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Taiwan Semiconductor Manufacturing Co Ltd Patents
What Taiwan Semiconductor Manufacturing Co Ltd has filed at the patent office — applications as well as grants, because a filing is on the record eighteen months before anyone has to say what it was for.
TSM on carbonthat →Filings on file
150
Granted
0
Still pending
150
Filed under
10 names
150 filings
Newest filing first. A pending application has no patent number yet, and most never get one.
| Invention | Patent |
|---|---|
| GAP-FILL AND BOND FILM INTERFACE OPENING IN OPTICAL APPLICATIONSH10W 70/65, G02B 6/132, G02B 6/34, H10W 74/019, H10W 74/137, H10W 74/43, H10W 90/00, H10W 70/635, H10W 74/141, H10W 90/20, H10W 20/42, H10W 90/792, H10W 20/435, H10W 74/01, H10W 74/147, G02B 6/1245, G02B 6/136, G02B 6/30, G02B 6/32, G02B 6/4214Filed as Taiwan Semiconductor Manufacturing Co., Ltd.2026-06-23Chia-Chun Kao | pending |
| EMBEDDED LENS STRUCTURES AND THE METHODS OF FORMING THE SAMEG02B 3/0012, G02B 3/0037Filed as Taiwan Semiconductor Manufacturing co., Ltd.2026-06-23Zi-Jheng Liu | pending |
| CAPACITOR INTEGRATED PASSIVE DEVICE WITH COMMON GROUNDED THROUGH-SUBSTRATE-VIA AND SUBSTRATE BACKSIDE CONDUCTOR AND METHODS OF FORMING THE SAMEH10W 70/635, H10D 1/665, H10W 20/43, H10W 90/701, H10W 70/685, H10W 70/095, H10W 72/00, H10W 20/427, H10W 20/023, H10W 70/698, H10W 20/435, H10W 20/496Filed as Taiwan Semiconductor Manufacturing Company Limited2026-06-23Shin-Puu Jeng | pending |
| SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAMEH10D 64/519, H10D 84/834, H10D 84/038, H10D 30/6211, H10D 84/0151, H10D 30/62, H10D 62/121, H10D 30/019, H10D 84/0135, H10D 30/501, H10D 84/0158, H10D 30/024, H10D 62/151, H10D 84/832, H10D 64/251, H10D 62/115, H10D 84/0137, H10D 84/0149, H10W 20/44, H10W 10/011, H10W 10/10, H10W 20/427, B82Y 10/00Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-06-23Huan-Chieh SU | pending |
| DISLOCATIONS IN GAA TRANSISTORS AND THE METHODS OF FORMING THE SAMEH10D 64/017, H10D 30/6735, B82Y 10/00, H10D 62/405, H10D 30/014, H10D 62/116, H10D 30/6757, H10D 84/013, H10D 62/121, H10D 64/018, H10D 62/151, H10D 62/822, H10D 84/832, H10D 30/797, H10D 30/0195, H10D 30/43, H10D 84/0128, H10D 62/119, H10D 84/038, H10D 84/83125, H10D 84/0133, H10D 84/83, H10D 30/507, B82Y 30/00, B82Y 40/00Filed as Taiwan Semiconductor Manufacturing Co., Ltd.2026-06-22Hui-Lin Huang | pending |
| SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOFH10P 50/244, H10W 72/0198, H10P 54/00, H10W 72/07331, H10P 50/287, H10W 72/073, H10W 72/01204, H10W 72/01353, H10W 72/952, H10W 90/731, H10W 72/29, H10W 70/68, H10W 70/698, H10W 72/252Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-22Lung-Kai Mao | pending |
| ELECTROSTATIC DISCHARGE PROTECTIONH10D 89/811, H02H 9/046Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-22Chia-Hui Chen | pending |
| SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAMEH10W 20/47, H10W 20/42, H10W 20/033, H10W 20/077, H10W 20/081, H10W 20/074, H10W 20/056, H10W 20/075Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-06-22Liang-Hsuan PENG | pending |
| FLOATING DATA LINE CIRCUIT AND METHODG11C 7/1009, G11C 7/12, G11C 16/10, G11C 16/24, H10B 41/35, H10B 41/20, G11C 7/1078, G11C 11/005, G11C 16/0483, G11C 16/30Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-06-22Manish ARORA | pending |
| SEMICONDUCTOR DEVICES WITH BONDING LAYERSH10D 62/121, H10P 14/6336, H10D 30/014, H10D 84/0126, H10D 30/6757, H10D 30/019, H10D 64/017, H10D 88/00, H10D 30/501, H10D 84/0144, H10D 84/832, H10D 30/6735, H10D 30/43, H10D 88/01, H10D 84/038, H10P 14/6532, B82Y 10/00Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-06-22Wan Chen HSIEH | pending |
| SYSTEM AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICESH10D 84/0172, H10D 30/0243, H10P 72/0402, H10D 64/017, H10D 84/0158, H10D 30/024, H10D 62/822, H10D 30/797, H10D 84/038, H10D 84/0193, H10P 72/0434, H10P 72/04, H10P 72/0432Filed as Taiwan Semiconductor Manufacturing Co., Ltd.2026-06-22Chia-Ao Chang | pending |
| IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAMEH10F 39/811, H10F 39/8057, H10F 39/807, H10F 39/199, H10F 39/024Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-06-22Feng-Chien Hsieh | pending |
| SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATIONH10P 72/722, H10P 72/0612, H10P 72/72Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-22Chung-Pin CHOU | pending |
| DELAY CHAIN AND METHOD OF OPERATING SAMEH03K 5/134, H03K 5/131, H03M 1/66, H03K 5/133, H03K 5/135, H03K 5/14, H03K2005/00045Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-06-22Shenggao LI | pending |
| HIGH VOLTAGE DEVICE STRUCTURE AND METHODS OF FORMING THE SAMEH10D 30/65, H10D 62/126, H10D 62/116, H10D 62/10, H10D 30/0281, H10D 64/111, H10D 64/112, H10D 64/516, H10D 30/603Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-06-22Chien-Ming KU | pending |
| LEVEL SHIFTER CIRCUIT AND METHOD OF OPERATING THE SAMEH03K 3/356182, H03K 19/018521, H03K 19/018557, H03K 3/037Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-06-22Yu-Lun OU | pending |
| SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAMEH10D 64/017, H10D 84/038, H10D 30/014, H10D 64/691, H10D 84/85, H10D 30/6739, H10D 62/121, H10D 30/019, H10D 84/0181, H10D 30/501, H10D 84/0167, H10D 84/0144, H10D 64/518, H10D 62/822, H10D 30/797, H10D 30/6735, H10D 30/43, H10D 30/0415, H10D 84/851, H10D 64/0134, B82Y 10/00Filed as Taiwan Semiconductor Manufacturing Co., Ltd.2026-06-22Mao-Lin Huang | pending |
