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SK Hynix Inc Patents

What SK Hynix Inc has filed at the patent office — applications as well as grants, because a filing is on the record eighteen months before anyone has to say what it was for.

SKHY on carbonthat →
Filings on file
78
Granted
0
Still pending
78
Filed under
3 names

78 filings

Newest filing first. A pending application has no patent number yet, and most never get one.

InventionPatent
HOST DEVICE FOR CONTROLLING READ-AHEAD OPERATION, METHOD OF OPERATING HOST DEVICE, AND COMPUTING SYSTEM INCLUDING HOST DEVICEG06F 3/0604, G06F 3/0659, G06F 3/061, G06F 3/0614, G06F 3/0658, G06F 3/0673, G06F 12/08, G06F2212/1016, G06F2212/1032Filed as SK hynix Inc.2026-06-22Chi Je PARKpending
STORAGE-SIDE PAGE TABLES FOR MEMORY SYSTEMSG06F 12/1009, G06F2212/1024, G06F2212/657, G06F2212/7201Filed as SK Hynix NAND Product Solutions Corp. (dba Solidigm)2026-06-22Samuel BRADSHAWpending
OPERATING METHOD OF MEMORY DEVICEG11C 16/10, G11C 16/102, G11C 16/3459, G11C 16/0483, G11C 16/26, G11C 16/3404, G11C 29/36Filed as SK hynix Inc.2026-06-18Jung Shik JANGpending
STORAGE DEVICE FOR MANAGING MAP INFORMATION PROVIDED TO HOST AND METHOD OF OPERATING THE SAMEG06F 3/0604, G06F 3/0634, G06F 3/0614, G06F 3/0658, G06F 3/0679, G06F 12/06, G06F2212/1016, G06F2212/1032Filed as SK hynix Inc.2026-06-18Jung Woo KIMpending
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAMEH10B 12/05, H10B 12/02, H10B 12/488, H10D 30/023, H10B 12/482, H10B 12/30, H10B 12/053, H10B 12/03, H10D 64/01, H10D 30/025Filed as SK hynix Inc.2026-06-18Seung Hwan KIMpending
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAMEH10B 53/20, H10B 43/27, H10D 30/693, H10B 43/40, H10D 30/0413, H10D 30/025Filed as SK hynix Inc.2026-06-17Ki Hong LEEpending
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICEH10B 41/10, H10B 41/27, H10B 43/27, H10B 43/50, H10B 63/00, H10B 41/50, H10B 43/10, H10W 20/435Filed as SK hynix Inc.2026-06-16Yun Cheol HANpending
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICEH10B 41/50, H10B 41/27, H10B 43/27, H10B 43/50, H10B 41/30, H10B 43/35, H10B 41/35, H10B 80/00, H10B 43/30, H10B 43/40, H10B 43/10, H10B 41/41, H10W 90/00, H10W 90/792Filed as SK hynix Inc.2026-06-16Seok Min CHOIpending
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING THE SEMICONDUCTOR DEVICEH10B 12/34, H10D 64/513, H10B 12/053, H10D 30/658, H10D 64/691, H10D 64/017, H10D 64/685, H10D 62/80, H10D 64/68, H10P 14/6922, H10P 14/6548, H10P 14/662, H10P 14/6921, H10P 14/692, H10P 14/6506, H10P 14/6518, H10P 14/6933Filed as SK hynix Inc.2026-06-15Young Gwang YOONpending
SEMICONDUCTOR DEVICE WITH LOW-K SPACERH10B 12/30, H10B 12/315, H10B 12/482, H10B 12/0335, H10B 12/485, H10B 12/34, H10B 12/02, H10D 62/115Filed as SK hynix Inc.2026-06-15Beom Ho MUNpending
