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Microchip Technology Inc Patents
What Microchip Technology Inc has filed at the patent office — applications as well as grants, because a filing is on the record eighteen months before anyone has to say what it was for.
MCHP on carbonthat →Filings on file
70
Granted
0
Still pending
70
Filed under
3 names
70 filings
Newest filing first. A pending application has no patent number yet, and most never get one.
| Invention | Patent |
|---|---|
| HIGH-CAPACITY SOLID-STATE DRIVE WITH ADAPTIVE HANDLING FOR HIGH PRECISION DATA WRITEG06F 3/0655, G06F 3/0604, G06F 3/0679Filed as Microchip Technology Incorporated2026-06-09Nian Niles Yang | pending |
| METHOD OF DECOMMISSIONING A SOLID-STATE DRIVEG06F 12/0246, G11C 16/22, G11C 16/0483, G11C 16/30Filed as Microchip Technology Incorporated2026-05-14Nian Niles Yang | pending |
| CONNECTIVITY FRAMEWORK HAVING SESSION LAYER SECURITY FOR EMBEDDED SECURE CONNECTIVITYH04L 67/55, H04L 67/141, H04W 4/70, H04W 4/80, H04L 67/63, H04L 67/565, H04L 67/562, H04L 51/214, H04L 67/561, H04L 5/0044, H04L 45/745, H04L 63/061, H04L 63/0869, H04L 67/02, H04L 67/10, H04L 67/12, H04L 69/08, H04L 69/18, H04L 69/22Filed as Microchip Technology Incorporated2026-04-24Paolo Trere | pending |
| Method for Computing a Circuit Simulation with Respect to a DriverG06F 30/34, G06F 30/347, G06F 30/367, G06F2119/12Filed as Microchip Technology Inc.2026-04-20Jonathan W. Greene | pending |
| DEVICES INCLUDING CAPACITOR COUPLING POWER PATH TO GROUND PATH AND ASSOCIATED COMPONENTS AND SYSTEMSH10W 72/00, H10W 20/496, H10D 1/68, H10W 20/43, H10W 90/701, H10W 70/685, H10W 70/635, H10W 70/65, H10W 72/20, H10W 20/42, H10W 90/726, H05K 1/0233, H05K 3/4602, H05K2201/086, H05K2201/09345, H05K2201/10015, H05K2201/1003, H05K2201/1006Filed as Microchip Technology Incorporated2026-04-14Yuming Tao | pending |
| TRANSMIT COIL SELECTION RESPONSIVE TO AVERAGE PEAK-TO-PEAK MEASUREMENT VOLTAGE POTENTIALS AND RELATED APPARATUSES AND METHODH02J 50/60, H02J 50/402, H02J 50/05, H02J 50/12, H02J 50/40Filed as Microchip Technology Incorporated2026-04-14Santosh Bhandarkar | pending |
| THREE-DIMENSIONAL METAL-INSULATOR-METAL (MIM) CAPACITORS AND TRENCHESH10W 20/496, H10D 1/716, H10D 1/042, H10D 1/696Filed as Microchip Technology Incorporated2026-04-07Yaojian Leng | pending |
| OWNER REVOCATION EMULATION CONTAINERG06F 21/575, G06F 21/602Filed as Microchip Technology Inc.2026-04-07Eileen Marando | pending |
| Coding Data Into a Handwritten SampleG06V 30/224, G06F 3/03545, G06V 40/33, G06V 30/1423, B43K 29/08, G06F 3/016, G06F 3/0346, G06F 3/038, H04L 9/06Filed as Microchip Technology Incorporated2026-04-06Valentin Stoia | pending |
| INTERRUPT STATUS SCANNING OVER MDIO/MDC INTERFACEG06F 13/128, G06F 13/4221, G06F 13/24, G06F 13/372, G06F 13/385, G06F 13/4282, G06F 13/4291, G06F2213/0052, G06F2213/2418, G06F2213/2424, G06F2213/3808, H04L 49/351Filed as Microchip Technology Incorporated2026-03-27Lars Ellegaard | pending |
| WEAK BIT DETECTION IN NON-VOLATILE MEMORY USING ADJUSTED READ CONDITIONSFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-03-24JUHA ERIK WIKSTRÖM | pending |