| REDUCING CAPACITIVE LOADING OF MEMORY SYSTEM BASED ON SWITCHESG11C 5/025, G11C 7/12, H10D 88/00, G11C 5/063, G11C 5/14, G11C 7/18, G11C 7/22, G11C 8/10, G11C 8/12Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-22Meng-Sheng Chang | pending |
| CPODE LANDING STRUCTURE ON INSULATOR SUBSTRATE AND THE METHODS OF FORMING THE SAMEH10D 84/83, H10P 14/60, H10D 30/0191, H10D 30/014, H10D 84/0151, H10D 30/6757, H10D 62/121, H10D 64/017, H10D 30/501, H10D 62/822, H10D 84/832, H10D 30/6735, H10D 30/0195, H10D 30/43, H10D 84/038, H10D 84/0153, H10D 30/507, H10W 10/17, H10W 10/0145, B82Y 10/00Filed as Taiwan Semiconductor Manufacturing Co., Ltd.2026-06-22Ming-Heng Tsai | pending |
| VOLTAGE REGULATORS WITH SHARED DECOUPLING CAPACITOR FOR MEMORY DEVICESG05F 1/59, G11C 13/0038, G11C 11/1697Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-22Zheng-Jun Lin | pending |
| SEMICONDUCTOR STRUCTURE HAVING LOW-RESISTANCE VIA CONTACTH10W 20/498, H10W 20/42, H10D 1/474, H10W 20/425, H10W 20/081, H10W 20/075Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-20Sheng-Kai Huang | pending |
| SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAMEH10D 84/85, H10D 62/121, H10D 30/014, H10D 84/83138, H10D 64/017, H10D 84/0167, H10D 84/8311, H10D 30/0193, H10D 62/151, H10D 64/518, H10D 84/832, H10D 30/6735, H10D 30/0195, H10D 84/017, H10D 62/292, H10D 30/43, H10D 84/0142, H10D 84/0128, H10D 84/038, H10D 84/83, H10D 84/8312, H10D 30/502, H10D 84/851Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-20Ta-Chun LIN | pending |
| FIELD EFFECT TRANSISTOR HAVING SEGMENTED CHANNEL REGIONH10D 30/6211, H10D 62/824, H10D 30/014, H10D 30/6757, H10D 30/62, H10D 62/121, H10D 30/019, H10D 84/853, H10D 30/501, H10D 84/0167, H10D 30/024, H10D 62/151, H10D 62/822, H10D 30/6735, H10D 84/017, H10D 30/43, H10D 84/038, H10D 84/0193, H10D 62/307, B82Y 10/00Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-20Wen-Yi Lin | pending |
| THREE DIMENSIONAL HETEROGENEOUS INTEGRATION WITH DOUBLE-SIDED SEMICONDUCTOR DIES AND METHODS OF FORMING THE SAMEH10W 90/00, H10W 99/00, H10B 80/00, H10W 72/90, H10W 80/312, H10W 90/20, H10W 90/297, H10W 20/42, H10W 80/327, H10W 90/792Filed as Taiwan Semiconductor Manufacturing Company Limited2026-06-20Hiroki Noguchi | pending |
| NOVEL PCM DEVICEH10N 70/231, H10N 70/883, H10N 70/8828, H10N 70/8613, H10N 70/253, H10N 70/841, H10N 70/823, H10N 70/023Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-20Chang-Chih Huang | pending |
| SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOFH10D 62/116, H10D 89/10, H10D 84/0186, H10D 84/85, H10D 84/0151, H10D 62/121, H10D 64/017, H10D 84/931, H10D 84/907, H10D 84/966, H10D 30/0195, H10D 84/017, H10D 84/038, H10D 84/0188, H10D 84/0153, H10D 84/0149, H10D 30/507, H10D 84/851Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-20Jhon Jhy LIAW | pending |
| SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOFH10D 62/121, H10D 84/0149, H10D 30/014, H10D 84/0186, H10D 30/506, H10D 84/85, H10D 30/6757, H10D 30/0194, H10D 64/017, H10D 84/0167, H10D 62/151, H10D 30/6735, H10D 84/017, H10D 30/43, H10D 84/038, H10D 84/0188, H10D 84/851, H10W 20/0245, H10W 20/481, H10W 20/069, H10W 20/20, H10W 20/0698, H10W 20/2134, H10W 20/427, H10W 20/023Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-20Jhon Jhy LIAW | pending |
| SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAMEH10D 84/907, H10D 84/953Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-20Jhon-Jhy LIAW | pending |
| DOPING FREE CONNECTION STRUCTURES AND METHODSH10W 10/0143, H10W 20/074, H10F 39/807, H10F 39/80, H10F 39/8033, H10F 30/223, H10F 71/121, H10F 30/225, H10F 39/811, H10W 10/17, H10P 14/6349, H10W 20/069, H10W 20/098, H10P 14/34Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-19Shih-Min Huang | pending |
| INTEGRATED CIRCUIT STRUCTURE AND METHOD OF FORMING THE SAMEH10D 89/10, H10D 84/82, G06F 30/392, H10D 84/0186, H10D 84/85, H10D 84/90, H10D 84/907, H10D 84/0156, H10D 84/991, H10D 84/0191, H10D 84/038Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-06-19Kam-Tou SIO | pending |
| SEMICONDUCTOR PACKAGE AND METHODH10W 90/00, H10P 72/74, H10W 74/019, H10W 74/43, H10W 90/701, H10W 70/685, H10P 72/743, H10W 70/65, H10W 80/312, H10W 90/794, H10W 90/297, H10W 90/401, H10W 70/614, H10W 74/47, H10P 72/7424, H10W 74/111, H10W 80/327, H10W 74/016, H10W 74/117, H10W 70/611Filed as Taiwan Semiconductor Manufacturing Co., Ltd.2026-06-19Hsien-Wei Chen | pending |
| FIN END ISOLATION STRUCTURE FOR SEMICONDUCTOR DEVICESH10B 10/12, H10D 84/0158, H10D 84/834, H10D 30/6211, H10D 62/116, H10D 84/0151, H10D 30/019, H10D 30/501, H10D 84/0167, H10D 89/10, H10D 30/024, H10D 84/832, H10D 84/038, H10D 84/0188, H10D 84/0193, H10D 84/851Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-19Jhon Jhy LIAW | pending |
| FINFET DEVICE STRUCTURE WITH EXTRA FINH10D 30/6211, H10D 84/0151, H10D 84/853, H10D 84/0158, H10D 84/834, H10D 30/024, H10D 30/6219, H10D 84/0128, H10D 84/0193Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-06-19Yi Hong WANG | pending |
| METAL STRUCTURES WITH SEAMSH10W 20/077, H10W 20/056, H10W 20/425, H10W 20/4441, H10W 20/47, H10W 20/033, H10W 20/063, H10W 20/42Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-19Hao Yang | pending |
| RAISED SOURCE/DRAIN OXIDE SEMICONDUCTING THIN FILM TRANSISTOR AND METHODS OF MAKING THE SAMEH10D 30/6713, H10D 30/6755, H10B 61/22, H10B 63/30, H10D 99/00, H10D 30/6757, H10D 62/151, H10D 62/82, H10P 14/3434, H10P 14/24, H10P 14/3426Filed as Taiwan Semiconductor Manufacturing Company Limited2026-06-19Gerben Doornbos | pending |
