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Intel Corp Patents
What Intel Corp has filed at the patent office — applications as well as grants, because a filing is on the record eighteen months before anyone has to say what it was for.
INTC on carbonthat →Filings on file
85
Granted
0
Still pending
85
Filed under
6 names
85 filings
Newest filing first. A pending application has no patent number yet, and most never get one.
| Invention | Patent |
|---|---|
| MULTILAYER BACK PLATE WITH MOLDED CERAMIC LAYERH10W 40/10, H05K 7/20509, H10W 40/625, H10W 40/60, H10W 40/611, H10W 42/121, H05K 1/0203, H05K 1/18, H05K 3/0067, H05K2201/066, H05K2201/10545Filed as Intel Corporation2026-06-23Phil GENG | pending |
| MICROELECTRONIC ASSEMBLIESH10W 90/00, H10W 72/01225, H10W 72/877, H10W 74/019, H10W 72/07253, H10W 72/07338, H10W 80/334, H10W 90/701, H10W 90/732, H10W 70/099, H10W 70/685, H10W 72/354, H10P 72/743, H10W 74/15, H10W 72/07307, H10W 72/241, H10W 72/2528, H10W 72/944, H10W 72/072, H10W 72/07236, H10W 40/70, H10W 72/07252, H10W 80/721, H10W 70/095, H10W 72/237, H10W 72/325, H10W 70/635, H10W 70/65, H10W 70/695, H10W 72/9445, H10W 72/07232, H10W 74/142, H10W 72/07254, H10W 72/07255, H10W 72/07332, H10W 80/312, H10W 72/20, H10W 90/794, H10W 70/682, H10W 80/211, H10W 80/333, H10W 90/22, H10W 90/297, H10W 90/401, H10W 90/724, H10W 72/29, H10W 72/327, H10W 70/614, H10W 72/347, H10P 72/74, H10W 72/874, H10W 72/926, H10W 72/07207, H10W 72/07352, H10W 72/07354, H10W 80/743, H10W 72/247, H10W 70/68, H10W 72/59, H10P 72/7424, H10W 72/9415, H10W 40/22, H10W 80/327, H10W 72/228, H10W 90/288, H10W 90/722, H10W 90/734, H10W 90/792, H10W 72/01235, H10W 72/074, H10W 72/227, H10W 90/736, H10W 72/257, H10W 70/611Filed as Intel Corporation2026-06-18Shawna M. Liff | pending |
| DIRECT BONDING IN MICROELECTRONIC ASSEMBLIESH10W 90/701, H10W 70/611, H10W 70/685, H10W 72/884, H10W 74/15, H10W 72/932, H10W 72/944, H10W 80/00, H10W 90/00, H10W 70/63, H10W 70/635, H10W 70/65, H10W 72/9445, H10W 74/142, H10W 80/312, H10W 90/20, H10W 90/794, H10W 70/682, H10W 72/50, H10W 72/0198, H10W 90/22, H10W 90/297, H10W 90/401, H10W 90/724, H10W 90/754, H10W 72/926, H10W 72/941, H10W 80/743, H10W 70/68, H10W 72/936, H10W 40/22, H10W 80/327, H10W 90/288, H10W 90/734, H10W 90/792Filed as Intel Foundry LP LLC2026-06-16Aleksandar Aleksov | pending |
| TECHNIQUES FOR ARTIFICIAL INTELLIGENCE CAPABILITIES AT A NETWORK SWITCHH04L 41/16, G06N 20/20, H04L 41/344, G06N 3/0495, G06N 3/047, G06N 3/045, G06N 3/0464, G06N 3/044, G06N 5/01, G06N 3/0442, G06F 8/60, G06N 3/105, G06N 5/04, H04L 41/0816, H04L 41/5012, H04L 41/5019, H04L 41/5051Filed as Intel Corporation2026-06-15Francesc GUIM BERNAT | pending |
| SINGLE LAYER AND MULTILAYER MAGNETIC INDUCTORS BETWEEN SUBSTRATE CORESH10W 70/685, H10W 44/501, H10D 1/20, H10W 90/701, H10W 70/635, H10W 20/497, H10W 70/692, H01F 17/0013, H01F 27/2804, H01F2017/0066, H01F2017/008, H01F2017/0086, H05K 1/0221, H05K 1/0306, H05K 1/165Filed as Intel Foundry IP LLC2026-06-12Jianyong XIE | pending |