| WEAK BIT DETECTION IN NON-VOLATILE MEMORY USING ADJUSTED READ CONDITIONSG06F 3/0655, G11C 29/021, G06F 3/0604, G06F 3/0679, G11C 29/028, G11C 29/42, G11C 29/50004, G11C2029/5004, G11C2029/5006Filed as Microchip Technology Incorporated2026-03-24Juha Erik Wikström | pending |
| LATERAL MOSFET HAVING A VERTICAL CHANNELFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-03-19SHESH MANI PANDEY | pending |
| LATERAL MOSFET HAVING A VERTICAL CHANNELH10D 30/658, H10D 30/603, H10D 30/0289, H10D 62/154, H10D 62/114, H10D 64/513, H10D 62/158, H10D 64/518, H10D 62/117, H10D 62/292, H10D 64/516, H10D 30/0221, H10D 62/393, H10D 30/608, H10D 62/01, H10D 64/025, H10D 64/514, H10D 30/026Filed as Microchip Technology Incorporated2026-03-19Shesh Mani Pandey | pending |
| DEVICE WITH FET GATE AND SCHOTTKY BARRIER DIODE IN SAME TRENCHFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-03-18SHESH MANI PANDEY | pending |
| DEVICE WITH FET GATE AND SCHOTTKY BARRIER DIODE IN SAME TRENCHH10D 84/146, H10D 84/0109, H10D 62/107, H10D 62/8325, H10D 30/668, H10D 30/0297Filed as Microchip Technology Incorporated2026-03-18Shesh Mani Pandey | pending |
| DEVICE, SYSTEM AND METHODS FOR PLL CONTROLFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-03-18KRSTE MITRIC | pending |
| SELF-CLEANING SAFETY SYSTEMB08B 7/026, G08B 29/18, B08B 5/02, B08B 6/00, G08B 17/00, G08B 29/126Filed as Microchip Technology Incorporated2026-03-17Patrick McFarland | pending |
| INDUCTIVE POSITION SENSOR THROTTLE ASSEMBLYFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-03-13AJITH KUMAR | pending |
| SOFTWARE DEVELOPMENT FRAMEWORK ENHANCEMENT TO SUPPORT CUSTOMIZED CODE GENERATIONFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-03-13KARTHIKEYAN JEGATHEESAN | pending |
| PROVISIONING HEADLESS WIFI DEVICES AND RELATED SYSTEMS, METHODS AND DEVICESH04W 48/16, H04W 76/11, H04W 12/55, H04W 12/06, H04W 84/12, H04W 88/10Filed as Microchip Technology Incorporated2026-03-13Vaibhav Madan | pending |
| SINGLE AND DUAL-EDGE TRIGGERED PHASE ERROR DETECTIONH03L 7/091, H03L 7/095, H03L 7/087, H03L 7/089, H03L 7/093, H03L2207/14Filed as Microchip Technology Incorporated2026-03-13William Roberts | pending |
| REDUCE DCO FREQUENCY OVERLAP-INDUCED LIMIT CYCLE IN HYBRID AND DIGITAL PLLSH03L 7/093, H03L 7/0991, H03L 7/099, H03L 7/104, H03L2207/06Filed as Microchip Technology Incorporated2026-03-13Youcef Fouzar | pending |
| ROTARY INDUCTIVE POSITION SENSING WITH 60° PHASE-SHIFTED SENSE SIGNALS, AND RELATED APPARATUSES AND METHODSG01D 5/20, G01D 5/2053, G01B 7/30, G01D 5/2046Filed as Microchip Technology Incorporated2026-03-12Ganesh Shaga | pending |
| SMART SOA CHECKS FOR DIGITAL CIRCUITSFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-03-12MAZHAR HOQUE | pending |
| FIELD EFFECT TRANSISTOR HAVING A GATE OXIDE WITH A LOW DIELECTRIC CONSTANTFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-03-10SHESH MANI PANDEY | pending |
| RADIATION HARDENED FIELD EFFECT TRANSISTOR WITH DOPED BUFFER LAYERH10D 30/0291, H10D 30/662, H10D 62/157, H10D 62/60, H10D 30/66, H10D 64/516, H10D 62/8325, H10P 30/212Filed as Microchip Technology Incorporated2026-03-06Shesh Mani Pandey | pending |