| MULTI-CHANNEL FERROELECTRIC MEMORY STRUCTUREH10B 51/20, H10B 51/30, H10B 53/30, H10B 51/10, H10D 30/6757, H10D 62/118, H10D 30/6713, H10D 30/6735, H10D 30/0415, H10D 30/031, H10D 30/701Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-19Yen-Chieh Huang | pending |
| INTEGRATED CIRCUIT WITH BACK-SIDE METAL LINEH10B 20/25, G11C 5/025, G06F 30/392, H10D 89/10, G11C 5/10Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-06-19Chien-Ying CHEN | pending |
| METHOD OF CLEANING A NOZZLEB05B 15/50, H10P 72/1926, H10P 72/1924, B05B 15/52, B08B 1/12, H10P 72/0604, H10P 72/0402, H10P 72/0412, B08B 5/04, B08B 9/035Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-06-19Guan Jung CHEN | pending |
| INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAMEH10D 84/0165, H03K 3/0372, G06F 30/39, H10D 84/038, H03K 3/356121, H03K 3/3562, H03K 3/35625Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-06-19Yueh CHIANG | pending |
| SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAMEH10D 84/834, H10D 62/106, H10D 84/853, H10D 84/0158, H10D 84/8311, H10D 84/038, H10D 84/8312, H10D 62/393, H10D 84/0193, H10D 30/6212, H10P 50/691Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-19Jhon-Jhy LIAW | pending |
| DUAL TRACKING FOR FLY BIT LINE STATIC RANDOM ACCESS MEMORY (SRAM) ARCHITECTUREG11C 8/12, G11C 11/417, G11C 7/18, G11C 8/14, G11C 11/412, G11C 11/419, H03K 19/20Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-19Atul Katoch | pending |
| EXTENDED VIA CONNECT FOR PIXEL ARRAYH10F 39/809, H10W 20/496, H10F 39/011, H10F 39/811Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-19Meng-Hsien Lin | pending |
| DEVICE CRACK-STOP STRUCTURE TO PREVENT DAMAGE DUE TO DICING CRACKH10F 39/80, H10W 42/00, H10F 39/807, H10F 39/199, H10F 39/026, H10F 39/18, H10F 39/809, H10F 39/024, H10F 39/811, H10F 39/014Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-19Tung-Ting Wu | pending |
| REPLACEMENT SIDEWALL SPACERSH10D 64/017, H10D 64/021, H10D 30/6211, H10D 64/01, H10D 62/121, H10D 30/6734, H10D 64/018, H10D 30/019, H10D 62/118, H10D 30/501, H10D 30/024, H10D 64/518, H10D 62/822, H10D 30/797, H10D 30/6735, H10D 30/031, H10D 64/015, B82Y 10/00Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-19Chang-Ta Chen | pending |
| DEVICE HAVING DIFFERENT FIRST METALLIZATION LAYER AND FIRST BURIED METALLIZATION LAYER ARCHITECTURES AND METHOD OF MANUFACTURING SAMEH10W 20/427, H10D 30/014, H10D 84/0186, H10D 84/85, H10D 30/6757, H10D 62/121, H10D 30/019, H10D 88/00, H10D 30/501, H10D 84/0167, H10D 64/251, H10D 30/6735, H10D 30/43, H10D 84/038, H10D 84/851, B82Y 10/00Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-06-19Chun-Yen LIN | pending |
| INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAMEH03K 3/356139, H03K 3/35625, H03K 17/6871, G06F 30/39, H10D 84/0126, H10D 89/10, H10D 84/038, H10D 84/856, H03K 19/20Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-06-19Yueh CHIANG | pending |
| INTEGRATED PHOTODETECTOR WITH EMBEDDED SEMICONDUCTOR REGIONG02F 1/025, G02B 6/12002, G02B 6/12004, G02B 6/124, G02B 6/132, G02B2006/12083, G02B2006/12097, G02B2006/12142Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-19Tai-Chun Huang | pending |
| FORMING ISOLATION REGIONS WITH LOW PARASITIC CAPACITANCE AND REDUCED DAMAGEH10D 30/6735, H10D 84/038, H10D 30/014, H10D 84/0151, H10D 30/6757, H10D 64/017, H10D 84/0135, H10D 62/118, H10D 62/151, H10D 62/822, H10D 84/832, H10D 30/797, H10D 30/43, H10D 84/83, H10D 62/115, H10D 84/0153, B82Y 10/00Filed as Taiwan Semiconductor Manufacturing Co., Ltd.2026-06-19Tzu-Ging Lin | pending |
| SOI DEVICE STRUCTURE FOR ROBUST ISOLATIONH10D 84/85, H10D 62/115, H10P 90/1916, H10D 30/0323, H10D 86/201, H10D 30/6744, H10D 84/038, H10D 84/0188, H10D 62/393, H10D 30/6704, H10W 42/60, H10P 90/00, H10W 44/20, H10W 10/181, H10P 30/209Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-19Lin-Chen Lu | pending |
| DIE EDGE STRUCTURE FOR MOLDING COMPOUND FILLING AND THE METHODS OF FORMING THE SAMEH10P 54/00, H10W 20/089, H10W 74/114, H10W 72/00, H10W 74/014, H10W 74/01, H10W 74/129Filed as Taiwan Semiconductor Manufacturing Co., Ltd.2026-06-19Min-Hsuan Hsu | pending |
| VOLTAGE REFERENCE CIRCUITG05F 1/567, G05F 3/262, G05F 1/468Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-02Bei-Shing LIEN | pending |
| SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAMEH10D 30/6211, H10D 64/017, H10D 64/01, H10D 84/0158, H10D 30/024, H10D 62/822, H10D 30/6219, H10D 84/038, H10W 20/40, H10W 20/063, H10W 20/42, H10W 20/056Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-06-02Yu-Lien HUANG | pending |
| INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAMEH10W 90/00, H10W 40/255, H10W 70/02, H10W 90/701, H10W 70/099, H10W 74/15, H10W 74/121, H10W 40/70, H10W 70/095, H10W 70/635, H10W 74/012, H10W 90/401, H10W 40/258, H10W 76/12, H10W 40/22, H10W 74/016, H10W 74/117, H10W 76/60, H10W 70/611Filed as Taiwan Semiconductor Manufacturing Co., Ltd.2026-06-02Ping-Yin Hsieh | pending |
| CELL BOUNDARY REGION WITH BURIED POWER GRID SEGMENT, SEMICONDUCTOR DEVICE INCLUDING SAME, AND METHOD OF MANUFACTURING SAMEH10W 20/40, H10W 20/427, H10D 84/944, H10D 89/10, H10W 20/01, H10W 20/42Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-06-02Ming-Cheng SYU | pending |
| CLOCK SIGNAL DISTRIBUTION SYSTEM, INTEGRATED CIRCUIT DEVICE AND METHODG06F 1/10, H03K 5/15, G06F 30/396Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-06-02Jerry Chang Jui KAO | pending |
