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Infineon Technologies AG Patents
What Infineon Technologies AG has filed at the patent office — applications as well as grants, because a filing is on the record eighteen months before anyone has to say what it was for.
IFNNY on carbonthat →Filings on file
73
Granted
0
Still pending
73
Filed under
6 names
73 filings
Newest filing first. A pending application has no patent number yet, and most never get one.
| Invention | Patent |
|---|---|
| SCANNING ELECTRON MICROSCOPY-BASED SAMPLE ANALYSISG01N 23/2251, H01J 37/28, H01J 37/265, H01J2237/2801, H01J2237/2802Filed as Infineon Technologies AG2026-06-16Maximilian Alexander MOSER | pending |
| MICRO-SPEAKER DEVICEH04R 1/2811, H04R 17/00, G10K 15/04, H04R 1/025, H04R 3/04, H04R 19/005, H04R 19/02, H04R2201/003, H04R2217/03Filed as Infineon Technologies AG2026-06-16Christian Bretthauer | pending |
| DOUBLE GATE TRANSISTOR DEVICE AND METHOD OF OPERATINGH03K 17/567, H10D 64/256, H10D 30/477, H10D 62/8503, H10D 12/481, H10D 64/117, H10D 30/611, H10D 62/343, H10D 64/513, H10D 62/165, H10D 48/362, H10D 30/668, H10D 30/475, H03K 17/687, H03K2017/6878Filed as Infineon Technologies Austria AG2026-06-15Markus Bina | pending |
| LATERAL COILS USED FOR ENERGY TRANSFER OVER ISOLATION REGION IN MULTIVOLTAGE DEVICESH02J 50/10, H10D 86/80, H10W 20/497, H02J 50/80, H02J 50/40, H02J 50/005, H10D 1/20, H02M 3/33584Filed as Infineon Technologies AG2026-06-12Hermann GRUBER | pending |
| SEMICONDUCTOR ASSEMBLY INCLUDING A SEMICONDUCTOR PACKAGE WITH A DELAMINATION MITIGATION FEATUREH10W 74/016, H10W 74/147, H10W 74/10, H10W 74/134, H10W 70/429, H10W 72/871, H10W 72/884, H10W 72/886, H10W 74/017, H10W 74/127, H10W 20/20, H10W 70/695, H10W 90/756, H10W 74/00, H10W 70/481, H10W 70/614, H10W 74/47, H10W 90/766, H10W 74/111, H10W 90/734, H10W 74/01, H10W 90/736, H05K 1/186, H05K 3/4611Filed as Infineon Technologies Austria AG2026-06-08Bernd Schmoelzer | pending |
| ESD PROTECTION DEVICE WITH REDUCED HARMONIC DISTORTIONH10D 89/611, H10D 89/60, H02H 9/046, H10D 89/911, H10W 44/601, H10W 42/80, H02H 9/04Filed as Infineon Technologies AG2026-05-26Egle Tylaite | pending |
| SEMICONDUCTOR DEVICE INCLUDING LATERAL AND VERTICAL ESD PROTECTION DEVICESH10D 89/611, H10D 89/931, H10D 89/711, H10W 42/60, H02H 9/046Filed as Infineon Technologies AG2026-05-22Egle Tylaite | pending |
| LIGHT DIFFUSER FOR LASER BEAM SCANNING DISPLAYG02B 26/101, G02B 26/105, G02B 27/0101, G02B 3/0056, G02B 27/0961, G02B 27/48, G02B2027/0118Filed as Infineon Technologies AG2026-05-18Boris KIRILLOV | pending |
