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Qorvo Inc Patents

What Qorvo Inc has filed at the patent office — applications as well as grants, because a filing is on the record eighteen months before anyone has to say what it was for.

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Filings on file
60
Granted
0
Still pending
60
Filed under
3 names

60 filings

Newest filing first. A pending application has no patent number yet, and most never get one.

InventionPatent
DELAMINATION/CRACKING IMPROVEMENT AT SOLDER JOINTS IN MICROELECTRONICS PACKAGEH10W 72/073, H10W 72/30, H10W 72/07336, H10W 72/923, H10W 72/952, H10W 72/90, H10W 72/07355, H10W 72/352, H10W 90/736, H10W 72/3524, H10W 72/3528Filed as Qorvo US, Inc.2026-06-08Yinbao Yangpending
POWER PROTECTION LOOP FOR AMPLIFIER CHAIN ELEMENTSH03F 1/52, H03F 3/195, H03F 1/30, H03F 1/523, H03F 3/21, H03F 3/213, H03F 3/245, H03F2200/105, H03F2200/171, H03F2200/258, H03F2200/426, H03F2200/441, H03F2200/444, H03F2200/451, H03F2200/462, H03F2200/465, H03F2200/468, H03F2200/471, H03F2200/519, H03F2200/522, H03F2200/78Filed as Qorvo US, Inc.2026-06-05George Maximpending
STACKED DIE PACKAGE AND METHODS OF FORMING THE SAMEH10W 90/00, H10W 72/856, H10W 72/877, H10W 74/10, H10W 72/07253, H10W 90/701, H10W 90/732, H10W 70/099, H10W 70/685, H10W 72/823, H10W 74/114, H10W 74/40, H10W 72/851, H10W 72/234, H10W 70/65, H10W 90/20, H10W 72/20, H10W 74/00, H10W 72/0198, H10W 90/724, H10W 70/05, H10W 90/288, H10W 90/722, H10W 72/01, H10W 74/016, H10W 90/24, H10W 72/252, H10W 70/611, B81B 7/0074, B81B2207/012, B81B2207/07, B81B2207/092, B81B2207/094, B81B2207/097, B81C 1/00301, B81C2203/032, B81C2203/035, B81C2203/0771Filed as Qorvo US, Inc.2026-05-14Julio C. Costapending
COMBINER/SPLITTERH03H 7/487, H04B 1/40, H01P 5/12, H01P 5/16, H03H 7/09, H03H 7/48, H03H2001/0078Filed as Qorvo US, Inc.2026-04-21Timothy M. Gittemeierpending
EDGE-ENABLED VOID ISOLATOR (EEVI) FOR ANTENNASH01Q 1/521, H01Q 21/28Filed as Qorvo US, Inc.2026-04-15Jan-Willem Zweerspending
ANTENNA STRUCTURES FOR SPATIAL POWER-COMBINING DEVICESH01P 5/16, H01Q 23/00, H01P 3/06, H01P 5/12, H01Q 13/085, H01Q 25/005, H03F 3/19, H03F 3/195, H03F 3/245Filed as Qorvo US, Inc.2026-03-30John Kittpending
ASYMMETRICAL POWER AMPLIFIER CIRCUITH03F 1/02, H03F 1/0288, H03F 1/0211, H03F 1/565, H03F 3/193, H03F 3/211, H03F 3/24, H03F 3/245, H03F 3/45475, H03F2200/273, H03F2200/451, H03F2200/541, H03F2200/75, H03F2203/45228Filed as Qorvo US, Inc.2026-03-02Nadim Khlatpending
IMPEDANCE TRANSFORMING TAPERED COUPLERSH01P 5/184, H01P 5/227, H01P 9/006, H01P 9/02, H03H 2/006Filed as Qorvo US, Inc.2026-02-27Kelly M. Learpending