| SEMICONDUCTOR DEVICE WITH REDUCED LEAKAGEH10D 64/258, H10D 64/01, H10D 30/611, H10D 62/371, H10D 89/10, H10D 30/023, H10D 64/512Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-06-02Motoki TAMURA | pending |
| PASSIVE SEMICONDUCTOR DEVICEH10D 1/696, H10W 44/601, H10D 1/716, H10D 1/042, H10D 1/68, H10D 1/043, H10W 90/00, H10W 70/095, H10W 70/65, H10W 90/401, H10W 74/117, H10W 70/611, H01G 4/012, H01G 4/33, H01G 4/385Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-01Fu-Chiang KUO | pending |
| LOW TEMPERATURE ERROR THERMAL SENSORG01K 7/01, G01K 7/18, G01K 17/00, G01K 7/00, G01K 15/00, G01K 15/002, G01K 15/005Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-01Jaw-Juinn HORNG | pending |
| OPTICAL FINGERPRINT SENSOR WITH ENHANCED ANTI-COUNTERFEITING FEATURESG06V 40/1318, H10F 39/8057, G06V 40/1365, G06V 40/1353, G06V 40/1324, H10F 39/8063, H10F 39/8053, H10F 39/198Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-01Feng-Chien Hsieh | pending |
| METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTUREH10D 84/0158, H10D 84/038, H10D 30/014, H10D 64/256, H10D 62/116, H10D 84/0151, H10D 84/013, H10D 62/121, H10D 64/017, H10D 64/021, H10D 30/797, H10D 30/43Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-06-01Chia-Yun CHENG | pending |
| DEVICE STRUCTURE WITH FERROELECTRIC LAYERH10D 30/6755, H10P 14/69392, H10D 64/691, H10D 64/033, H10D 30/674, H10P 14/6544Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-05-29Oreste MADIA | pending |
| SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAMEH10D 84/85, H10D 30/025, H10D 64/667, H10D 84/0195, H10D 62/121, H10D 30/63, H10D 64/018, H10D 64/017, H10D 84/0181, H10D 84/017, H10D 30/0415, H10D 84/038, H10D 84/83, H10D 30/701, H10D 84/0188, H10D 84/0177, H10D 64/689Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-29Chun-Fu LU | pending |
| SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAMEH10D 87/00, H10D 84/0188, H10D 62/116, H10D 30/6757, H10D 30/019, H10D 64/017, H10D 30/501, H10D 62/822, H10D 30/797, H10D 30/6735, H10D 84/017, H10D 84/038, H10D 84/8312, H10D 86/01, H10D 84/851, B82Y 10/00Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-29Jhon-Jhy LIAW | pending |
| LITHOGRAPHY SYSTEM WITH NON-INVASIVE MONITORING AND METHODSG03F 7/70033, G03F 7/7015, G03F 7/2004, G03F 7/70025Filed as Taiwan Semiconductor Manufacturing Co., Ltd.2026-05-29Chi YANG | pending |
| METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTUREH10D 64/017, H10P 14/6682, H10D 84/013, H10D 62/121, H10D 30/019, H10D 30/501, H10D 84/0158, H10D 62/822, H10D 30/797, H10D 84/0128, H10D 84/038, H10P 14/3211, H10P 14/3252, H10P 14/3411, B82Y 10/00Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-05-29Shahaji B. MORE | pending |
| PACKAGE STRUCTUREH10W 74/10, H10W 74/134, H10P 72/74, H10W 74/019, H10W 70/685, H10W 74/15, H10W 72/851, H10W 74/121, H10W 90/00, H10W 70/65, H10W 72/00, H10W 74/00, H10W 90/401, H10W 70/68, H10P 72/7424, H10W 74/111, H10W 70/60, H10W 74/01, H10W 42/121, H10W 70/611Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-29Po-Chen LAI | pending |
| TRANSISTOR CONTACTS AND METHODS OF FORMING THE SAMEH10D 62/121, H10W 20/069, H10D 30/014, H10D 84/85, H10D 84/0151, H10D 30/6757, H10D 30/019, H10D 64/017, H10D 30/501, H10D 84/0167, H10D 84/0184, H10D 84/0158, H10D 30/6735, H10D 84/017, H10D 30/43, H10D 84/038, H10D 30/6729, H10D 84/0149, H10D 84/851, H10D 64/015, H10W 20/072, H10W 70/65, H10W 20/46, H10W 70/611Filed as Taiwan Semiconductor Manufacturing Co., Ltd.2026-05-29Hung-Yu Yen | pending |
| INTERCONNECT STRUCTURE HAVING HEAT DISSIPATION CAPABILITY AND METHOD FOR MANUFACTURING THE SAMEH10W 20/42, H10W 20/056, H10W 20/097, H10W 20/075Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-05-29Cheng-Chin LEE | pending |
| SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOFH10W 20/496, H10D 1/042, H10D 1/714, H10W 20/42Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-28Kai-I Cheng | pending |
| FAULT DIAGNOSTICSG06F 30/333, G01R 31/2839, G11C 29/10, G06F 30/392, G06F 30/33, G06F 30/39, G01R 31/2851, G01R 31/318342, G11C 29/025, G11C 29/36, G11C2029/3602Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-28Sandeep Kumar Goel | pending |
| MEMORY CELL WITH OFFSET INTERCONNECT VIAH10B 51/30, H10D 1/682, H10B 53/30, H10B 51/10, H10D 1/692, H10W 20/42, H10W 20/435Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-28Fu-Chen Chang | pending |
| HIGH DENSITY CAPACITOR IMPLEMENTED USING FINFETH10D 1/692, H10D 84/834, H10D 84/0151, H10D 30/62, H10D 84/0135, H10D 84/853, H10D 84/811, H10D 84/0158, H10D 84/038, H10D 84/0133, H10D 84/813, H10D 62/115, H10D 84/014, H10D 84/0193, H10D 84/0149, H10W 20/43, H10W 10/014, H10W 10/17, H10W 20/069, H10W 20/42, H10P 95/062Filed as Taiwan Semiconductor Manufacturing Co., Ltd.2026-05-28Jiefeng Lin | pending |
| METAL-INSULATOR-SILICIDE CAPACITORSH10D 1/692, H10W 20/496, H10D 84/212, H10D 84/813, H10W 20/435Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-27Kaochao Chen | pending |
| PELLICLE AND METHOD OF MANUFACTURING THEREOFG03F 1/62, G03F 1/64Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-26Pei-Cheng HSU | pending |
| SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAMEH10W 70/685, G02B 6/125, H10W 72/942, H10W 90/701, H10W 72/241, H10W 72/072, H10W 90/00, H10W 70/65, H10W 20/20, H10W 72/90, H10W 72/20, H10W 99/00, H10W 74/00, H10W 90/297, H10P 72/74, H10W 72/9413, H10W 90/722, H10W 74/117, G02B 6/136, G02B 6/4204, G02B2006/12061, G02B2006/12107, G02B2006/12147Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-26Feng-Wei KUO | pending |
| INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOFH10D 84/0191, H10D 62/378, H10B 10/12, H10D 84/0186, H10D 62/371, H10D 84/853, H10D 84/0167, H10D 62/292, H10D 84/038, H10D 84/0193, H10D 84/859, H10W 20/021, H10W 20/427Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-26Jhon-Jhy LIAW | pending |
| METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICEH10D 84/0186, H10D 84/017, H10D 30/6211, H10D 64/017, H10D 84/853, H10D 30/024, H10D 62/151, H10D 62/822, H10D 30/797, H10D 30/6219, H10D 84/038, H10D 84/8312, H10D 84/0193Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-26Te-Chih HSIUNG | pending |
| LIGHT SENSOR FOR PACKAGE INTRUSION DETECTIONH10W 42/405, H10D 86/40, H10D 88/00, H10D 84/811, H10D 89/10, H10D 84/813Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-26Katherine H. Chiang | pending |
| TRANSISTOR DEVICE WITH MULTI-LAYER CHANNEL STRUCTUREH10D 30/6757, H10D 62/121, H10D 30/6739, H10D 99/00, H10D 62/875, H10D 30/6734, H10D 30/6755, H10D 62/80, H10D 30/504, H10D 30/701, H10D 30/502Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-26Ya-Yun Cheng | pending |
| HIGH-K ISOLATION OF FIN STRUCTURESH10P 14/69392, H10D 30/014, H10D 84/0151, H10D 30/6757, H10D 30/62, H10D 62/121, H10D 30/019, H10D 30/501, H10D 30/024, H10D 84/832, H10D 30/6735, H10D 30/43, H10P 95/064, H10P 14/69215, B82Y 10/00Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-26Kang Huang | pending |
| STRUCTURE AND FABRICATION OF PCM-BASED CAPACITOR BANKH10N 79/00, H10D 1/692, H10N 70/826, H10N 70/061, H10N 70/231, H10N 70/8828, H10N 70/8413, H10N 70/8613, H10B 63/30, H10B 63/80, H10N 70/063, H03H 11/04Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-26Kuo-Pin Chang | pending |
| SENSING CIRCUIT OF MEMORY DEVICE AND CONTROL METHOD OF SENSING CIRCUITG11C 7/1069, G11C 7/065, G11C 7/08, G11C 7/12Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-26Atul Katoch | pending |
| MULTILAYER ALD COATING FOR CRITICAL COMPONENTS IN PROCESS CHAMBERC23C 16/405, C23C 16/45529, C23C 16/45531, C23C 16/45553, H01J 37/32495Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-25Ren-Guan Duan | pending |
| DIRECT NON-OHMIC SWITCH FOR VOLTAGE INSTABILITY PROTECTION AND METHODS FOR FORMING THE SAMEH10N 79/00, H10N 70/826, H10B 63/24, H10N 70/231, H10N 70/8828, H10B 63/20, H10N 70/20, H10B 63/80Filed as Taiwan Semiconductor Manufacturing Company Limited2026-05-25Wei Ting Hsieh | pending |
| DEVICE STRUCTURE AND METHOD FOR MANUFACTURING THE SAMEH10D 84/0151, H10D 89/10, H10D 30/014, H10D 84/83138, H10D 30/019, H10D 64/017, H10D 30/501, H10D 84/8311, H10D 30/6735, H10D 30/43, H10D 84/0142, H10D 84/0128, H10D 84/038, H10D 84/83, H10D 30/031, H10D 84/0153, H10W 20/43, B82Y 10/00Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-05-22Jhon Jhy LIAW | pending |
| SILICIDE LAYER OF SEMICONDUCTOR DEVICEH10D 84/013, H10D 62/121, H10D 30/6757, H10D 64/017, H10D 30/501, H10D 62/151, H10D 62/822, H10D 30/797, H10D 64/251, H10D 84/0128, H10D 30/0212, H10D 84/038, H10D 30/6729Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-05-22Ta-Chun LIN | pending |
| ETCHING-DAMAGE-FREE INTERMETAL DIELECTRIC LAYER WITH THERMAL DISSIPATION FEATUREH10W 40/253, H10W 40/228, H10W 20/47, H10W 70/02, H10W 20/077, H10P 14/69433, H10W 20/48, H10W 20/42, H10W 20/056Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-05-22Kai-Fang CHENG | pending |
| EDGE FILL FOR STACKED STRUCTUREH10W 70/611, H10W 70/685, H10W 80/312, H10W 90/794, H10W 72/0198, H10W 80/327Filed as Taiwan Semiconductor Manufacturing Co., Ltd.2026-05-22Su-Chun Yang | pending |
| CONDUIT CHECK APPARATUSH10P 72/0604, H10P 72/722, H10P 72/0602, H10P 72/0402, H10P 72/72, H10P 72/0616, G02F 1/132Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-22Shih Yang CHIU | pending |
| Semiconductor Device and Method of ManufacturingH10D 62/121, H10D 30/6713, H10D 84/0193, H10D 64/256, H10D 62/116, H10D 30/6757, H10D 30/019, H10D 64/017, H10D 62/021, H10D 84/853, H10D 30/501, H10D 62/151, H10D 30/6735, H10D 84/017, H10D 64/62, H10D 84/038, H10D 30/6729, H10D 30/031, H10P 14/3462, H10P 50/642, H10P 14/3411, H10D 64/0112, B82Y 10/00Filed as Taiwan Semiconductor Manufacturing Co., Ltd.2026-05-22Shyh-Shin Ferng | pending |
| SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAMEH10D 30/6735, H10D 84/038, H10D 84/0151, H10D 30/6757, H10D 62/121, H10D 30/019, H10D 64/017, H10D 62/118, H10D 30/501, H10D 62/822, H10D 30/797, H10D 84/83, B82Y 10/00Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-05-22Tzu-Ging LIN | pending |
| SYSTEM FOR THERMAL TESTING A WAFER CHUCK AND METHODS FOR PERFORMING THE SAMEG01K 13/00, G01R 31/2875Filed as Taiwan Semiconductor Manufacturing Company Limited2026-05-22Chia Wei Wang | pending |
| SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAMEH10D 62/121, H10D 84/013, H10D 30/019, H10D 30/501, H10D 84/834, H10D 30/6735, H10D 84/0128, H10D 84/038Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-22Kuo-Chiang TSAI | pending |
| Vertically Stacked Semiconductor Device Including a Hybrid Bond Contact Junction Circuit and Methods for Forming the SameH10W 90/00, H10W 74/141, H10W 20/40, H10W 80/102, H10W 42/00, H10W 70/654, H10W 72/922, H10W 72/944, H10W 80/00, H10W 90/26, H10W 70/65, H10W 72/834, H10W 72/951, H10W 80/312, H10W 72/0198, H10W 90/22, H10W 90/297, H10W 72/941, H10W 80/743, H10W 70/05, H10W 80/327, H10W 90/792, H10W 70/652, H10W 72/01, H10W 90/24Filed as Taiwan Semiconductor Manufacturing Company Limited2026-05-22Jen-Yuan Chang | pending |