| RADIATION HARDENED FIELD EFFECT TRANSISTOR WITH DOPED BUFFER LAYERFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-03-06SHESH MANI PANDEY | pending |
| APPARATUS INCLUDING FET AND INTEGRATED SBD LOCATED INSIDE OF FET UNIT CELLH10D 84/146, H10D 84/101, H10D 8/60, H10D 30/0515, H10D 62/343, H10D 64/027, H10D 84/0107, H10D 64/411, H10D 62/117, H10D 30/051, H10D 30/831Filed as Microchip Technology Incorporated2026-03-04Shesh Mani Pandey | pending |
| APPARATUS INCLUDING FET AND INTEGRATED SBD LOCATED OUTSIDE OF FET UNIT CELLFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-03-04SHESH MANI PANDEY | pending |
| APPARATUS INCLUDING FET AND INTEGRATED SBD LOCATED OUTSIDE OF FET UNIT CELLH10D 62/343, H10D 84/101, H10D 8/60, H10D 30/0515, H10D 62/117, H10D 30/831, H10D 84/87Filed as Microchip Technology Incorporated2026-03-04Shesh Mani Pandey | pending |
| APPARATUS INCLUDING FET AND INTEGRATED SBD LOCATED INSIDE OF FET UNIT CELLFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-03-04SHESH MANI PANDEY | pending |
| HIGH PERFORMANCE POWER MOSFET WITH INTEGRATED SBDFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-03-03SHESH MANI PANDEY | pending |
| HIGH PERFORMANCE POWER MOSFET WITH INTEGRATED SBDH10D 30/66, H10D 84/101, H10D 64/661, H10D 30/63, H10D 8/051, H10D 84/0109, H10D 8/60, H10D 84/146, H10D 62/117, H10D 62/124, H10D 30/0297, H10D 30/025, H10D 64/514Filed as Microchip Technology Incorporated2026-03-03Shesh Mani Pandey | pending |
| MANAGING POWER STATE AT A PHYSICAL LAYERH04L 12/12, G06F 1/3209, H04L 12/40039Filed as Microchip Technology Incorporated2026-03-03William T. Baggett | pending |
| SECURE COMMUNICATIONS WITH DYNAMICALLY CHANGING CRYPTOGRAPHIC KEYS USING RANDOM KEY GENERATOR, AND RELATED METHODS AND DEVICESFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-02-27TIK MAN LEE | pending |
| DEBUG METHOD FOR HIGH DATA RATE PHYSICAL LAYER INTERFACEFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-02-26MORGAN MONKS | pending |
| SEMICONDUCTORS WITH METAL-INSULATOR-METAL (MIM) CAPACITORS AND INTERCONNECTSH10D 1/692, H10W 20/42, H10W 20/496Filed as Microchip Technology Inc.2026-02-24Yaojian Leng | pending |
| AJINOMOTO BUILD-UP FILM (ABF) BRIDGE FRAMEFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-02-19STEVE NAGEL | pending |
| POWER MODULE WITH SELECTIVE HEAT SPREADERH10W 40/251, H10W 90/10, H10W 74/019, H10W 90/753, H10W 72/527, H10W 72/5445, H10W 72/01515, H10W 74/114, H10W 72/073, H10W 72/07552, H10W 72/07554, H10W 72/5363, H10W 74/121, H10W 40/70, H10W 40/257, H10W 72/075, H10W 70/658, H10W 72/50, H10W 72/534, H10W 72/547, H10W 74/476, H10W 40/778, H10W 90/754, H10W 72/5473, H10W 72/5475, H10W 74/111, H10W 40/03, H10W 74/473, H10W 90/734, H10W 72/5524, H10W 72/5525, H10W 40/255, H10W 72/522, H10W 72/5438Filed as Microchip Technology Incorporated2026-02-17Shesh Mani Pandey | pending |
| POWER MODULE WITH SELECTIVE HEAT SPREADERFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-02-17SHESH MANI PANDEY | pending |
| ASSIGNMENT OF NODE IDENTIFIERS IN A 10BASE-T1S NETWORKH04L 12/40, H04W 84/18, H04L 12/4015, H04L 12/40156, H04L 12/4035, H04L 12/413, H04L 12/417, H04L 41/22, H04L 45/28, H04L2012/40273Filed as Microchip Technology Incorporated2026-02-11Willaim T. Baggett | pending |