SEMICONDUCTOR DEVICE AND MEMORY DEVICE INCLUDING SAMPLING CIRCUITG11C 11/406, G11C 11/4076, G11C 11/40611, G11C 11/408Filed as SK hynix Inc.2026-06-11Hyeon Woo NOHpending
SEMICONDUCTOR DEVICEH10B 63/20, H10B 63/80, H10W 20/435, H10N 70/826, H10B 63/24, H10N 70/231, H10B 61/10, H10B 63/22, H10N 70/20, H10B 63/845, H10N 70/821, G06F 3/0656, G06F 12/08, G06F 13/16Filed as SK hynix Inc.2026-06-11Soo Man SEOpending
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAMEH10B 41/27, H10B 43/27, H10B 63/34, H10B 43/50, H10B 41/30, H10B 41/50, H10B 41/10, H10B 43/35, H10B 41/35, H10B 43/30, H10B 43/10Filed as SK hynix Inc.2026-06-11In Ku KANGpending
MEMORY SYSTEM WITH AN ADJUSTABLE NUMBER OF ACTIVE DIES AND METHOD FOR OPERATING THE SAMEG06F 3/0625, G06F 3/064, G06F 3/0658, Y02D 10/00, G06F 3/0629, G06F 3/0631, G06F 3/0644, G06F 3/0656, G06F 3/0679, G06F 12/0607Filed as SK hynix Inc.2026-06-10Dong Kyu LEEpending
STORAGE DEVICE THAT BACKS UP DATA TO PAGE BUFFER IN LOW POWER MODE AND METHOD FOR OPERATING THE SAMEG06F 3/0614, G06F 11/1441, G06F 11/1451, Y02D 10/00, G06F 1/3203, G06F 3/0604, G06F 3/0625, G06F 3/0658, G06F 3/0659, G06F 11/1469, G06F2212/1016, G06F2212/1028, G06F2212/1032, G06F2212/7207Filed as SK hynix Inc.2026-06-10Gi Pyo UMpending
SYSTEMS, METHODS, AND MEDIA FOR IDENTIFYING SEQUENTIAL WORKLOADSG06F 3/0659, G06F 3/0679, G06F 3/0604, G06F 3/061Filed as SK hynix NAND Product Solutions Corp.2026-06-09David J. Pelsterpending
CAPACITOR COMPRISING ANTI-FERROELECTRIC LAYERS AND HIGH-K DIELECTRIC LAYERSH10D 1/684, H10D 1/68, H10B 51/20, H10B 53/30, H10B 12/34, H10D 1/692, H10D 64/691, H10D 64/685, H10D 30/60, H10D 64/689, H10P 14/6939, H10P 14/662, H01G 4/10, H01G 4/30Filed as SK hynix Inc.2026-06-05Se Hun KANGpending
ADDRESS COUNTER USING ASYNCHRONOUS INPUT AND OPERATING METHOD THEREOFG11C 7/1084, G11C 8/04, G11C 16/0483, G11C 16/08, G11C 7/1018, G11C 7/18Filed as SK hynix Inc.2026-06-05Su Han LEEpending
SSD MANAGED HOST WRITE ATOMICITY WITH ARBITRARY TRANSFER LENGTHG06F 3/0659, G06F 12/0246, G06F 3/0619, G06F 3/0656, G06F 3/0679, G06F 3/0685, G06F 12/1009, G06F 13/1673, G06F 13/28, G06F2212/657, G06F2212/7203Filed as SK hynix NAND Product Solutions Corp.2026-06-02Peng Lipending
SEMICONDUCTOR DEVICE INCLUDING A TRANSISTOR HAVING A METAL-RICH METAL OXIDE LAYERH10D 64/667, H10D 64/01, H10D 64/513, H10D 64/0134, H10D 30/6211, H10D 64/691, H10D 64/66, H10D 64/685, H10D 30/024, H10D 64/669, H10D 64/517, H10D 64/665, H10D 64/514, H10D 64/01318, H10D 64/01304Filed as SK hynix Inc.2026-06-01Young Gwang YOONpending
CONTROLLER FOR MANAGING BAD BLOCK, STORAGE DEVICE INCLUDING THE SAME, AND METHOD OF OPERATING THE STORAGE DEVICEG06F 3/0619, G11C 29/52, G11C 29/789, G06F 3/0604, G06F 3/064, G06F 3/0658, G06F 3/0659, G06F2212/1016, G06F2212/1032, G11C 29/76Filed as SK hynix Inc.2026-05-31Se Joong KIMpending