| TREATMENT OF ELECTRODES OF MIM CAPACITORSH10D 1/692, H10D 1/68, H10W 20/42, H10D 1/696, H10W 20/096, H10W 20/069, H10W 20/075, H10W 20/496, H01G 4/008Filed as Taiwan semiconductor Manufacturing Co., Ltd.2026-05-22Shin-Hung Tsai | pending |
| COMPUTE-IN-MEMORY LUT-BASED MULTIPLY-ADD APPARATUSG06F 7/5443, G06F 15/7821, G06N 3/063, G06N 3/08Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-22Chia-Fu LEE | pending |
| SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTUREH10D 84/834, H10W 20/069, H10D 30/6211, H10D 30/62, H10D 64/017, H10D 84/0158, H10D 30/024, H10D 30/797, H10D 30/6219, H10D 84/038, H10W 20/077, H10W 20/0698, H10W 20/056Filed as Taiwan Semiconductor Manufacturing Co., Ltd.2026-05-22Chan Syun David Yang | pending |
| IMAGE SENSOR DEVICES AND METHODS OF FORMATIONH10F 39/18, H10F 39/8037, H10F 39/807, H10F 39/199, H10F 39/811, H10F 39/014Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-22Feng-Chien HSIEH | pending |
| TRENCH CAPACITOR STRUCTURE AND METHODS OF MANUFACTURINGH10D 1/042, H10D 1/716, H10D 1/665, H10P 50/242Filed as Taiwan Semiconductor Manufacturing company, Ltd.2026-05-22Yu JIANG | pending |
| MULTI-PORT SRAM STRUCTURE WITH GATE-ALL-AROUND TRANSISTORSH10B 10/12, G11C 11/419, H10D 30/014, H10D 84/85, H10D 30/6757, H10D 62/121, H10D 64/017, H10D 30/501, H10D 84/0167, H10D 84/8314, H10D 84/83135, H10D 84/8311, H10D 30/6735, H10D 30/43, H10D 84/038, H10D 84/851, G11C 11/412Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-22Ping-Wei Wang | pending |
| METHODS OF REDUCING CAPACITANCE IN FIELD-EFFECT TRANSISTORSH10D 30/62, H10D 84/0158, H10D 64/681, H10D 30/6211, H10D 84/0151, H10D 64/01, H10D 84/0147, H10D 84/834, H10D 84/038, H10P 14/6334, H10W 10/014, H10W 10/17, H10W 10/20, H10W 10/021, H10P 95/062Filed as Taiwan Semiconductor Manufacturing Co., Ltd.2026-05-22Chun-Han Chen | pending |
| SEMICONDUCTOR PHOTONICS DEVICE AND METHODS OF FORMATIONG02B 6/30, G02B 6/4214, G02B 6/34, G02B2006/12142Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-21Po-Chun LIU | pending |
| HEAT DISSIPATION FOR SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTUREH10D 62/121, H10D 84/0149, H10W 20/43, H10W 40/22, H10D 84/0186, H10D 64/01, H10D 64/017, H10D 62/118, H10D 84/853, H10D 30/501, H10D 62/151, H10D 62/822, H10D 30/797, H10D 64/251, H10D 30/6735, H10D 84/0128, H10D 84/038, H10D 30/6729, H10D 84/0193, H10D 64/517, H10D 30/0198, H10P 72/7416, H10P 72/7422, H10W 40/47, H10P 72/744, H10W 20/481, H10W 20/031, H10W 20/069, H10W 70/635, H10W 40/10, H10W 40/40, H10W 90/401, H10P 72/74, H10W 40/228, H10W 20/0696, H10W 20/427, H10W 40/226, H10W 40/255, B82Y 10/00Filed as Taiwan Semiconductor Manufacturing Co., Ltd.2026-05-20Chen-Fong Tsai | pending |
| CIRCUIT SCREENING SYSTEM AND CIRCUIT SCREENING METHODG01R 31/31721, G01R 31/31725, G01R 31/31727, G01R 31/2879, G01R 31/3004, G01R 31/31712, G01R 31/3183Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.2026-05-20CHI-CHE WU | pending |
| SEMICONDUCTOR DEVICEH10W 20/40, H10W 20/20, H10D 30/6757, H10D 62/121, H10D 30/501, H10D 30/6735, H10D 30/43, H10W 20/42, H10W 20/435Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-20Yi-Ren CHEN | pending |
| MULTIPLE GATE PATTERNING METHODS TOWARDS FUTURE NANOSHEET SCALINGH10D 64/017, H10D 30/6735, H10D 64/667, H10D 30/014, H10D 30/6757, H10D 62/121, H10D 30/019, H10D 30/501, H10D 84/83135, H10D 62/822, H10D 30/797, H10D 64/669, H10D 30/43, H10D 84/038, H10D 84/0177, H10D 84/851, H10D 64/01318, B82Y 10/00Filed as Taiwan Semiconductor Manufacturing Co., Ltd.2026-05-20Lung-Kun CHU | pending |
| Device and Method for Synchronizing A Data Input Signal and A Clock Input SignalH03K 5/14, H03L 7/00, H03K2005/00058, H03K2005/00084, H03K2005/00286Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-20Yu-Jie HUANG | pending |
| SEMICONDUCTOR DEVICE INCLUDING MULTI-DIMENSION THROUGH SILICON VIA STRUCTURES FOR BACKSIDE ALIGNMENT AND THERMAL DISSIPATIONH10W 90/00, H10W 20/20, H10D 88/00, H10W 20/0245, H10W 42/00, H10W 46/301, H10W 80/00, H10W 90/297, H10W 20/212, H10W 20/023, H10W 46/00, H10W 90/288, H10W 90/792, H10W 80/168Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-20Ke-Gang WEN | pending |
| SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAMEH10W 70/417, H10W 46/301, H10W 90/00, H10W 70/05, H10W 46/00Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-19Yung-Chi Lin | pending |
| SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOFH10W 90/701, H10W 90/00, H10B 80/00, H10W 72/942, H10W 74/019, H10W 90/291, H10W 70/685, H10P 72/743, H10P 72/744, H10W 90/10, H10W 72/923, H10W 72/944, H10W 72/952, H10W 72/90, H10W 80/312, H10W 72/20, H10W 90/794, H10W 99/00, H10W 74/014, H10W 90/22, H10W 90/297, H10W 90/401, H10W 90/724, H10W 70/614, H10P 72/74, H10P 72/7432, H10W 72/941, H10W 80/743, H10W 70/6528, H10P 72/7424, H10W 72/9415, H10W 80/327, H10W 70/09, H10W 70/60, H10P 72/7412, H10W 72/934, H10W 72/252, H10W 70/611Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-19Chuei-Tang WANG | pending |
| SLURRY DISPERSION SYSTEM WITH REAL TIME CONTROLB24B 57/04, Y02P 70/10, B24B 37/005, B24B 37/042Filed as TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.2026-05-19I-Chen CHIANG | pending |
| REINFORCEMENT STRUCTURES FOR CHIP-INTERPOSER AND INTERPOSER-SUBSTRATE BONDING AND METHODS OF MAKING THE SAMEH10W 42/121, H10W 70/611, H10W 90/701, H10W 74/15, H10W 76/40, H10W 72/073, H10W 72/851, H10W 72/072, H10W 72/07236, H10W 72/20, H10W 99/00, H10W 90/401, H10W 90/724, H10W 72/30, H10W 90/734, H10W 74/117Filed as Taiwan Semiconductor Manufacturing Company Limited2026-05-19Yu Chen Lee | pending |