| SEMICONDUCTOR DEVICEH10N 30/302, B81B 3/0054, B81B 3/007, B81B 3/0078, H10N 30/06, H10N 30/802, H10N 30/308, H10N 30/87, B81B 3/0021, B81B 7/02, B81B2201/0235, B81B2201/0242, B81B2201/025, B81B2201/0257, B81B2201/0264, B81B2201/0285, B81B2201/0292, B81B2203/0109, B81B2203/0127, B81B2203/019, B81B2203/04, B81B2203/053, B81C 1/00158, G01D 11/00, G01D 21/02, G01H 11/00, G01H 11/08, G01L 1/142, G01L 1/16, G01L 1/2293, G01L 9/04, G01L 9/08, G01L 9/12, G01P 15/09, G01P 15/12, G01P 15/125Filed as Infineon Technologies AG2026-05-18Andreas Bogner | pending |
| RADAR-BASED TARGET TRACKERG01S 13/536, G01S 13/726, G01S 7/356, G01S 7/292, G01S 7/295, G01S 7/415, G01S 13/538, G01S 13/584, G01S 13/723Filed as Infineon Technologies AG2026-05-08Abhilash Govinda Kammath | pending |
| TRANSISTOR DEVICE AND METHOD OF OPERATING A TRANSISTOR DEVICEH03K 17/08104, H03K 17/082, H03K 17/0822, H03K 17/08112, H03K 17/08116, H03K 17/567, H03K 17/60, H03K 17/687, H03K 17/6877, H03K2017/6875, H03K2217/0027Filed as Infineon Technologies AG2026-05-08Massimo GRASSO | pending |
| FILTERING ARCHITECTURE WITH MINIMIZED TRANSIENTSH04R 1/08, H04R 3/06, H03M 3/494, H04R 19/04, H04R2201/003Filed as Infineon Technologies AG2026-05-06Dietmar Straeussnigg | pending |
| TRANSISTOR DEVICE AND METHOD FOR FORMING A RECESS FOR A TRENCH GATE ELECTRODEH10D 12/038, H10D 30/0297, H10D 30/025, H10D 12/481, H10D 64/01, H10D 30/63, H10D 64/117, H10D 64/513, H10D 64/021, H10D 62/124, H10D 30/668, H10D 64/013, H10W 20/098, H10W 20/074, H10P 50/642, H10P 50/283Filed as Infineon Technologies Austria AG2026-05-05Thomas Feil | pending |
| SYSTEM AND METHOD FOR ISOLATION RESISTANCE MEASUREMENTG01R 31/389, G01R 27/025, G01R 31/52, G01R 27/18Filed as Infineon Technologies Americas Corp.2026-04-29Mark HEALY | pending |
| CHIP PACKAGES INCLUDING SUBSTRATE INTEGRATED WAVEGUIDESH10W 44/20, H01P 3/121, H10W 90/701, H10P 72/0438, H10W 20/42, H10W 44/216, H10W 90/725, H10W 44/206, H10W 90/755, H01P 3/023, H01P 5/1015, H01P 5/107Filed as Infineon Technologies AG2026-04-23Ernst SELER | pending |
| WAFER, ELECTRONIC COMPONENT AND METHOD USING LASER PENETRATION AFFECTING STRUCTUREH10P 54/00, H10P 34/42, H10W 74/014, H10W 42/20, H10W 42/121Filed as Infineon Technologies AG2026-04-21Gunther MACKH | pending |
| CAPACITIVE COUPLING COMPENSATION FOR DIRECT CURRENT ELECTRODES IN ION TRAPSG21K 1/00, H01J 49/4285, G06N 10/40, H01J 49/422Filed as Infineon Technologies Austria AG2026-04-14Jens Repp | pending |
| MULTI-CHANNEL HIGH ELECTRON MOBILITY TRANSISTOR WITH REDUCED INPUT CAPACITANCEH10D 62/235, H10D 62/149, H10D 62/8503, H10D 30/015, H10D 62/126, H10D 62/343, H10D 64/513, H10D 62/151, H10D 64/411, H10D 64/251, H10D 64/64, H10D 30/4732, H10D 30/475Filed as Infineon Technologies Austria AG2026-04-13Clemens Ostermaier | pending |
| GAS CONCENTRATION SENSOR AND SENSOR CALIBRATION WITHOUT USE OF A TARGET GASG01N 25/18, G01N 33/0006Filed as Infineon Technologies AG2026-04-10Christoph STEINER | pending |