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICEH10B 43/50, H10D 30/694, H10W 90/00, H10B 43/20, H10B 41/50, H10B 41/10, H10B 43/35, H10B 43/30, H10B 43/40, H10B 43/10, H10B 41/27, H10B 43/27, H10B 41/41, H10D 64/01, H10D 64/517, H10D 64/512, H10W 72/07331, H10W 90/732, H10W 80/00, H10W 90/792Filed as SK hynix Inc.2026-05-29Nam Jae LEEpending
SEMICONDUCTOR DEVICE HAVING LOW-K SPACERS INCLUDE A CARBON-DOPED SILICON-BASED MATERIALH10B 12/482, H10B 12/30, H10B 12/315, H10B 12/0335, H10B 12/485, H10B 12/02Filed as SK hynix Inc.2026-05-21Hyo Won BAIKpending
SYSTEM AND OPERATING METHOD THEREOFH04B 1/12, H04L 25/03878, H04L 27/01, H04B 1/04, H04B 1/16, H04B2001/1072, H04L 25/03019Filed as SK hynix Inc.2026-05-20Jong Heon JEONGpending
PATTERN ANALYSIS ENABLED READ OPERATION IN NAND COMPONENTG11C 16/08, G11C 16/28, G11C 11/5642, G11C 16/0483, G11C 16/26, G11C 16/30, G11C 29/021, G11C 29/028, G11C2211/5642, G11C2211/5644Filed as SK hynix Inc.2026-05-20Ming Zhangpending
INTERCONNECTION STRUCTURE, SEMICONDUCTOR DEVICE WITH INTERCONNECTION STRUCTURE AND METHOD FOR FABRICATING THE SAMEH10W 20/085, H10W 20/089, H10W 20/435, H10W 20/43, H10W 20/4403, H10W 20/057, H10W 20/084, H10W 20/074, H10W 20/42, H10W 20/056Filed as SK hynix Inc.2026-05-20Jong Su KIMpending
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICEH10B 51/20, H10B 51/30, H10D 64/033, H10D 30/0415, H10D 30/701, H10D 64/689, G11C 5/063, G11C 11/2275, G11C 16/08, G11C 16/10, G11C 16/24Filed as SK hynix Inc.2026-05-20Hee Sung KONGpending
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICEH10B 43/40, H10B 43/27, H10B 43/50, H10B 43/35, H10B 63/845, H10B 43/10, H10B 41/27, H10D 30/693Filed as SK hynix Inc.2026-05-19Jin Ha KIMpending
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICEH10D 84/85, H10D 84/0181, H10D 84/856, H10D 64/691, H10D 64/01, H10D 64/685, H10D 30/0415, H10D 84/038, H10D 30/701, H10D 64/68, H10D 64/689Filed as SK hynix Inc.2026-05-19Young Gwang YOONpending
OPERATING METHOD OF STORAGE CONTROLLER MANAGING SYSTEM MEMORY BLOCKS AND STORAGE DEVICE INCLUDING THE SAMEG06F 3/0604, G06F 3/0616, G06F 3/064, G06F 3/0614, G06F 3/0619, G06F 3/0631, G06F 3/0647, G06F 3/0652, G06F 3/0658, G06F 3/0659, G06F 3/0679, G06F2212/1016, G06F2212/1032, G06F2212/7211Filed as SK hynix Inc.2026-05-19Jae Il LEEpending
DATA STORAGE APPARATUS GUARANTEEING PROGRAM SEQUENCE AND OPERATING METHOD THEREOFG06F 3/0656, G06F 12/0246, G06F 12/1009, G06F 3/0638, G06F 3/0658, G06F 3/0679, G06F 11/073, G06F 12/0284, G06F 12/0868, G06F 12/12, G06F2212/214, G06F2212/261, G06F2212/312, G06F2212/7201, G06F2212/7203, G06F2212/7208Filed as SK hynix Inc.2026-05-19Min Sik LIMpending
MEMORY CELL AND SEMICONDUCTOR MEMORY DEVICE WITH THE SAMEH10B 12/30, H10B 12/03, H10D 1/68, H10B 12/482, H10B 12/05, H10B 12/50, H10D 30/6741, H10D 1/714, H10D 30/6745, H10D 86/60, H10D 30/6755, H10D 86/481, H10W 20/069Filed as SK hynix Inc.2026-05-19Seung Hwan KIMpending