| CONNECTIVITY FRAMEWORK HAVING UNIFIED STACK AND MESSAGING PROTOCOL FOR EMBEDDED SECURE CONNECTIVITYH04L 67/55, H04L 67/141, H04W 4/70, H04W 4/80, H04L 67/63, H04L 67/565, H04L 67/562, H04L 51/214, H04L 67/561, H04L 5/0044, H04L 45/745, H04L 63/061, H04L 63/0869, H04L 67/02, H04L 67/10, H04L 67/12, H04L 69/08, H04L 69/18, H04L 69/22Filed as Microchip Technology Incorporated2026-02-10Paolo Trere | pending |
| NON-HARDMASK THIN FILM RESISTOR AND THIN FILM METAL-INSULATOR-METAL CAPACITOR WITH DIELECTRIC UNIFORMITY FOR ALUMINUM BACKEND PROCESSESH10D 84/206, H10D 84/811, H10D 1/68, H10D 1/47, H10D 1/021, H10D 1/474, H10D 1/043, H10W 20/43, H10W 20/498Filed as Microchip Technology Inc.2026-02-10Howard Simon | pending |
| COMPENSATING FOR DELAY MISMATCH BETWEEN DELAY STAGES OF A DELAY-LOCKED LOOPFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-02-03PRANAY PRABHAT | pending |
| HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR MANUFACTURING SAMEFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-02-03SHESH MANI PANDEY | pending |
| SCHOTTKY BARRIER DIODE STRUCTUREFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-01-31SHESH MANI PANDEY | pending |
| ADDRESSING AND ROUTING FOR DEVICES USING CONNECTIVITY FRAMEWORK FOR EMBEDDED CONNECTIVITYH04L 67/55, H04L 67/141, H04W 4/70, H04W 4/80, H04L 67/63, H04L 67/565, H04L 67/562, H04L 51/214, H04L 67/561, H04L 5/0044, H04L 45/745, H04L 63/061, H04L 63/0869, H04L 67/02, H04L 67/10, H04L 67/12, H04L 69/08, H04L 69/18, H04L 69/22Filed as Microchip Technology Incorporated2026-01-30Paolo Trere | pending |
| DEVICE AND METHOD FOR ROBOTIC PREDICTIVE MAINTENANCE DIAGNOSTICS, AND COMPONENT REPLACEMENTFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-01-22STEVE NAGEL | pending |
| DEVICE AND METHOD FOR ROBOTIC PREDICTIVE MAINTENANCEFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-01-22STEVE NAGEL | pending |
| HIGH PERFORMANCE SCHOTTKY BARRIER DIODE STRUCTUREH10D 8/60, H10D 62/106, H10D 8/051, H10D 62/128, H10D 62/8325, H10D 64/64, H10D 62/124, H10D 64/0121Filed as Microchip Technology Incorporated2026-01-21Yogesh Kumar Sharma | pending |
| HIGH PERFORMANCE SCHOTTKY BARRIER DIODE STRUCTUREFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-01-21YOGESH KUMAR SHARMA | pending |
| AJINOMOTO BUILD-UP FILM (ABF) BRIDGE FRAMEG02B 6/4268, G02B 6/4245, G02B 6/4278Filed as Microchip Technology Incorporated2026-01-21Steve Nagel | pending |
| HIGH PERFORMANCE SCHOTTKY BARRIER DIODEH10D 8/60, H10D 62/106, H10D 8/051, H10D 62/128, H10D 62/8325, H10D 64/64, H10D 62/124, H10D 64/0121Filed as Microchip Technology Incorporated2026-01-21Shesh Mani Pandey | pending |
| HIGH PERFORMANCE SCHOTTKY BARRIER DIODEFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-01-21SHESH MANI PANDEY | pending |
| HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR MANUFACTURING SAMEFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-01-20SHESH MANI PANDEY | pending |
| SYSTEM AND METHOD FOR DETECTING DEVIATIONS IN HARDWARE TIMERSFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-01-20DANIEL COSTIN | pending |