| ELECTRONIC SYSTEM HAVING INTERMETALLIC CONNECTION STRUCTURE WITH CENTRAL INTERMETALLIC MESH STRUCTURE AND MESH-FREE EXTERIOR STRUCTURESH10W 70/417, H10W 70/461, H10W 72/07336, H10W 72/884, H10W 72/073, H10W 72/851, H10W 72/325, H10W 40/10, H10W 72/07332, H10W 72/07355, H10W 90/756, H10W 72/50, H10W 70/481, H10W 72/30, H10W 72/352, H10W 90/736, H10W 72/3528Filed as Infineon Technologies AG2026-04-09Chee Yang NG | pending |
| PRESSURE SENSING DEVICEG01L 9/0047, G01L 9/0072, G01L 13/025, G01L 19/0618, G01L 19/0645Filed as Infineon Technologies Dresden GmbH & Co. KG2026-04-09Marco Haubold | pending |
| METHOD OF PRODUCING A SEMICONDUCTOR DEVICE SEMICONDUCTOR DEVICE HAVING A FIELD TERMINATION STRUCTURE AND A CHARGE BALANCE STRUCTUREH10D 62/111, H10D 30/665, H10D 12/481, H10D 62/126, H10D 62/058, H10D 62/107, H10D 62/127, H10D 62/052, H10D 62/8325, H10D 30/668, H10D 62/393, H10P 30/204, H10P 30/21, H10P 30/22Filed as Infineon Technologies AG2026-04-09Michael Hell | pending |
| SEMICONDUCTOR DEVICE INCLUDING TERMINATION TRENCH STRUCTURE OR SEGMENTH10D 30/665, H10D 64/117, H10D 30/669, H10D 30/668, H10D 30/0297Filed as Infineon Technologies Dresden AG & Co. KG2026-04-06Andreas Meiser | pending |
| SUPERJUNCTION TRANSISTOR DEVICE AND METHODH10D 62/111, H10D 64/117, H10D 62/054, H10D 62/127, H10D 30/665, H10D 30/668, H10D 30/0297Filed as Infineon Technologies Austria AG2026-03-27Christian Fachmann | pending |
| POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAMEH10W 40/235, H10D 80/251, H10W 40/40, H10W 70/658, H10W 40/237, H10W 40/233, H10W 70/05, H10W 70/692, H10W 40/22, H10W 40/226, H10W 40/255, H10W 70/611, H10W 70/66Filed as Infineon Technologies AG2026-03-26Andre Uhlemann | pending |
| METHOD FOR FORMING A SUPERJUNCTION DEVICE AND SUPERJUNCTION DEVICEH10D 62/054, H10D 62/111, H10D 30/668Filed as Infineon Technologies Austria AG2026-03-26Christian Fachmann | pending |
| POWER SEMICONDUCTOR PACKAGE INCLUDING A MOLDED BODY WITH PROTRUSION AND METHOD FOR FABRICATING THE SAMEH10W 70/429, H10W 70/481, H10W 74/10, H10W 70/048, H10W 74/114, H10W 74/127, H10W 70/40, H10W 76/01, H10W 70/424, H10W 74/00, H10W 76/12, H10W 90/766, H10W 74/111, H10W 70/421, H10W 70/466, H10W 74/01Filed as Infineon Technologies AG2026-03-26Arivindran Navaretnasinggam | pending |
| SEMICONDUCTOR MODULE ARRANGEMENTH10W 90/10, H10W 70/611, H10W 70/685, H10W 76/165, H10W 70/65, H10W 72/00, H10W 70/655, H10W 70/658, H10W 90/401, H10W 90/754, H10W 70/68, H10W 70/692, H10W 90/734, H10W 70/652Filed as Infineon Technologies AG2026-03-20Georg Troska | pending |
| FORMING A SUPERJUNCTION DEVICE AND SUPERJUNCTION DEVICEH10D 62/111, H10D 62/054, H10D 30/668Filed as Infineon Technologies Austria AG2026-03-20Armin Willmeroth | pending |
| PRESERVING PRIVACY DURING SECURE TRANSACTIONS WITH AMBIENT POWER DEVICESH04W 12/033, H04W 12/0471, H04W 12/041, H04W 12/02Filed as Infineon Technologies Americas Corp.2026-03-19Hui Luo | pending |
