10-06Kazuma Sekiya | pending |
| PROCESSING METHOD OF CHUCK TABLE, MANUFACTURING METHOD OF PROCESSED CHUCK TABLE, PROCESSING METHOD OF WORKPIECE, MANUFACTURING METHOD OF PROCESSED WAFER, AND PROCESSING APPARATUSH10P 72/70, B24B 41/06, H10P 52/00, H10P 72/78, B24B 7/04, B24B 7/228, B24B 37/107Filed as DISCO CORPORATION2025-10-06Hiroki ABE | pending |
| WAFER PROCESSING METHOD AND GRINDING APPARATUSB24B 7/228, B24B 41/068, H10P 52/00, H10P 54/00, H10P 72/0428, H10P 54/30Filed as DISCO CORPORATION2025-10-03Akira MIZUTANI | pending |
| CHUCK TABLE AND METHOD FOR GRINDING WAFERB24B 37/042, B24B 37/30, B24B 7/228, B24B 41/068Filed as DISCO CORPORATION2025-10-02Daishi KONNO | pending |
| CHIP PRODUCTION METHODH10P 54/00, H10P 72/7402, H10P 72/7416, H10P 72/7422, H10P 34/42, H10P 72/742, H10W 46/503, H10W 46/00Filed as DISCO CORPORATION2025-09-26Kazuki HASHIMOTO | pending |
| WAFER PROCESSING METHODH10P 90/123, B23K 26/53, H10P 52/00, H10P 72/0428, H10P 90/128Filed as DISCO CORPORATION2025-09-17Akira Mizutani | pending |
| METHOD AND APPARATUS FOR CLEANING WAFERH10P 72/0412, H10P 52/00, H10P 90/128, H10P 72/7618, H10P 72/0414Filed as DISCO CORPORATION2025-09-16Atsushi KOMATSU | pending |
| CUTTING METHOD FOR WORKPIECEH10P 52/00, H10P 54/40, H10P 74/203, H10P 72/0428, H10P 58/00, B28D 5/022Filed as DISCO CORPORATION2025-09-11Kokichi MINATO | pending |
| GRINDING METHOD AND GROUND WAFER MANUFACTURING METHODH10P 90/123, B24B 5/14, B24B 5/24, B24B 7/04, B24B 7/228Filed as DISCO CORPORATION2025-09-05Yoshikazu Suzuki | pending |
Filings are matched to the company by applicant name, so a subsidiary filing under its own name is only here if that name resolves to this company. The applicant is printed as filed, which makes a wrong match visible. A patent is not a product: most applications are never granted, and most grants are never built.