| EMBEDDED MEMORY FOR GLASS CORE PACKAGESH10W 72/851, H10W 70/692, H10B 80/00, H10W 90/701, H10W 74/15, H10W 90/00, H10W 70/635, H10W 72/20, H10W 90/401, H10W 90/724, H10W 72/30, H10W 90/734, H10W 70/611, G06F 12/0811, G06F 12/0897Filed as Intel Foundry IP LLC2026-06-11Mohammad Mamunur RAHMAN | pending |
| TECHNOLOGIES FOR COORDINATING DISAGGREGATED ACCELERATOR DEVICE RESOURCESH04L 41/0895, G06F 9/5005, H04L 41/40, H04L 47/83, G06F 8/65, G06F 9/4881, G06F 9/5038, G06F 9/5044, G06F 9/505, G06F 9/5083, G06F 11/0709, G06F 11/3006, G06F 11/3079, G06F 11/3409, G06F 13/1652, G06F 13/4022, G06F 13/4027, G06F 15/161, G06F 21/44, G06F 21/57, G06F 21/70, G06F 21/73, H03K 19/1731, H04L 41/0816, H04L 41/0853, H04L 41/12, H04L 47/78, H04L 67/10, H05K 7/1492Filed as Intel Corporation2026-06-10Francesc Guim Bernat | pending |
| TRANSISTOR BACKSIDE ROUTING LAYERS WITH CONTACTS HAVING VARYING DEPTHSH10D 84/0186, H10D 64/251, H10D 84/85, H10D 30/6757, H10D 64/01, H10D 62/121, H10D 30/6735, H10D 64/62, H10D 84/038, H10D 30/0198, B82Y 10/00Filed as Intel Foundry IP LLC2026-06-09Shaun MILLS | pending |
| DECOMPOSING A DECONVOLUTION INTO MULTIPLE CONVOLUTIONSG06N 3/0464, G06N 3/08, G06N 20/00, G06F 40/35, G06F 40/40, G06F 40/30, G06N 3/09, G06N 3/042, G06N 3/094, G06N 3/048, G06N 3/045, G06N 3/0442, G06N 3/0475, G06F 17/15, G06F 17/153, G06N 3/063, G06N 3/084Filed as Intel Products IP LLC2026-06-08Alessandro Palla | pending |
| DEVICE VIRTUALIZATION TECHNIQUESG06F 13/26, G06F 13/4221, G06F2213/0024Filed as Intel Corporation2026-06-08Filip SCHMOLE | pending |
| PATCH PACKAGING ARCHITECTURE IMPLEMENTING HYBRID BONDS AND SELF-ALIGNED TEMPLATEH10W 70/685, H10W 70/611, H10W 90/701, H10W 74/114, H10W 80/00, H10W 90/00, H10W 70/095, H10W 72/20, H10W 90/794, H10W 70/69, H10W 90/401, H10P 72/74, H10W 70/05, H10P 72/7424, H10W 70/692, H10W 74/117Filed as Intel Foundry IP LLC2026-06-05Jeremy Ecton | pending |
| MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMSH10W 74/117, H01Q 9/0414, H10W 72/877, H10W 74/10, H10W 70/685, H10W 44/20, H10W 70/63, H10W 74/142, H10W 44/241, H10W 90/401, H10W 90/724, H10W 20/423, H10W 44/248, H10W 74/111, H10W 40/22, H10W 42/20, H10W 70/421, H10W 74/016, H01Q 1/2283, H01Q 1/241, H01Q 1/526, H01Q 19/22Filed as Intel Foundry IP LLC2026-06-05Feras EID | pending |
| MEASUREMENT REPORTING DELAY FOR PRE-CONFIGURED MEASUREMENT GAPSH04W 24/10, H04W 24/08, H04W 36/0088Filed as Intel Corporation2026-06-05Rui Huang | pending |
| MICROPHONE CHANNEL SELF-NOISE SILENCINGH04R 3/04, H04R2410/03Filed as Intel Products IP LLC2026-06-04Adam Kupryjanow | pending |
| METHODS AND APPARATUS FOR MEMORY DEVICES AND MEMORY CONTROLLERSG06F 3/0659, G06F 3/0604, G06F 3/0679Filed as Intel Products IP LLC2026-06-04Saravanan SETHURAMAN | pending |