SELF-CORRECTED LOW-DENSITY PARITY CHECK (LDPC) WITH INDEX MATCHG06F 3/0604, G06F 3/0679, G06F 3/0653Filed as SK Hynix NAND Product Solutions Corp. (dba Solidigm)2026-05-18Zion KWOKpending
SEMICONDUCTOR DEVICE INCLUDING BARRIER DIELECTRIC LAYER INCLUDING FERROELECTRIC MATERIALH10B 53/30, H10D 1/684, H10D 1/68, H10B 12/31, H10B 51/30, H10D 1/716, H10D 64/691, H10D 30/62, H10D 64/685, H10D 30/701, H10D 64/689Filed as SK hynix Inc.2026-05-15Dong Ik SUHpending
MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAMEH10B 41/49, H10B 43/40, H10B 41/41, H10B 43/50, H10B 41/50, H10B 41/10, H10B 43/10, H10B 41/27, H10B 43/27Filed as SK hynix Inc.2026-05-14Nam Jae LEEpending
PERIPHERAL COMPONENT INTERCONNECT EXPRESS (PCIe) SYSTEM PERFORMING LOW POWER MANAGEMENT AND METHOD OF OPERATING THE SAMEG06F 13/28, G06F 1/3275, G06F 1/3296, G06F 13/4221, G06F2213/0026Filed as SK hynix Inc.2026-05-14Yong Tae JEONpending
MEMORY DEVICEG11C 7/04, G11C 7/1018, G11C 16/10, G11C 16/102, G11C 7/1048, G11C 11/5628, G11C 16/0483, G11C 16/08, G11C 16/24, G11C 16/26, G11C 16/32, G11C 16/3418, G11C 16/3459Filed as SK hynix Inc.2026-05-12Chan Hui JEONGpending
MEMORY DEVICE FOR PERFORMING TARGET REFRESH OPERATION, AND OPERATION METHOD THEREOFG06F 21/554, G06F 21/79, G11C 11/40611, G06F 3/0659, G06F 21/566, G06F2221/034, G11C 11/4078, G11C 11/408Filed as SK hynix Inc.2026-05-12Chul Moon JUNGpending
DATA CODING DEVICE, MEMORY CONTROLLER, AND STORAGE DEVICEG06F 3/0604, G06F 3/0656, G06F 3/0659, G06F 3/0679Filed as SK hynix Inc.2026-05-11Ji Wook KIMpending
EXTERNAL DATA STORAGE DEVICEG06F 1/187, H05K 5/0091, H05K 5/0256, G06F 1/16, G06F 1/20, G11B 23/021, H05K 5/0204, H05K 5/0213, H05K 7/20127Filed as SK hynix Inc.2026-05-11Nam Hyeon CHOIpending
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICEH10B 43/30, H10B 41/27, H10B 43/27, G11C 5/063, H10B 43/50, H10B 41/30, H10B 41/50, H10B 41/10, H10B 41/40, H10B 43/40, H10B 43/10Filed as SK hynix Inc.2026-05-07Nam Jae LEEpending
MEMORY PACKAGE AND MEMORY MODULE INCLUDING THE MEMORY PACKAGEH10B 80/00, H10W 72/50, H10W 72/851, H10W 90/00, H10W 20/20, H10W 72/879, H10W 72/20, H10W 90/297, H10W 90/724, H10W 90/754, H10W 90/722, G11C 5/04, G11C 5/06, G11C 7/1057Filed as SK hynix Inc.2026-05-07Won Ha CHOIpending
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICEH10B 41/10, H10B 43/30, H10B 41/27, H10B 43/27, H10B 43/50, H10B 41/30, H10B 41/50, H10B 43/10, H10W 20/435, G11C 16/0483Filed as SK hynix Inc.2026-05-06Jung Shik JANGpending
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICEH10B 43/50, H10B 41/35, H10B 43/10, H10W 20/42, H10B 41/10, H10B 43/35, H10B 43/40, H10B 41/27, H10B 43/27, H10D 30/69, H10W 20/43, H10W 20/20, H10W 20/435Filed as SK hynix Inc.2026-05-06Sang Yong LEEpending