| COOLING SYSTEMH10W 40/22, H05K 1/0203, H10W 40/47, H10W 40/625, H10W 40/60, H10W 40/641, H10W 40/774, H10W 40/228, H10W 40/611, H05K 7/20, H05K 7/20254, H05K 7/20927Filed as Infineon Technologies Austria AG2026-03-19Veljko Palija | pending |
| SEMICONDUCTOR MODULE ARRANGEMENTH10W 90/10, H10W 90/753, H10W 72/823, H10W 72/884, H10W 70/654, H10W 90/735, H10W 90/756, H10W 70/66Filed as Infineon Technologies AG2026-03-19Thomas Raker | pending |
| CURRENT SENSING CIRCUIT AND METHOD FOR SENSING A SOURCE DRAIN CURRENT OF A SWITCH TRANSISTORG01R 31/2621Filed as Infineon Technologies Austria AG2026-03-18Abhishek JAIN | pending |
| THERMAL CONDUCTIVITY SENSITIVITY COMPENSATION WITH SUPPLY VOLTAGEG01N 25/18Filed as Infineon Technologies AG2026-03-17Dan-Alexandru MOCANU | pending |
| APPARATUS AND METHOD FOR DETECTING RADAR INTERFERENCE IN A RADAR SYSTEMG01S 7/023, G01S 7/356Filed as Infineon Technologies AG2026-03-17Abdülkadir Eryildirim | pending |
| POWER SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING A POWER SEMICONDUCTOR DEVICEH10D 62/127, H10D 30/668, H10D 62/106, H10D 64/256, H10D 12/481, H10D 12/038, H10D 62/126, H10D 62/155, H10D 64/117, H10D 64/519, H10D 62/107, H10D 30/665, H10D 64/2527, H10D 64/62, H10D 12/035, H10D 62/145, H10D 30/0295, H10D 62/115, H10D 12/461, H10D 62/393, H10D 64/23, H10D 64/232, H10D 30/0297Filed as Infineon Technologies Dresden AG & Co. KG2026-03-13Thomas Hunger | pending |
| MACHINE-LEARNING MODEL FOR PROCESSING RADAR DATASETS IN MULTIPLE DOMAINSG01S 7/417, G06N 3/0455, G06N 3/0499, G06N 3/045, G06N 3/0464, G06N 3/044, G01S 13/04, G01S 13/34, G01S 13/42, G01S 13/584, G06F 3/017, G06N 3/08, G06N 3/084Filed as Infineon Technologies AG2026-03-12Tobias Sukianto | pending |
| AUTOMATED AI MODEL OPTIMIZATION FOR MICROCONTROLLERSFiled as INFINEON TECHNOLOGIES AMERICAS CORP.2026-03-12LYONS NIALL | pending |
| POWER CONVERTERH02M 1/0095, H02M 5/293, H02M 3/003, H02M 1/0064, H02M 3/33571, H02M 1/0083Filed as Infineon Technologies Austria AG2026-03-11Federico IOB | pending |
| PRE-CHARGE CIRCUIT WITH DIFFERENTIAL INPUTS AND OUTPUTSG11C 27/026, H02M 3/07, H02M 1/0006, H02M 1/0012, G11C 27/02, G11C 27/024, H03H 1/0007, H03H 1/02, H03M 1/00, H03M 1/06, H03M 1/12Filed as Infineon Technologies AG2026-03-11Peter Bogner | pending |
| AUTOMATED AI MODEL OPTIMIZATION FOR MICROCONTROLLERSG06N 3/063, G06N 3/082, G06N 20/00, G06N 3/0985, G06N 3/0495, G06N 3/09, G06N 3/048, G06N 3/045, G06N 3/0464, G06N 3/044, G06N 5/01, G06N 3/04, G06N 3/08, G06N 3/084, G06N 3/10Filed as Infineon Technologies Americas Corp.2026-03-11Niall LYONS | pending |
| SOFT-START CIRCUIT FOR VOLTAGE REGULATORSH02M 1/0025, H02M 1/36, H02M 1/0032, H02M 1/0045, G05F 1/468, G05F 1/575, H02M 1/08, H02M 1/32, H02M 3/156, H02M 3/158Filed as Infineon Technologies AG2026-03-06Ionut-Alin ILIE | pending |