| ELECTRONIC OBJECT INSIDE WASHING MACHINE DRUM DETECTION SYSTEMFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-01-20TIK MAN LEE | pending |
| METHOD AND APPARATUS FOR POWER-PERFORMANCE-AREA (PPA) ENHANCED RANDOM ERROR CORRECTION IN REED-SOLOMON (RS) CODESFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-01-16DIEGO COELHO | pending |
| CONTROLLING POWER STATES OF INDUCTIVE SENSOR CIRCUIT UTILIZING CAPACITIVE SENSOR CIRCUITG01D 5/20, G01D 5/2053, G01D 5/241, H01M 10/4264Filed as Microchip Technology Inc.2026-01-16Miguel Lomeli | pending |
| ENHANCED PCI EXPRESS (PCIE) FORWARD ERROR CORRECTION (FEC)Filed as MICROCHIP TECHNOLOGY INCORPORATED2026-01-16PETER GRAUMANN | pending |
| SEMICONDUCTOR DEVICE HAVING INTEGRATED PLANAR MOSFETS AND AN INTEGRATED TRENCH SCHOTTKY BARRIER DIODEFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-01-12SHESH MANI PANDEY | pending |
| MICROCONTROLLER WITH ERROR INJECTION CIRCUITRY AND METHOD OF USING SAMEFiled as MICROCHIP TECHNOLOGY INCORPORATED2026-01-09KJETIL KIRKHOLT | pending |
| HYPER-INTEGRATED DATA DEVICES WITH RADIATION TOLERANCEC08K 3/08, G05B 19/4099, H10W 74/114, H10W 74/121, H10W 74/473, H10W 42/20, C08K 3/36, C08K 9/02, G05B2219/45031Filed as Microchip Technology Inc.2026-01-08Nian Yang | pending |
| METHOD AND APPARATUS FOR LIMITING RE-RUSH CURRENT IN A POWER SUPPLY UNIT (PSU) USING A BATTERY BACKUP UNIT (BBU)Filed as MICROCHIP TECHNOLOGY INCORPORATED2026-01-06JONGWAN KIM | pending |
| METHOD AND APPARATUS FOR LIMITING RE-RUSH CURRENT IN A POWER SUPPLY UNIT (PSU) USING A BATTERY BACKUP UNIT (BBU)G06F 1/305, H02M 1/007, H02M 3/33573, H02M 1/4283, H02J 9/061, H02M 1/10, H02M 1/36, H02M 1/4225, H02M 1/4233, H02M 3/158, H02M 3/33584Filed as Microchip Technology Incorporated2026-01-05Jongwan Kim | pending |
| INTEGRATED SBD IN A TRENCH OF A TRENCH MOSFETFiled as MICROCHIP TECHNOLOGY INCORPORATED2025-12-31SHESH MANI PANDEY | pending |
| POWER FET WITH FAIL-OPEN SAFETY FEATUREH10D 30/66, H10D 89/911, H10D 89/931, H10D 30/0415, H10D 30/668, H10D 64/689Filed as Microchip Technology Incorporated2025-12-30Andrei Bucsa | pending |
| RUGGED PLANAR MOSFET WITH INTEGRATED TRENCH SBDH10D 8/60, H10D 84/146, H10D 84/0109, H10D 30/662Filed as Microchip Technology Incorporated2025-12-17Shesh Mani Pandey | pending |
| RUGGED PLANAR MOSFET WITH INTEGRATED TRENCH SBDFiled as MICROCHIP TECHNOLOGY INCORPORATED2025-12-17SHESH MANI PANDEY | pending |
Filings are matched to the company by applicant name, so a subsidiary filing under its own name is only here if that name resolves to this company. The applicant is printed as filed, which makes a wrong match visible. A patent is not a product: most applications are never granted, and most grants are never built.
More on MCHP
Company overviewEverything on MCHP in one place, with the price.SEC filingsWhat MCHP's 8-Ks say happened: results, departures, auditor changes.Insider tradingWhat MCHP's own officers and directors buy and sell.Who owns itEvery manager reporting a position in MCHP.Funds holding itWhich funds and ETFs hold MCHP, and how big a bet.LobbyingWhat MCHP spends lobbying Congress, and on what.Who lobbies for itThe lobbyists on MCHP's account, and who they worked for.Federal contractsWhat federal agencies pay MCHP.