ACOUSTIC WAVE DEVICES WITH VIA STRUCTURESH03H 9/131, H03H 9/172, H03H 3/02, H03H 9/02102, H03H 9/0514, H03H 9/0547, H03H 9/13, H03H 9/132, H03H 9/173, H03H 9/605, H03H2003/021Filed as Qorvo US, Inc.2026-02-26Andriy Kryshtopinpending
MULTI-OUTPUT DIRECT CURRENT (DC) VOLTAGE CIRCUITH02M 1/008, H02M 3/1584, H02M 1/007, H02M 3/07Filed as Qorvo US, Inc.2026-02-20Nadim Khlatpending
CREATING A SINTERING METALLIZATION LAYER ON EXPOSED SURFACES OF SILICON DIES FOR DSMBGAS TO ENHANCE HEAT DISSIPATIONH10W 40/242, H10P 52/00, H10W 72/877, H10W 72/01323, H10W 90/291, H10W 70/099, H10W 90/10, H10W 72/01361, H10W 90/7295, H10W 72/01304, H10W 90/22, H10W 90/724, H10W 40/258, H10W 72/322, H10W 72/365, H10W 90/288, H10W 90/734, H10W 72/352, H10W 74/117, H10W 70/611Filed as Qorvo US, Inc.2026-02-20Zhengpeng Xiongpending
PLANAR SOLID STATE POWER AMPLIFIER ARCHITECTURE WITH INTEGRATED WAVEGUIDE TRANSITIONS, HEAT SINK AND COMBINERH01P 5/107, H03F 3/602, H01P 5/024, H01P 5/16, H03F 3/245, H03F2200/451Filed as Qorvo US, Inc.2026-02-20Michael Dean Robergpending
LOW-POWER UNDERVOLTAGE LOCKOUT CIRCUITSH02H 3/24, H02H 1/0007, H02H 3/066Filed as Qorvo US, Inc.2026-02-19Daijiro Otanipending
CROSSTALK TOLERANT LRRM AUTO-LOAD INDUCTANCE CALIBRATIONG01R 35/005, G01R 35/007, G01R 27/04, G01R 27/28, G01R 27/32Filed as Qorvo US, Inc.2026-02-18Leonard Haydenpending
LAMINATE PASSIVE STRUCTURE WITH STAND-OFF FOR MULTILEVEL MODULE INTEGRATIONH10W 90/724, H10W 42/20, H10W 90/701, H10W 90/00, H10W 42/276, H10W 90/401, H10W 42/273, H10W 90/726Filed as Qorvo US, Inc.2026-02-17Thomas Scott Morrispending
CORRECTING AMPLITUDE-AMPLITUDE DISTORTION IN AN ENVELOPE TRACKING POWER MANAGEMENT CIRCUITFiled as QORVO US, INC.2026-02-16NADIM KHLATpending
VOLTAGE STANDING WAVE RATIO IMMUNITY IN A POWER MANAGEMENT CIRCUITH03F 1/02, H03F 3/245, H03F 1/0222, H03F 1/0288, H03F 1/56, H03F 1/565, H03F 3/19, H03F 3/195, H03F 3/211, H03F 3/24, H03F2200/102, H03F2200/192, H03F2200/204, H03F2200/336, H03F2200/387, H03F2200/451, H03F2200/541Filed as Qorvo US, Inc.2026-02-12Nadim Khlatpending
WIRELESS DEVICE MULTI-TRANSMISSION CONFIGURATIONSFiled as QORVO US, INC.2026-02-11NADIM KHLATpending
EFFICIENCY IMPROVEMENT IN AN ENVELOPE TRACKING POWER MANAGEMENT CIRCUITFiled as QORVO US, INC.2026-02-11NADIM KHLATpending
VOLTAGE RIPPLE REDUCTION IN AN ENVELOPE TRACKING POWER MANAGEMENT CIRCUITFiled as QORVO US, INC.2026-02-11NADIM KHLATpending
RECONFIGURABLE HYBRID LATTICE FILTER SYSTEMH03H 9/0023, H03H 9/02, H03H2009/02165Filed as Qorvo US, Inc.2026-02-10Yazid Yusufpending
REDUCING OUTPUT STAGE INSERTION LOSS IN A MULTI-STAGE DIFFERENTIAL POWER AMPLIFIER CIRCUITH03F 3/45475, H03F 3/245, H03F2200/451Filed as Qorvo US, Inc.2026-02-10Nadim Khlatpending