MEMORY DEVICE AND METHOD OF OPERATING THE SAMEG11C 16/10, G11C 16/14, G11C 16/16, H10B 43/35, H10B 43/27, G11C 7/227, G11C 11/5628, G11C 16/0483, G11C 16/08, G11C 16/12, G11C 16/24, G11C 16/30, G11C 16/32, G11C 16/34, G11C 16/3404, G11C 16/3409Filed as SK hynix Inc.2026-05-05Sang Tae AHNpending
APPRATUS AND OPERATION METHOD FOR DISTRIBUTED PROCESSING OF PLURAL OPERATIONS IN DATA STORAGE SYSTEMG06F 3/0604, G06F 9/3838, G06F 3/0614, G06F 3/0653, G06F 3/0658, G06F 9/4881, G06F2212/1016, G06F2212/1032Filed as SK hynix Inc.2026-05-04Ku Ik KWONpending
STORAGE DEVICE, HOST DEVICE, AND ELECTRONIC DEVICE FOR SHARED MEMORY AREA ACCESSG06F 3/0659, Y02D 10/00, G06F 3/0604, G06F 3/0679Filed as SK hynix Inc.2026-05-04Dong Sop LEEpending
SEMICONDUCTOR DEVICE, METHOD FOR FABRICATING THE SEMICONDUCTOR DEVICE, AND MEMORY DEVICE AND SYSTEM INCLUDING THE SEMICONDUCTOR DEVICEH10B 41/50, H10W 20/20, H10W 20/083, H10W 70/611, H10B 43/50, H10B 43/35, H10B 41/35, H10B 41/40, H10B 43/40, H10B 41/27, H10B 43/27, H10W 20/069, H10W 70/65, H10W 20/076, G11C 16/0483Filed as SK hynix Inc.2026-05-04Nam-Kuk KIMpending
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICEH10B 12/30, H10B 41/30, H10B 41/27, H10B 12/05, H10B 43/30, H10B 41/23, H10B 43/27, H10B 12/02, H10P 50/691Filed as SK hynix Inc.2026-05-04Na Yeong YANGpending
MEMORY CONTROLLER AND STORAGE DEVICE INCLUDING THE SAMEG06F 3/0656, G06F 3/0658, G06F 3/0659, G06F 3/0604, G06F 3/061, G06F 3/0611, G06F 3/0679, G06F 12/0246, G06F 12/0253, G06F 12/0292, G06F2212/1024, G06F2212/1032, G06F2212/7203, G06F2212/7205Filed as SK hynix Inc.2026-05-04Geon Woo KIMpending
DATA STORAGE DEVICE AND OPERATING METHOD THEREOFG06F 3/061, G06F 3/0631, G06F 3/0656, G06F 3/0659, G06F 3/0608, G06F 3/0611, G06F 3/0629, G06F 3/0634, G06F 3/0644, G06F 3/0658, G06F 3/0665, G06F 3/0673, G06F 3/0679, G06F 12/0246, G06F 12/0871, G06F 12/0873, G06F2212/1044Filed as SK hynix Inc.2026-05-04Hyun Tae KIMpending
MEMORY DEVICE GENERATING VOLTAGE RESPONSIVE TO TEMPERATURE AND METHOD OF OPERATING THE SAMEG11C 5/147, G11C 7/04, G11C 7/1012, G11C 16/30Filed as SK hynix Inc.2026-04-30Min Hye KANGpending
SEMICONDUCTOR MEMORY DEVICE INCLUDING A PLURALITY OF MEMORY BLOCKS AND METHOD OF MANUFACTURING THE SAMEH10B 43/35, H10B 43/30, H10B 43/27, G11C 5/025, H10B 43/20, H10B 41/30, H10B 41/10, H10B 41/40, H10B 43/40, H10B 43/10, H10B 41/27, H10B 41/41, G11C 16/0483Filed as SK hynix Inc.2026-04-30Jung Shik JANGpending
SYSTEMS, METHODS, AND MEDIA FOR PROCESSING SUB-INDIRECTION-UNIT DATA IN SOLID-STATE DRIVESG06F 3/064, G06F 12/0246, G06F 3/0611, G06F 3/0679, G06F2212/7201Filed as SK hynix NAND Product Solutions Corp.2026-04-30Vinit Vyaspending