| 8-BIT FLOATING POINT COMPARISON INSTRUCTIONSG06F 9/30021, G06F 9/30036, G06F 9/30094Filed as Intel Products IP LLC2026-06-03Alexander Heinecke | pending |
| APPARATUS AND METHOD FOR ADDRESS PRE-TRANSLATION TO ENHANCE DIRECT MEMORY ACCESS BY HARDWARE SUBSYSTEMSG06F 12/1081, G06F 12/1036, G06F2212/1024, G06F2212/151, G06F2212/507, G06F2212/651, G06F2212/657Filed as Intel Products IP LLC2026-06-02Kaijie GUO | pending |
| INTEGRATED CIRCUIT STRUCTURE WITH RECESSED TRENCH CONTACT AND DEEP BOUNDARY VIAH10D 30/6729, H10W 20/20, H10D 30/6757, H10D 62/121, H10D 30/501, H10D 84/834, H10W 20/40, H10W 20/481, H10W 20/0698, H10W 20/427, H10W 20/435Filed as Intel Foundry IP LLC2026-06-01Tao CHU | pending |
| VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGESH10W 90/701, H10W 70/65, H10W 90/401, H10W 70/685, H10W 70/688, H10W 74/15, H10W 70/40, H10W 72/00, H10W 72/20, H10W 72/0198, H10W 90/724, H10W 70/611, H10W 70/66, B23K 3/0623Filed as Intel Foundry IP LLC2026-05-29Xiao LU | pending |
| SCALABLE SOFTWARE-DEFINED VEHICLE PLATFORM MANAGEMENT AND FUNCTIONSB60R 16/03, G06F 1/3203, B60R 16/0231, G07C 5/008Filed as Intel Products IP LLC2026-05-27Donald Raymond Gignac | pending |
| OFFLOADING VIDEO CODING PROCESSES TO HARDWARE FOR BETTER DENSITY-QUALITY TRADEOFFSH04N 19/114, H04N 19/127, H04N 19/42, H04N 19/154, H04N 19/156, H04N 19/164, H04N 19/17, H04N 19/172, H04N 19/174, H04N 19/176, H04N 19/177, H04N 19/184, H04N 19/186, H04N 19/192, H04N 19/31, H04N 19/51, H04N 19/82, H04N 19/91Filed as Intel Products IP LLC2026-05-27Brinda Ganesh | pending |
| THREE-DIMENSIONAL (3D) NAND COMPONENT WITH CONTROL CIRCUITRY ACROSS MULTIPLE WAFERSH10W 90/00, H10B 43/50, H10B 43/40, H10B 43/27, H10W 80/00, H10W 72/90, H10W 80/312, H10W 99/00, H10W 80/327, H10W 90/792Filed as Intel NDTM US LLC2026-05-26Khaled HASNAT | pending |
| NON-EPITAXIAL ELECTRICAL COUPLING BETWEEN A FRONT SIDE TRENCH CONNECTOR AND BACK SIDE CONTACTS OF A TRANSISTORH10D 30/6215, H10W 20/021, H10D 84/0158, H10D 84/834, H10D 84/038, H10W 20/40, H10W 20/084, H10W 20/20, H10W 20/0698Filed as Intel Foundry IP LLC2026-05-26Shaun MILLS | pending |
| MODULATION OF SOURCE VOLTAGE IN NAND-FLASH ARRAY READG11C 16/08, G11C 16/26, G11C 8/08, G11C 16/0483, G11C 16/10, G11C 16/24, G11C 16/30, G11C 16/3427Filed as Intel NDTM US LLC2026-05-26Narayanan RAMANAN | pending |
| TETHERED TRAJECTORY GENERATION FOR ROBOTSB25J 9/1666, B25J 9/161, B25J 9/1651, B25J 9/1676Filed as Intel Products IP LLC2026-05-26Rodrigo Aldana Lopez | pending |
| ENERGY EFFICIENCY FOR INFERENCING WORKLOADSG06N 5/046, G06F 1/28Filed as Intel Products IP LLC2026-05-22Christopher Michael MACNAMARA | pending |
| INTEGRATED CIRCUITS WITH SELF-ALIGNED TUB ARCHITECTUREH10D 30/019, H10D 84/0188, H10D 30/83, H10D 62/121, H10D 64/017, H10D 30/501, H10D 84/83135, H10D 30/801, H10D 30/721, H10D 84/038, H10D 84/0177, H10D 84/851, B82Y 10/00Filed as Intel Foundry IP LLC2026-05-22Dan S. LAVRIC | pending |