REDUCING DRIVER STAGE FOOTPRINT IN A MULTI-STAGE DIFFERENTIAL POWER AMPLIFIER CIRCUITH03F 3/195, H03F 3/24, H03F 1/0222, H03F 1/56, H03F 1/565, H03F 3/19, H03F 3/193, H03F 3/211, H03F 3/245, H03F 3/26, H03F 3/45188, H03F 3/45475, H03F2200/06, H03F2200/09, H03F2200/102, H03F2200/192, H03F2200/336, H03F2200/387, H03F2200/451, H03F2200/534, H03F2200/537, H03F2200/541, H03F2203/45731Filed as Qorvo US, Inc.2026-02-10Marcus Granger-Jonespending
AIR CAVITY LIDH10W 95/00, H10W 90/724, H10W 76/67, H10W 74/15, H10W 76/15, H10W 42/00, H10W 44/20, H10W 76/63, H10W 76/153, H10W 76/134, H10W 76/47, H10W 90/754, H10W 76/12, H10W 90/734, H10W 76/17, H10W 76/60, H10W 42/121, H10W 90/736Filed as Qorvo US, Inc.2026-02-10MD Hasninepending
BULK ACOUSTIC WAVE DEVICES WITH VERTICALLY STACKED FILTERSFiled as QORVO US, INC.2026-02-09ELOI GUERREROpending
ELECTRONIC DEVICE COMPRISING A SINGLE DIELECTRIC LAYER FOR SOLDER MASK AND CAVITY AND METHOD FOR FABRICATING THE SAMEH10W 70/65, H05K 3/3452, H10W 70/69, H10W 70/05, H05K 1/111, H05K 3/287, H05K2201/0191, H05K2201/0338, H05K2201/0376, H05K2201/09045, H05K2201/094, H05K2201/09472, H05K2201/09736, H05K2201/0989, H05K2203/0759Filed as Qorvo US, Inc.2026-02-09John August Orlowskipending
METHOD FOR REUSING UNIQUE SUBORDINATE IDENTIFICATION IN A SERIAL BUS CIRCUITFiled as QORVO US, INC.2026-01-26CHRISTOPHER TRUONG NGOpending
SELF-CONTAINED DETERMINATION OF MODE-OF-OPERATION FOR A SUBORDINATE CIRCUIT IN A SERIAL BUS APPARATUSFiled as QORVO US, INC.2026-01-26CHRISTOPHER TRUONG NGOpending
DOHERTY AMPLIFIER WITH FAST PEAK ACTIVATIONFiled as QORVO US, INC.2026-01-23BAKER SCOTTpending
COMPRESSION COMPENSATION FOR POWER AMPLIFERFiled as QORVO US, INC.2026-01-22BAKER SCOTTpending
BULK ACOUSTIC WAVE FILTER CURCUITS OF ADJUSTABLE INDUCTIVE IMPEDANCEFiled as QORVO US, INC.2026-01-20JUNYI HUANGpending
ULTRAWIDEBAND SIDELOBE SUPPRESSION USING COMPLEMENTARY GOLAY PAIR TRANSMISSIONFiled as QORVO US, INC.2026-01-15MARCO CAVALIEREpending
ALTERNATIVE DIPLEXER-BASED ACOUSTIC UNWANTED SPURS AND LOSSES REDUCTION TECHNIQUEH04B 1/0483, H03H 9/54, H03H 9/64Filed as Qorvo US, Inc.2026-01-08Chris Levesquepending
SINGLE VCO FREQUENCY SYNTHESIZER ARCHITECTURE FOR UWB APPLICATIONSH03K 5/00006, H03L 7/183, H03L 7/1976Filed as Qorvo US, Inc.2026-01-08Mohamed Bouhamamepending
RECEIVER DELAY DETERMINATION AND CALIBRATIONFiled as QORVO US, INC.2026-01-07ANDREW FORTpending
SECOND OVERTONE ACOUSTIC RESONATOR WITH SPURIOUS MODE DAMPINGFiled as QORVO US, INC.2026-01-06YAZID YUSUFpending
CLOSED LOOP POWER CONTROLH03F 1/0205, H03F 1/0227, H03F 1/0238, H03F 1/3205, H03F 3/193, H03F 3/245, H03F2200/102, H03F2200/126, H03F2200/129, H03F2200/451, H03G 3/3036Filed as Qorvo US, Inc.2026-01-05Søren Deleuran Laursenpending