BUFFER CIRCUIT, AND SEMICONDUCTOR APPARATUS CAPABLE OF ADJUSTING A CLOCK RECEIVER AND/OR CHANGING A CLOCK PATH ACCORDING TO FREQUENCY INFORMATIONG06F 1/08, G06F 1/10, G11C 7/222, G06F 1/12, G06F 1/324, G11C 7/1048, G11C 7/1084, G11C 8/18, H03K 19/018528, H03L 7/0893, H03L 7/0896, H03L 7/191Filed as SK hynix Inc.2026-04-30Ji Hyo KANGpending
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICEH10B 43/35, H10B 43/30, H10B 41/27, H10B 43/50, H10B 41/30, H10B 41/50, H10B 41/10, H10B 41/35, H10B 43/10, H10B 43/27Filed as SK hynix Inc.2026-04-29Seok Min CHOIpending
STORAGE DEVICE AND OPERATING METHOD OF CONTROLLER OF STORAGE DEVICE BASED ON PROGRAM OPERATION CONTROLG06F 3/0614, G11C 29/1201, G06F 3/0604, G06F 3/0658, G06F2212/1016, G06F2212/1032, G11C 11/5628, G11C 16/10, G11C 16/102, G11C 16/3459, G11C 29/12005Filed as SK hynix Inc.2026-04-28Young Gyun KIMpending
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICEH10B 41/35, H10B 43/10, H10B 41/27, H10B 43/27, H10B 43/20, H10B 41/10, H10B 43/35, H10B 41/40, H10B 43/40, H10B 41/20, G11C 16/0483Filed as SK hynix Inc.2026-04-27Mi Seong PARKpending
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOFH10B 10/18, H10B 43/27, H10B 43/50, H10B 43/40, H10B 43/10, H10B 41/27Filed as SK hynix Inc.2026-04-27Nam Jae LEEpending
DATA STORAGE DEVICEH03M 13/1108, H03M 13/3707, G06F 3/0619, G06F 3/064, G06F 3/0659, G06F 3/0679, G06F 11/1048, G06F 11/1076, H03M 13/1111Filed as SK hynix Inc.2026-04-27Kyoung Lae CHOpending
DATA STORAGE DEVICE, DATA STORAGE SYSTEM AND COMPUTING SYSTEM FOR SNAPSHOT OPERATIONSG06F 3/061, G06F 9/5016, G06F 11/1451, G06F 11/1456, G06F 3/0638, G06F 3/065, G06F 3/0658, G06F 3/0659, G06F 9/45558, G06F 11/1448, G06F 11/1469, G06F 11/1471, G06F2009/45583, G06F2201/84Filed as SK hynix Inc.2026-04-27Hyeong Soo KIMpending
MEMORY CONTROLLER AND METHOD OF OPERATING THE SAMEG06F 3/0604, G06F 3/0655, G06F 3/0679, G06F 3/0614, G06F 3/064, G06F 3/0658, G06F 12/0253, G06F2212/1032, G06F2212/7205Filed as SK hynix Inc.2026-04-26In Jong JANGpending
MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAMEH10B 43/50, H10B 43/20, H10B 43/27, G11C 5/063, H10B 41/10, H10B 41/35, H10B 43/30, H10B 43/10, H10D 30/694Filed as SK hynix Inc.2026-04-22Won Geun CHOIpending
DATA STORAGE SYSTEM INCLUDING INTERFACE DEVICEG06F 13/1668, G06F 13/1684, G06F 13/4022, G06F 3/0655, G06F 3/0683, G06F 13/4221, G06F 13/4282, G06F2213/0026Filed as SK hynix Inc.2026-04-22Wenwei Wangpending
BUFFER CHIP, SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP, MEMORY MODULE, AND OPERATION METHOD OF SEMICONDUCTOR PACKAGEH10W 90/00, G11C 7/109, H10W 72/90, H10W 72/50, H10W 90/754, H10W 72/5453, H10W 90/752, H10W 90/792, H10W 90/24, G11C 5/025, G11C 5/04, G11C 5/06, G11C 7/1069, G11C 7/1084, G11C 7/1087, G11C 7/1093, G11C 7/222, G11C 8/12, G11C2207/2227, G11C2207/2272Filed as SK hynix Inc.2026-04-22Choung Ki SONGpending