| SYSTEMS, METHODS, AND APPARATUSES FOR TILE TRANSPOSEG06F 9/3001, G06F 9/30036, G06F 9/30038, G06F 7/485, G06F 7/4876, G06F 7/5443, G06F 7/762, G06F 9/30014, G06F 9/30032, G06F 9/30043, G06F 9/30109, G06F 9/30112, G06F 9/30134, G06F 9/30145, G06F 9/30149, G06F 9/3016, G06F 9/30185, G06F 9/30196, G06F 9/3818, G06F 9/3836, G06F 9/3861, G06F 12/0207, G06F 17/16, G06F2212/454, G06F2212/455Filed as Intel Products IP LLC2026-05-21Robert VALENTINE | pending |
| METHODS AND ARRANGEMENTS FOR ENCRYPTION OF GROUP ADDRESSED MANAGEMENT FRAMESH04L 9/0825, H04L 9/0833, H04W 12/037, H04W 12/0433, H04L 9/0637, H04L 9/14, H04L 63/065, H04L2209/80, H04L2463/062, H04W 84/12, H04W 88/06, H04W 88/10Filed as Intel Corporation2026-05-21Po-Kai Huang | pending |
| LOWER DEVICE ACCESS IN STACKED TRANSISTOR DEVICESH10D 84/853, H10D 88/00, H10D 84/0186, H10D 30/6757, H10D 64/258, H10D 62/121, H10D 30/019, H10D 30/501, H10D 62/151, H10D 84/832, H10D 30/6735, H10D 88/01, H10D 64/254, H10D 84/038, H10D 84/0149, H10W 20/20, B82Y 10/00Filed as Intel Foundry IP LLC2026-05-18Cheng-Ying Huang | pending |
| NETWORK RESOURCE MONITORINGH04L 43/0882, H04L 47/193, H04L 43/0817, H04L 47/115, H04L 47/26, H04L 47/263, H04L 47/283, H04L 47/29Filed as Intel Corporation2026-05-14Junggun LEE | pending |
| PARALLAX ENGINE FOR AUTO-FRAMING OVER REPLACED BACKGROUNDSG06T 3/40, G06T 5/50, G06T 7/194, G06T 7/11, G06T2207/20221Filed as Intel Products IP LLC2026-05-13Rony Zatzarinni | pending |
| PERSISTENT DATA STRUCTURE TO TRACK AND MANAGE SSD DEFECTSG06F 11/2094, G11C 29/76, G06F 16/2237, G06F 16/11, G06F 1/30, G06F 11/1072, G06F 11/1666, G06F2201/85, G11C 29/4401, G11C2029/1202Filed as Intel NDTM US LLC2026-05-12Naveen Vittal PRABHU | pending |
| CONDITIONAL KERNEL PREDICTION NETWORK AND ADAPTIVE DEPTH PREDICTION FOR IMAGE AND VIDEO PROCESSINGG06T 5/70, G06N 20/10, G06T 5/60, G06N 3/08, G06T2207/10004, G06T2207/20012, G06T2207/20024, G06T2207/20081, G06T2207/20084Filed as Intel Products IP LLC2026-05-11Anbang Yao | pending |
| SUBFINS REPLACED USING BACKSIDE DIELECTRIC FORMATIONH10D 62/121, H10D 64/017, H10D 30/6757, H10D 30/6735Filed as Intel Foundry IP LLC2026-05-11Giorgio Mariottini | pending |
| DEVICE, METHOD AND SYSTEM FOR EXECUTING A TILE LOAD AND EXPAND INSTRUCTIONG06F 9/30038, G06F 9/30145, G06F 9/30032, G06F 9/30043, G06F 9/30047, G06F 9/30178, G06F 9/3887, G06N 3/04Filed as Intel Corporation2026-05-11Menachem Adelman | pending |
| LEARNING-BASED TECHNIQUES FOR AUTONOMOUS AGENT TASK ALLOCATIONB25J 9/0084, G05B 19/41895, G06N 3/09, G06N 3/0499, B25J 5/007, B25J 9/1664, B25J 9/1676, B25J 9/1682, G05B 19/418, G05B2219/33056, G05B2219/39117, G05B2219/40518, G06F 9/50, G06N 3/008Filed as Intel Products IP LLC2026-05-11Venkataraman Natarajan | pending |