| DIGITAL LOW-DROPOUT VOLTAGE REGULATORG05F 1/56, H10D 84/0165, H10D 84/85, H10D 84/038, H10D 64/23, H10W 20/42Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-19Po-Yu LAI | pending |
| SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION THEREOFH10D 64/017, H10D 62/151, H10D 30/014, H10D 30/6757, H10D 62/121, H10D 30/019, H10D 30/501, H10D 62/834, H10D 62/822, H10D 30/797, H10D 30/6735, H10D 64/62, H10D 30/43, H10D 62/832, H10D 30/031, H10D 64/0112Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-05-19Cheng-Wei CHANG | pending |
| INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE VIAH10D 64/017, H10D 30/6735, H10D 64/256, H10D 30/6757, H10D 64/258, H10D 64/01, H10D 62/121, H10D 62/364, H10D 30/019, H10D 30/501, H10D 62/151, H10D 62/822, H10D 84/832, H10D 30/797, H10D 62/82, H10D 84/038, H10D 84/0149, H10D 30/0198, H10P 50/691, H10W 20/481, H10P 14/3211, H10W 20/069, H10P 14/24, H10P 14/27, H10W 20/0696, H10W 20/427, H10P 14/3411, B82Y 10/00Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-05-19Che-Lun CHANG | pending |
| DUMMY PATTERN STRUCTURE FOR REDUCING DISHINGH10W 20/425, H10W 72/019, H10W 80/732, H10W 20/0245, H10W 20/2125, H10W 72/944, H10W 90/00, H10W 72/834, H10W 72/90, H10W 80/312, H10W 20/2134, H10W 90/297, H10W 20/42, H10W 80/743, H10W 72/9415, H10W 80/327, H10W 20/023, H10W 90/722, H10W 20/056, H10W 20/062, H10W 90/792, H10W 72/921, H10P 52/403, H10W 72/934, H10W 80/701Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-18Jen-Yuan Chang | pending |
| JIG FOR PLASMA PROCESSING APPARATUS AND SYSTEM FOR OPERATING PLASMA PROCESSING APPARATUSC23C 14/34, H01J 37/32862, B08B 7/0071, C23C 14/022, C23C 14/3435, C23C 16/4405, C23C 16/45536, H01J 37/32082, H01J 37/32798Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-18Ming Che CHEN | pending |
| SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAMEH10N 70/826, B65H 54/585, H10B 63/24, H10N 70/231, H10N 70/8828, H10B 63/20, H10B 63/84, H10N 70/20, H10N 70/011, H10W 20/435Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-18Hengyuan Lee | pending |
| STACKED MULTI-GATE DEVICE WITH LOW CONTACT VIA RESISTANCE AND METHODS FOR FORMING THE SAMEH10D 84/0186, H10D 87/00, H10D 30/0191, H10D 64/256, H10D 30/6757, H10D 64/017, H10D 88/00, H10D 30/501, H10D 30/6735, H10D 84/017, H10D 88/01, H10D 84/038, H10D 84/0188, H10D 86/01, H10D 84/851, B82Y 10/00Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-05-18Yuting CHENG | pending |
| SEMICONDUCTOR DEVICE STRUCTURE WITH GATE STACKH10D 64/01326, H10W 10/021, H10D 30/014, H10D 84/0151, H10D 30/6757, H10D 62/121, H10D 64/017, H10D 84/0135, H10D 30/501, H10D 62/822, H10D 84/832, H10D 30/797, H10D 64/251, H10D 30/6735, H10D 30/43, H10D 84/0128, H10D 84/038, H10D 84/83, H10D 30/031, H10D 62/115, H10D 84/0153, H10D 84/0149, H10D 30/0198, H10W 10/20, H10P 14/3462, B82Y 10/00Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-18Huan-Chieh SU | pending |
| SEMICONDUCTOR DEVICEH10B 10/12Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-18Dian-Sheng YU | pending |
| METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION LINEH10W 72/90, H10W 20/0698, H10W 74/147, H10W 20/40, H10W 20/43, H10W 20/47, H10W 74/137, H10W 20/063, H10W 72/232, H10P 50/71, H10W 72/932, H10W 72/952, H10P 14/69433, H10W 72/01938, H10W 70/65, H10W 72/9445, H10W 72/20, H10W 72/242, H10W 20/0633, H10W 72/29, H10P 14/683, H10W 70/05, H10W 70/68, H10W 20/49, H10W 72/019, H10W 70/60, H10P 14/6342, H10W 20/435, H10W 72/01935, H10W 42/121, H10W 72/252Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-05-18Anhao CHENG | pending |
| INSERTING INHIBITION LAYER FOR INDUCING ANTIFERROELECTRICITY TO FERROELECTRIC STRUCTUREH10D 1/684, H10D 64/689, H10B 53/30, H10B 51/30, H10D 99/00, H10D 1/68, H10D 64/033, H10D 30/0415, H10D 30/701, H10P 14/69397, H10P 14/69391, H10P 14/6339Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-18Po-Ting Lin | pending |
| FERROELECTRIC MEMORY DEVICE AND METHOD OF FORMING THE SAMEH10B 51/20, H10B 51/10, H10B 51/30, H10D 30/0415, H10D 99/00, H10D 30/6757, H10D 64/033, H10D 30/6755, H10D 30/701, G11C 11/221, G11C 11/223, G11C 11/2275Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-18Chun-Chieh Lu | pending |
| SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOFH10D 64/01, H10D 30/43, H10D 30/014, H10D 62/121, H10D 64/018, H10D 30/508, H10D 64/017, H10D 64/021, H10D 30/6735, H10D 30/0195, H10D 30/6729Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-18Tsung-Han Tsai | pending |
| METHOD FOR FORMING SEMICONDUCTOR STRUCTUREH10D 62/121, H10D 30/6713, H10D 30/014, H10D 84/0151, H10D 30/6757, H10D 62/364, H10D 64/017, H10D 62/822, H10D 30/797, H10D 64/251, H10D 30/6735, H10D 30/0195, H10D 64/62, H10D 30/43, H10D 84/038, H10D 30/6729, H10D 30/031, H10D 64/679, H10D 84/0149, H10D 30/507, H10D 64/01326, H10P 14/3462, B82Y 10/00Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-18Li-Zhen YU | pending |
| INPUT BUFFER CIRCUITG05F 1/56, H03K 3/0377, H03K 19/018521, G06F 30/32, H03K 3/13, H03K 3/3565Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-05-18Yu-Kai TSAI | pending |
| SHELF STATUS DETERMINATIONH10P 72/3404, G06T 7/74, H10P 72/53, G06T2207/30148Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-18Guancyun LI | pending |
| SEMICONDUCTOR STRUCTURE WITH DIELECTRIC WALL STRUCTURE AND METHOD FOR MANUFACTURING THE SAMEH10D 62/121, H10D 64/017, H10D 30/0191, H10D 30/014, H10D 30/506, H10D 84/85, H10D 84/0151, H10D 30/6757, H10D 84/0167, H10D 84/8311, H10D 84/832, H10D 30/6735, H10D 30/43, H10D 84/0128, H10D 84/038, H10D 84/0188, H10D 84/833Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-18Yu-Lung TUNG | pending |