BUFFER CHIP, SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP, AND MEMORY MODULEG11C 11/4093, H10B 80/00, H10W 90/00, H10W 90/754Filed as SK hynix Inc.2026-04-22Choung Ki SONGpending
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICEH10B 41/27, H10B 20/50, H10B 43/50, H10B 20/40, H10B 41/50, H10B 43/35, H10B 41/35, H10B 43/40, H10B 43/10, H10B 43/27, H10B 20/65, H10W 20/435Filed as SK hynix Inc.2026-04-22Jae Ho KIMpending
MULTIPLICATION AND ACCUMULATION (MAC) OPERATORG06F 7/5443, G06F 5/012, G06F2207/4824Filed as SK hynix Inc.2026-04-22Choung Ki SONGpending
STORAGE DEVICE DETERMINING WHETHER DATA IS ALL ONE OR ALL ZERO BASED ON STATE VALUE AND OPERATING METHOD OF THE STORAGE DEVICEG06F 3/0625, G06F 3/0658, G06F 3/0604, G06F 3/061, G06F 3/0653, G06F 3/0659, G06F 3/0673, G06F 3/0679, G06F2212/1016, G11C 16/10, G11C 16/26Filed as SK hynix Inc.2026-04-21Young Gyun KIMpending
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICEH10B 43/20, H10B 80/00, H10B 41/27, H10W 72/20, H10B 43/50, H10B 41/50, H10B 41/40, H10B 43/40, H10B 41/20, H10B 43/27, H10W 90/00, H10W 80/312, H10W 90/297, H10W 80/327, H10W 90/792Filed as SK hynix Inc.2026-04-21Sung Wook JUNGpending
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOFH10B 43/10, H10B 41/27, H10B 43/27, H10B 43/50, H10B 41/30, H10B 41/50, H10B 41/10, H10B 43/30Filed as SK hynix Inc.2026-04-17Rho Gyu KWAKpending
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAMEH10B 12/34, H10D 64/01, H10B 12/01, H10B 12/053, H10D 64/667, H10D 64/691, H10D 64/685, H10D 30/60, H10D 64/513, H10D 64/669, H10D 64/68, H10D 64/01338, H10D 64/01332Filed as SK hynix Inc.2026-04-15Jun Sik KIMpending
INTERFACE DEVICE AND METHOD OF OPERATING THE SAMEG06F 13/385, G06F 13/4018, G06F 13/4022, G06F 13/4291, G06F 1/08, G06F 13/4059, G06F2213/0024, G06F2213/0026, H04L 7/005, H04L 7/0079, H04L 7/0091, H04L 7/033Filed as SK hynix Inc.2026-04-15Dae Sik PARKpending
DEVICE AND COMPUTING SYSTEM INCLUDING THE DEVICEG06F 13/4291, H04L 7/005, G06F 1/08, G06F 13/4059, H04B 15/02, H04L 7/0079, H04L 7/0091, H04L 7/033Filed as SK hynix Inc.2026-04-15Yong Tae JEONpending
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICEH10B 43/35, H10B 41/27, H10B 41/10, H10B 41/40, H10B 43/40, H10B 43/10, H10B 43/27Filed as SK hynix Inc.2026-04-13Nam Jae LEEpending
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOFH10B 43/27, H10W 90/00, H10B 43/50, H10B 41/10, H10B 43/40, H10B 43/10, H10B 41/27, H10W 80/00, H10W 80/312, H10W 80/327, H10W 90/792Filed as SK hynix Inc.2026-04-13Dong Hwan LEEpending
PCIe DEVICEG06F 13/4045, G06F 13/4221, G06F 1/08, G06F 1/3209, G06F 1/3253, G06F 1/3287, G06F 7/588Filed as SK hynix Inc.2026-04-10Yong Tae JEONpending
PCIe DEVICEG06F 13/4045, G06F 13/4221, G06F 1/08, G06F 1/3209, G06F 1/3253, G06F 1/3287, G06F 7/588Filed as SK hynix Inc.2026-04-10Yong Tae JEONpending

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