| INTEGRATED CIRCUIT STRUCTURES HAVING UNIFORM GRID METAL GATE AND TRENCH CONTACT PLUGH10D 84/83, H10D 84/0149, H10D 84/0151, H10D 62/121, H10D 62/364, H10D 30/019, H10D 64/017, H10D 84/0135, H10D 64/519, H10D 30/501, H10D 84/8311, H10D 62/151, H10D 64/518, H10D 84/832, H10D 64/251, H10D 84/038, H10D 84/0153, B82Y 10/00Filed as Intel Foundry IP LLC2026-05-11Leonard P. GULER | pending |
| PREFETCH TO LAST LEVEL CACHE INTERCONNECT SEMANTICG06F 12/0897, G06F 12/063, G06F 12/0862Filed as Intel Products IP LLC2026-05-08Ashwani KUMAR | pending |
| CONDUCTIVE VIA STRUCTURES FOR GATE CONTACT OR TRENCH CONTACTH10D 64/512, H10W 20/20, H10W 20/42, H10D 30/014, H10D 84/0186, H10D 30/6757, H10D 62/121, H10D 84/0147, H10D 64/018, H10D 30/019, H10D 64/017, H10D 62/118, H10D 30/501, H10D 84/0184, H10D 84/832, H10D 30/6735, H10D 30/43, H10D 30/031, H10D 84/0149, H10W 20/40, H10W 20/069, H10W 70/65, H10W 20/081, H10W 20/0698, H10W 20/083, H10P 14/3462, H10W 70/611Filed as Intel Foundry IP LLC2026-05-08Leonard P. GULER | pending |
| FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING PRE-SPACER-DEPOSITION WIDE CUT GATESH10D 84/0147, H10D 30/6735, H10D 30/6211, H10D 62/116, H10D 62/121, H10D 30/019, H10D 84/0135, H10D 84/853, H10D 30/501, H10D 84/832, H10D 30/6219, H10D 84/038, H10D 84/0153, H10D 84/0149, B82Y 10/00Filed as Intel Foundry IP LLC2026-05-07Leonard P. GULER | pending |
| REMOTE DIRECT MEMORY ACCESS (RDMA) SUPPORT IN CELLULAR NETWORKSH04L 67/1097, H04W 28/0284, H04W 4/029, H04W 28/0263, H04W 28/0268Filed as Intel Corporation2026-05-07Sangeetha L. BANGOLAE | pending |
| SINGLE-DCI-BASED PHYSICAL UPLINK SHARED CHANNEL (PUSCH) TRANSMISSION SCHEDULINGH04W 72/232, H04L 1/189, H04W 72/23, H04B 7/024, H04B 7/0456, H04B 7/0639, H04B 7/0697, H04L 1/06, H04L2001/0093, H04W 72/046, H04W 72/1268Filed as Intel Corporation2026-05-07Alexei Davydov | pending |
| INTEGRATED CIRCUIT STRUCTURES HAVING GATE CUT PLUG REMOVED FROM TRENCH CONTACT USING ANGLED DIRECTIONAL ETCHH10D 64/017, H10D 84/834, H10D 30/6757, H10D 62/121, H10D 30/501, H10D 64/021, H10D 62/151, H10D 84/832, H10D 30/6735Filed as Intel Founday IP LLC2026-05-05Leonard P. GULER | pending |
| INTEGRATED OPTICAL FIBER SHUFFLE HARNESS FOR SWITCH AND COMPUTE TRAYSG02B 6/44528, G02B 6/44526, G02B 6/44715, G02B 6/3878, G02B 6/3885, G02B 6/3897, G02B 6/4257, G02B 6/4261, G02B 6/43, G02B 6/4446, G02B 6/4472, H05K 7/1489, H05K 7/1492Filed as Intel Products IP LLC2026-05-04Josh COLLIER | pending |
| SELF-ALIGNMENT OF GLASS CORE HALVES USING PROTRUDED BUMPSH10W 70/635, H10W 46/00, H10W 70/685, H10W 46/301, H10W 46/607, H10W 70/095, H10W 70/65, H10W 90/401, H10W 90/724, H10W 70/692Filed as Intel Foundry IP LLC2026-05-04Brandon C. MARIN | pending |
| CODE SEGMENT VALIDATIONG06F 21/566, G06F 13/28, G06F 21/602Filed as Intel Products IP LLC2026-05-04Deepak MOHAN | pending |
| CHANNEL STATE INFORMATION (CSI) PROCESSING CONFIGURATIONSH04B 7/0626, H04L 5/0042, H04L 5/0053, H04L 5/0057, H04L 5/0094, H04W 72/02Filed as Intel Corporation2026-05-01Viktor Sergeev | pending |