| SHARED POWER FOOTER CIRCUITG11C 5/147, G11C 11/417, G11C 11/418, G11C 5/148, G11C 11/412, G11C 11/413, G11C 11/419, H03K 17/6871Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-18Hidehiro Fujiwara | pending |
| METHOD OF STORING PHOTORESIST COATED SUBSTRATES AND SEMICONDUCTOR SUBSTRATE CONTAINER ARRANGEMENTG03F 7/38, F24F 3/163, F24F 3/167, H10W 40/00, G03F 7/0042, G03F 7/11, G03F 7/162, G11B 33/1453, G11B 33/1486Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-18Chun-Wei LIAO | pending |
| METHOD OF CLEANING, SUPPORT, AND CLEANING APPARATUSB08B 9/0321, B08B 13/00, B08B2209/032Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-18Yi Chen HO | pending |
| SPACE OPTIMIZATION BETWEEN SRAM CELLS AND STANDARD CELLSG06F 30/392, G06F 30/398, H10B 10/12, H10B 10/18, H10D 84/834, H10D 89/10Filed as Taiwan Semiconductor Manufacturing Co., Ltd.2026-05-15Feng-Ming Chang | pending |
| SEMICONDUCTOR DEVICE INCLUDING MOLDED DIE STACK AND METHODS OF FORMING THE SAMEH10W 90/00, H10W 20/023, H10W 72/942, H10W 74/019, H10W 20/0245, H10W 74/121, H10W 80/00, H10W 20/20, H10W 72/90, H10W 20/0249, H10W 99/00, H10W 74/014, H10W 90/297, H10W 80/327, H10W 90/792, H10W 74/016, H10W 74/117, H10W 20/0253Filed as Taiwan Semiconductor Manufacturing Company Limited2026-05-15Tsung-Fu TSAI | pending |
| VACANCY-RICH SILICON FOR USE WITH A GALLIUM NITRIDE EPITAXIAL LAYERH10P 14/2905, C30B 29/06, H10P 14/36, H10P 74/203, H10P 90/00, H10P 14/3458, H10P 14/3416, C30B 15/203, C30B 15/206, C30B 33/02Filed as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.2026-05-15Pu-Fang CHEN | pending |
| SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOFH10B 12/05, H10B 12/36, H10B 12/482, H10B 12/056, H10B 12/488, H10B 12/03, H10D 30/014, H10D 30/6757, H10D 62/121, H10D 64/017, H10D 30/501, H10D 62/151, H10D 62/822, H10D 30/797, H10D 30/6735, H10D 30/43, H10D 30/0198, B82Y 10/00Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-15Jhon Jhy LIAW | pending |
| ALL-TUNGSTEN SCHEME FOR SOURCE/DRAIN CONTACT, SOURCE/DRAIN VIA, AND GATE VIAH10W 20/0698, H10W 20/062, H10W 20/425, H10W 20/033, H10W 20/057, H10W 20/20, H10W 20/045, H10D 64/0112Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-15Chen-Hung Tsai | pending |
| SEMICONDUCTOR DEVICESH10D 64/667, H10D 64/017, H10D 30/6211, H10D 64/691, H10D 84/853, H10D 84/83135, H10D 30/024, H10D 62/822, H10D 30/797, H10D 64/669, H10D 62/119, H10D 84/038, H10D 84/0177, H10D 84/0193, H10D 64/01318, H10P 14/418Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-15Hsin-Yi Lee | pending |
| PATTERNING MATERIAL INCLUDING CARBON-CONTAINING LAYER AND METHOD FOR SEMICONDUCTOR DEVICE FABRICATIONH10P 76/405, H10W 20/089, H10P 76/2041, H10P 14/6334, H10W 20/033, H10P 50/73, H10P 14/6902, H10P 76/4085, H10W 20/081, H10P 76/4088, H10P 14/416, H10P 14/6329, H10W 20/056, H10P 76/4083Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-15Szu-Ping TUNG | pending |
| MEMORY DEVICE AND SEMICONDUCTOR DIEH10N 52/80, H10N 50/10, H10B 61/00, H10B 61/22, H10N 52/00, H10N 50/01Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-15Shy-Jay Lin | pending |
| Package with Improved Heat Dissipation Efficiency and Method for Forming the SameH10W 40/228, H10W 40/22, H10B 80/00, H10W 72/877, H10W 40/25, H10W 74/15, H10W 72/851, H10W 90/00, H10W 70/095, H10W 70/635, H10W 90/724, H10W 72/347, H10P 72/74, H10W 40/258, H10W 72/07354, H10P 72/7424, H10W 72/352, H10W 70/698, H10W 74/01, H10W 74/117, H10W 90/736Filed as Taiwan Semiconductor Manufacturing Co., Ltd.2026-05-15Hung-Yi Kuo | pending |
| Systems and Methods for Improved Data Access SpeedG11C 8/06, G11C 11/418, G11C 11/419, G11C 7/06, G11C 7/065, G11C 7/08, G11C 8/08, G11C 11/413Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-14Sanjeev Kumar JAIN | pending |
| Systems and Methods for Duty Cycle MeasurementG01R 29/023, H03K 19/20, H03K 19/21, G01R 25/005, H03K 3/037, H03K 5/00, H03K 5/1565, H03K2005/00058Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-14Tsung-Hsien TSAI | pending |
| METHODS AND SYSTEMS FOR COOLING PLASMA TREATMENT COMPONENTSH01J 37/32449, H10P 50/242, H01J 37/3244, H01J 37/32522, H01J2237/334Filed as Taiwan Semiconductor Manufacturing Company, LTD.2026-05-13Cheng Kuang Tso | pending |
| MEMORY DEVICE HAVING FERROELECTRIC LAYERH10B 51/20, H10B 51/30, H10B 53/30, H10B 53/20Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-13Ya-Ling Lee | pending |
| MULTI-LAYER PELLICLE MEMBRANEG03F 1/62Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-12Pei-Cheng Hsu | pending |
| CAPACITOR STRUCTURE INCLUDING A BUFFER LAYER AND METHODS OF FORMATIONH10D 1/696, H10W 44/601, H10W 20/496, H10B 12/00, H10D 1/692, H10D 1/68Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-12Jun-Nan NIAN | pending |
| PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICEH10P 76/2041, G03F 7/0382, C08L 101/02, C09D 201/02, G03F 7/004, G03F 7/0042, G03F 7/0045, G03F 7/38, G03F 7/40Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-12Chien-Chih CHEN | pending |
| SEMICONDUCTOR STRUCTUREH10B 61/22, H10B 80/00, H10B 61/00, H10N 52/85, H10N 50/80, H10N 50/20, H10N 50/01, H10N 50/10Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-12Han-Jong Chia | pending |
| METHOD OF FORMING ELECTRO-OPTICAL DEVICEG02F 1/0113, G02F 1/0102, G02F 1/025, G02F2201/02, G02F2201/128, G02F2201/302Filed as Taiwan Semiconductor Manufacturing Company, Ltd.2026-05-12Shuen-Shin Liang | pending |
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