METHOD AND APPARATUS FOR TERMINATING A TIME DIVISION DUPLEX PHASED ARRAY ANTENNAH01Q 3/26, H01Q 3/30, H01Q 1/241, H01Q 1/288, H01Q 1/48, H01Q 1/525, H01Q 9/0407, H01Q 21/065, H01Q 25/001Filed as Qorvo US, Inc.2025-12-30Wade C. Allenpending
METHOD TO ENABLE DOUBLE SIDE MOLDED MODULE WITH PLATED COPPER POSTSH10W 70/099, H10W 74/019, H10W 72/823, H10W 70/06, H10W 42/121Filed as Qorvo US, Inc.2025-12-30Yong-Jae Kopending
PA COARSE COMPLEX VSWR DETECTION (QUADRANT) FOR ANALOG-ASSISTED DPD AND PA LOAD MODULATION OPTIMIZATIONH03F 1/3241, H03F 3/245, H03F 1/0272, H03F 1/3247, H03F 1/565, H03F 3/189, H03F 3/195, H03F 3/20, H03F2200/102, H03F2200/387, H03F2200/435, H03F2200/451, H03F2201/3233Filed as Qorvo US, Inc.2025-12-29Nadim Khlatpending
TEMPERATURE SENSING IN A RADIO FREQUENCY (RF) DEVICE ARRAYH03F 1/302, H03F 1/301, H03F 3/245, H03F2200/447, H03F2200/451, H03F2200/468Filed as Qorvo US, Inc.2025-12-18John Bellantonipending
SYSTEMS, DEVICES, AND METHODS FOR DIGITAL ANTENNA SWITCHING FOR INTERNET OF THINGS GATEWAYS AND END-NODES AND OTHER WIRELESS COMMUNICATION DEVICESFiled as QORVO US, INC.2025-12-16ANDREW FORTpending
DOUBLE-SIDED INTEGRATED CIRCUIT MODULE HAVING AN EXPOSED SEMICONDUCTOR DIEH10W 90/00, H10W 74/117, H10F 77/50, H10W 72/877, H10W 70/685, H10W 44/20, H10W 72/073, H10W 72/944, H10W 72/072, H10W 90/293, H10W 70/635, H10W 40/10, H10W 74/142, H10W 72/07254, H10W 74/00, H10P 95/00, H10P 95/066, H10W 72/0198, H10W 90/724, H10W 90/754, H10W 72/247, H10W 42/20, H10W 90/734, H10W 72/352, H10P 50/28, H10W 70/611Filed as Qorvo US, Inc.2025-12-16John Robert Siomkospending
SEMICONDUCTOR PACKAGE WITH TOP-LID SURFACE-MOUNTED TECHNOLOGY CAPACITORS FOR ENHANCED PERFORMANCEH10W 76/01, H10W 42/276, H10W 90/701, H10W 74/114, H10W 44/20, H10W 90/10, H10W 76/153, H10W 90/00, H10W 42/271, H10W 90/22, H10W 90/401, H10W 90/724, H10W 90/754, H10W 44/243, H10W 42/20, H10W 42/273Filed as Qorvo US, Inc.2025-12-09Assaf Aviv Havivpending
RADIO FREQUENCY FRONT END MODULE WITH GAIN AND PHASE ALIGNMENTH04B 17/13Filed as Qorvo US, Inc.2025-12-08David Cormanpending
SYSTEMS AND METHODS FOR THERMAL DROOP COMPENSATION FOR POWER AMPLIFIERSH03F 1/30, H03F 1/0222, H03F 3/195, H03F 3/213, H03F2200/447, H03F2200/451, H03F2200/468Filed as Qorvo US, Inc.2025-12-08John Bellantonipending
INFERENCE MODEL FOR OPTIMIZING A FRONT-END MODULE (FEM) IN A WIRELESS COMMUNICATION DEVICEG06N 5/04Filed as Qorvo US, Inc.2025-12-05George Maximpending
ELECTROMAGNETIC COMPARTMENTAL SHIELDING FOR MULTICHIP CAVITY SYSTEM-IN-PACKAGE (SIP) MODULEH10W 42/20, H10W 42/273, H10W 76/15, H10W 42/00, H10W 44/20, H10W 76/63, H10W 90/10, H10W 95/00, H10W 90/00, H10W 76/01, H10W 76/134, H10W 76/47, H10W 42/271, H10W 42/267, H10W 42/276, H10W 90/754, H10W 40/233, H10W 76/12, H10W 42/281, H10W 90/734, H10W 90/752, H10W 74/117, H10W 76/167, H10W 76/17, H10W 76/60, H10W 44/206, H10W 90/736Filed as Qorvo US, Inc.2025-12-02MD Hasninepending