| DCI TRIGGERED HARQ-ACK CODEBOOK RETRANSMISSIONH04L 1/1854, H04L 5/0055, H04L 1/1896, H04L 5/0044, H04L 5/0048, H04L 5/0053Filed as Intel Corporation2026-05-01Yi Wang | pending |
| GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEPOPULATED CHANNEL STRUCTURES USING DIRECTED BOTTOM-UP APPROACHH10D 30/6735, H10D 84/0128, H10D 30/014, H10D 30/6757, H10D 64/258, H10D 84/013, H10D 64/01, H10D 62/121, H10D 62/364, H10D 30/501, H10D 84/8311, H10D 62/151, H10D 84/832, H10D 30/43, H10D 84/038, H10D 84/83, H10D 84/8312, H10D 30/0198, B82Y 10/00Filed as Intel Foundry IP LLC2026-05-01Leonard P. GULER | pending |
| EPI BARRIER ALIGNED BACKSIDE CONTACTH10D 62/121, H10D 64/017, H10D 62/151, H10D 30/6757, H10D 30/0321, H10D 62/364, H10D 30/6745, H10D 30/019, H10D 30/501, H10D 62/822, H10D 30/6713, H10D 30/6735, H10D 64/254, H10D 84/038, H10D 30/6729, H10D 84/0149, H10D 30/0198, B82Y 10/00Filed as Intel Foundry IP LLC2026-04-30Leonard P. GULER | pending |
| INTEGRATED CIRCUIT STRUCTURES WITH TRENCH CONTACT DEPOPULATION STRUCTUREH10D 62/151, H10D 84/0153, H10D 62/116, H10D 62/121, H10D 30/501, H10D 84/832Filed as Intel Foundry IP LLC2026-04-29Leonard P. GULER | pending |
| INTEGRATED CIRCUIT STRUCTURES HAVING GATE CUT PLUG REMOVED FROM TRENCH CONTACTH10D 62/151, H10D 30/6735, H10D 30/6757, H10D 62/121, H10D 30/019, H10D 30/501, H10D 84/834, H10D 84/832, H10D 30/6213Filed as Intel Foundry IP LLC2026-04-27Leonard P. GULER | pending |
| UNIDIRECTIONAL COMMAND BUS PHASE DRIFT COMPENSATION BY SENDING THE COMMAND BUS DELAY TO MEMORY CONTROLLERG06F 13/1689, G06F 13/4234, Y02D 10/00, G06F 13/4009, G11C 7/109, G11C 7/1093, G11C 11/4076, G11C 11/4093, G11C2207/2254, H03K 19/017509Filed as Intel Corporation2026-04-27James A. McCALL | pending |
| INTEGRATED CIRCUIT STRUCTURE WITH FRONT SIDE SIGNAL LINES AND BACKSIDE POWER DELIVERYH10D 84/834, H10D 89/10, H10W 20/427, H10W 20/435, G06F 30/392, G06F2115/02, H10D 84/80, H10D 84/979, H10D 30/62, H10D 62/121, H10D 84/981, H10D 30/501, H10D 84/907, H10D 30/6219, H10D 62/119, H10D 84/975, H10D 84/83, H10W 20/40, H10W 20/481, H10W 72/00, H10W 20/0698, H10W 20/42, B82Y 10/00Filed as Intel Foundry IP LLC2026-04-24Quan SHI | pending |
| TRACKING CRC (CYCLIC REDUNDANCY CHECK) ERRORS PER MEMORY WRITE TRANSACTIONG06F 11/1004, G06F 11/073, G06F 11/0772Filed as Intel Products IP LLC2026-04-20Christopher P. MOZAK | pending |
| USB-C WIRELESS WIDE AREA NETWORK DONGLEG06F 1/3206, G06F 13/4282, G06F 1/26, G06F 1/266, G06F 1/3278, G06F 1/3296, G06F 9/4411, G06F2213/0042Filed as Intel Corporation2026-04-20Arvind Sundaram | pending |
| METHOD TO IMPLEMENT HALF WIDTH MODES IN DRAM AND DOUBLING OF BANK RESOURCESG11C 11/4076, G11C 11/4096, Y02D 10/00, G11C 5/04, G11C 11/406Filed as Intel Products IP LLC2026-04-20Kuljit S. Bains | pending |
| METHOD AND APPARATUS TO RESET COMPONENTS IN A SIDEBAND BUS INTERFACE IN A MEMORY MODULEG06F 13/1673, G06F 13/4282Filed as Intel Products IP LLC2026-04-20George Vergis | pending |