CASCADED BAW FILTER DIES OF DIFFERENT TECHNOLOGIES FOR PERFORMANCE IMPROVEMENTH03H 9/542, H03H 9/725, H03H 3/02, H03H 9/02015, H03H 9/02574, H03H 9/0542, H03H 9/0576, H03H 9/175, H03H 9/568, H03H 9/588, H03H 9/605, H03H 9/6483, H03H 9/706Filed as Qorvo US, Inc.2025-12-02Aykut Cihangirpending
MULTI-MILLISECOND RANGING IN ULTRA-WIDEBAND SYSTEMSG01S 13/0209, H04L 27/0014, H04B 1/71637, H04B 1/7183Filed as Qorvo US, Inc.2025-12-02Michael McLaughlinpending
INTEGRATED SINGLE-CHIP BEAMFORMING SYSTEMH04B 7/04, H04B 7/0617, H04B 7/18513Filed as Qorvo Texas, LLC2025-11-25Kartik Sridharanpending
SYSTEM AND METHODS FOR DETERMINING USERS INTENT IN ACCESS APPLICATIONSG05B 13/027Filed as Qorvo US, Inc.2025-11-25Ha Cam Thanh Lepending
DEVICES, METHODS, AND SYSTEMS THAT COMBINE DOWNLINK AND UPLINK TIME DIFFERENCE OF ARRIVAL TECHNIQUESH04W 56/0015, H04B 1/7163, H04W 64/00Filed as Qorvo US, Inc.2025-11-19Alexander Ivanovpending
BAW STRUCTURES WITH SYMMETRIC BO CONFIGURATIONSFiled as QORVO US, INC.2025-11-19YAZID YUSUFpending
CHEMICAL-ASSISTED ION BEAM DICINGFiled as QORVO US, INC.2025-11-17KRISHNA CHETRYpending
RF SWITCH STRUCTURE DESIGN USING LOCAL BODY BIAS TECHNIQUES FOR REDUCED AREAH03K 17/687, H10D 80/213, H10D 80/251, H10W 44/231, H10W 44/20, H10W 90/00, H10W 20/20, H03K2217/0018Filed as Qorvo US, Inc.2025-11-12Karl J. Couglarpending
LINEARIZED FRONT-END OPERATION USING INFORMATION FROM BASEBAND CIRCUITH04B 1/04, H04B 1/0475, H03F 1/3247, H03F2201/3233, H04B2001/0425, H04L 5/001, H04L 25/49Filed as Qorvo US, Inc.2025-11-11George Maximpending
REDUCING EQUIVALENT SERIES RESISTANCE IN A POWER MANAGEMENT CIRCUIT DURING SINGLE TRANSMISSIONH02M 3/07, H03F 3/211, H03F 1/0227, H03F 3/195, H03F 3/245, H03F2200/451Filed as Qorvo US, Inc.2025-11-10Nadim Khlatpending
SEMICONDUCTOR DETECTION STRUCTURES FOR DIE CRACKING SCREENING TEST AND METHOD FOR FORMING THE SAMEFiled as QORVO US, INC.2025-11-07RICHARD FRANKOVICpending
RANGING WITH SIMULTANEOUS FRAMESG01S 13/76, G01S 13/765, H04B 1/7163, H04W 12/037, H04W 12/03, G05D 1/226, B60R 25/2072, B60R 25/24, B60R2325/108, B60W 30/06, G01S 13/0209, G05D 1/0022, H04B2201/71634Filed as Qorvo US, Inc.2025-11-05Michael McLaughlinpending

Filings are matched to the company by applicant name, so a subsidiary filing under its own name is only here if that name resolves to this company. The applicant is printed as filed, which makes a wrong match visible. A patent is not a product: most applications are never granted, and most grants are never built.

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