| INTEGRATED CIRCUIT STRUCTURES WITH GATE VOLUME REDUCTIONH10D 62/364, H10D 30/6735, H10D 30/014, H10D 64/01, H10D 62/121, H10D 30/019, H10D 30/501, H10D 62/151, H10D 30/43Filed as Intel Corporation2026-04-20Leonard P. GULER | pending |
| MEMORY MODULES AND SOCKETSH05K 1/117, H05K2201/09063, H05K2201/09409, H05K2201/10159Filed as Intel Products IP LLC2026-04-20Xiang Li | pending |
| INFRASTRUCTURE AS CODE DEPLOYMENT MECHANISMG06F 9/44505, G06F 9/505, G06F 9/4411, G06F 9/5072, G06F 9/5077, G06F 21/57Filed as Intel Products IP LLC2026-04-20Alpa Choksi | pending |
| TECHNIQUES FOR A MEMORY MODULE PER ROW ACTIVATE COUNTERG06F 21/566, G06F 21/554, G06F2221/034Filed as Intel Products IP LLC2026-04-20George Vergis | pending |
| CONDUCTIVE VIA BAR SELF-ALIGNED TO GATE ENDH10D 64/258, H10W 20/069, H10D 62/121, H10D 62/126, H10D 30/019, H10D 62/118, H10D 30/501, H10D 84/832, H10D 30/6735, H10D 84/038, H10D 84/83, H10D 84/0149, H10W 20/023, B82Y 10/00Filed as Intel Corporation2026-04-17Leonard P. GULER | pending |
| FEEDBACK IN MULTI-STATION BLOCK ACKNOWLEDGEMENT FRAMESH04B 7/0417, H04L 5/0055, H04L 1/18, H04W 72/121, H04W 84/12Filed as Intel Corporation2026-04-15Laurent Cariou | pending |
| USAGE SCENARIO BASED MONITORING AND ADJUSTMENTG06F 1/3206, Y02D 10/00, G06F 1/206, G06F 1/324, G06F 9/5083, G06F 15/76, G06F 15/7807, G06F2015/761Filed as Intel Corporation2026-04-14Zhongsheng Wang | pending |
| DYNAMICALLY DIVIDING ACTIVATIONS AND KERNELS FOR IMPROVING MEMORY EFFICIENCYG06N 3/063, G06N 3/084, G06T 1/20, G06N 20/10, G06N 3/0495, G06N 3/047, G06N 3/048, G06N 3/045, G06N 3/0464, G06N 3/044, G06T 5/70, G06F 9/3802, G06F 9/3804, G06F 9/3887, G06F 9/5027, G06N 3/04, G06N 3/08, G06N 3/088, G06N 5/046, G06T2207/20081, G06T2207/20084Filed as Intel Corporation2026-04-10Xiaoming Chen | pending |
| HYBRID IMAGE PROCESSOR AND LATENT DIFFUSION FRAMEWORK USING FLOATING LATENT SPACE PROJECTORSG06T 1/20, G06T 7/246, G06T 11/60, G06T2207/10016, G06T2207/20081, G06T2207/20084, G06T2207/20212Filed as Intel Corporation2026-04-08Noam Levy | pending |
| MECHANISM FOR QUALITY OF SERVICE-RELATED CAPABILITY UPDATE IN WIRELESS COMMUNICATIONSH04W 28/0268, H04W 8/22Filed as Intel Corporation2026-04-08Dibakar DAS | pending |
| METHODS AND APPARATUS TO NEW RADIO BROADCAST RECEPTIONH04L 5/0053, H04W 72/1273, H04W 76/20, H04W 76/40, H04W 72/30, H04W 72/231, H04W 72/23, H04L 1/0061, H04L 5/006, H04L 5/0064, H04W 4/06Filed as Intel Corporation2026-04-07Avik SENGUPTA | pending |
| CAPACITOR DEVICES WITH STRONTIUM TITANATE INSULATOR LAYERSH10D 1/684, H10D 1/694, H10D 1/716, H10D 1/042, H10D 1/696Filed as Intel Corporation2026-04-06Arnab Sen Gupta | pending |
| CRITICAL UPDATE OVERHEAD REDUCTIONH04W 48/08, H04W 84/12Filed as Intel Corporation2026-04-03Laurent Cariou | pending |
| WAFER LEVEL ELECTRON BEAM PROBERG01R 31/307, G01R 1/07342, G01R 31/2886Filed as Intel Corporation2026-04-02Xianghong Tong | pending |
| MSG3 PHYSICAL UPLINK SHARED CHANNEL (PUSCH) REPETITION REQUESTSH04W 74/004, H04W 74/0833, H04W 74/0838, H04W 74/0836, H04L 1/189, H04L 5/001, H04L 5/0053Filed as Intel Corporation2026-03-31Gang Xiong | pending |
| STACKED RANDOM ACCESS MEMORY DEVICES WITH MULTILAYER CONTINUOUS VIASH10W 20/20, G11C 11/005, H10B 12/50, H10B 80/00, H10B 10/18, H10D 89/10, H10W 80/00, H10W 90/00, H10W 90/26, H10W 99/00, H10W 20/023, G11C 5/025, G11C 11/408, G11C 11/4087, G11C 11/412, G11C 11/418Filed as Intel Corporation2026-03-31Abhishek A. Sharma | pending |
| TIME-DOMAIN RESOURCE ALLOCATION FOR TRANSPORT BLOCK OVER MULTIPLE SLOT (TBOMS) TRANSMISSIONSH04L 1/08, H04W 72/0446, H04W 72/23, H04L 5/0042, H04L 5/0044, H04L 5/0048, H04L 5/0091, H04W 72/1268Filed as Intel Corporation2026-03-31Gang Xiong | pending |
| TUNNELING USB2 DATA USING USB4-BASED CONFIGURATIONSG06F 13/4282, G06F2213/0042Filed as Intel Corporation2026-03-31Aruni Nelson | pending |
| ENHANCED MULTIPLEXING OF UPLINK CONTROL INFORMATION WITH DIFFERENT PHYSICAL LAYER PRIORITIESH04W 72/20, H04L 5/0005, H04W 72/563, H04W 72/23, H04L 1/1664, H04L 1/1854, H04L 5/0044, H04L 5/0053, H04L 5/0094Filed as Intel Corporation2026-03-30Toufiqul ISLAM | pending |
| VECTOR DATABASE LOOKUPS AND/OR INFERENCEG06F 16/24542, G06F 16/24552, G06F 16/2237, G06F 16/24539Filed as Intel Corporation2026-03-28Madhur KUMAR | pending |
| ON-CHIP DECOMPRESSION AND SPARSITY DECODEG06F 9/30036, G06F 9/30145, G06F 9/30038, G06F 9/3001, G06F 9/30043, G06F 9/3016, G06F 9/30178, G06F 9/3887Filed as Intel Corporation2026-03-28Ashwani KUMAR | pending |
| MEMORY DEVICE AND A PROCESSOR FOR MEMORY FRESHNESSG06F 12/0897, G06F 12/0831, G06F 12/0891Filed as Intel Corporation2026-03-27Scott CONSTABLE | pending |
| SOURCE-SIDE SYNCHRONIZATION OF FRAME UPDATES FOR DISPLAYSG09G 3/3208, G09G 3/3283, G09G 3/3225, G09G2310/08, G09G2340/0435Filed as Intel Corporation2026-03-27Vishal Ravindra Sinha | pending |
| METHODS AND APPARATUS FOR CHIP SELECTING TECHNIQUESG06F 13/1689, G06F 13/1673, G06F 13/4243Filed as Intel Corporation2026-03-27Arjun KRIPANIDHI | pending |
| MULTI-DIE BRIDGE ASSEMBLIES AND METHODS FOR THREE-DIMENSIONAL PACKAGINGH10W 90/00, H10W 20/20, H10W 90/22, H10W 42/121, H10B 80/00, H10W 70/02, H10W 90/291, H10W 90/701, H10W 90/732, H10W 70/618, H10W 70/685, H10W 74/114, H10W 74/15, H10W 80/301, H10W 90/10, H10W 72/952, H10W 72/072, H10W 70/635, H10W 70/65, H10W 72/20, H10W 20/213, H10W 90/297, H10W 90/401, H10W 90/724, H10W 20/42, H10W 70/692, H10W 90/722, H10W 90/734, H10W 90/792, H10W 20/435, H10W 74/01, H10W 70/611Filed as Intel Corporation2026-03-27Jeremy D. Ecton | pending |
| DIE-TO-DIE ADAPTERG06F 11/1004, G06F 13/4221, G06F 13/4295, G06F 13/385, G06F 13/4291, G06F2213/0026Filed as Intel Corporation2026-03-27Swadesh Choudhary | pending |
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