| CONTINUOUS SYNCHRONIZATION SIGNALING FOR CRYSTAL-LESS COMMUNICATION LINKSFiled as INFINEON TECHNOLOGIES AMERICAS CORP.2026-03-06SEID ALIREZA RAZAVI MAJOMARD | pending |
| CONFIGURABLE COMMUNICATION DEVICE THAT OPERATES WITH ASYMMETRIC AND SYMMETRIC DATA RATESH04L 5/22, G06F 13/42Filed as Infineon Technologies Americas Corp.2026-03-06Ragnar Hlynur JONSSON | pending |
| CONTINUOUS SYNCHRONIZATION SIGNALING FOR CRYSTAL-LESS COMMUNICATION LINKSH04L 7/0016, H04L 5/0055, H04L 7/0054, H04L 7/033, H04L 7/041Filed as Infineon Technologies Americas Corp.2026-03-05Seid Alireza Razavi Majomard | pending |
| CIRCUIT ARRANGEMENT AND METHOD FOR THE EXCITATION OF IMPEDANCE SPECTROSCOPY IN MULTICELLULAR BATTERIESG01R 31/389, G01R 31/385, G01R 31/396, H02J 7/54, G01R 31/3644Filed as Infineon Technologies AG2026-03-04Guenter Hofer | pending |
| AMBIENT POWER DEVICE-INITIATED SECURE COMMUNICATIONS USING WIRELESS BACKSCATTERINGH04B 1/7075, H04L 63/0428, H02J 50/20, H04J 13/0025, H04W 12/06Filed as Infineon Technologies Americas Corp.2026-03-03Hui Luo | pending |
| SILICON CARBIDE DEVICE WITH METALLIC INTERFACE LAYERSH10D 62/155, H10D 62/8325, H10D 30/635, H10D 64/252, H10D 64/2527, H10D 64/62, H10D 30/0295, H10D 30/668, H10D 30/0297, H10D 12/031, H10P 30/2042, H10P 30/21, H10P 50/00, H10D 64/0115Filed as Infineon Technologies AG2026-03-02Ravi Keshav Joshi | pending |
| A PARTICLE TRAPPING DEVICEG21K 1/20, G04F 5/14, G06N 10/40, G06N 10/20, G21K 1/30, B82Y 10/00, G21K 1/00Filed as Infineon Technologies Austria AG2026-02-27Jens Repp | pending |
| Cell Design for MOS-Controlled Power Semiconductor DeviceH10D 62/106, H10D 12/491, H10D 62/127, H10D 12/481, H10D 12/038, H10D 64/117, H10D 62/103, H10D 64/513, H10D 30/668, H10D 62/393, H10D 64/512Filed as Infineon Technologies AG2026-02-27Thomas Kurzmann | pending |
| POWER SEMICONDUCTOR PACKAGE INCLUDING A CONTACT PIN WITH A POINTED TIP AND METHOD OF FABRICATION THEREOFH10W 70/658, H10W 70/464, H10W 74/10, H10W 70/048, H10W 70/429, H10W 74/114, H10W 70/457, H10W 70/424, H10W 74/00, H10W 74/014, H10W 70/481, H10W 70/427, H10W 74/111, H10W 70/421, H10W 70/466, H10W 74/01, H10W 74/016Filed as Infineon Technologies AG2026-02-27Alexander Schwarz | pending |
| POWER SEMICONDUCTOR PACKAGE INCLUDING STACKED CONTACT CLIPS, SYSTEM AND METHOD FOR FABRICATING A POWER SEMICONDUCTOR PACKAGEH10W 72/07636, H10W 72/637, H10W 72/691, H10W 72/07331, H10W 72/07336, H10W 72/07652, H10W 90/701, H10W 90/764, H10W 72/631, H10W 72/647, H10W 72/652, H10W 90/10, H10W 72/07653, H10W 90/811, H10W 72/646, H10W 90/00, H10W 72/60, H10W 90/756, H10W 90/763, H10W 72/534, H10W 90/401, H10W 72/07354, H10W 44/501, H10W 72/076, H10W 72/07631, H10W 90/766, H10W 90/734, H10W 72/5524, H10W 72/5525, H10W 72/634, H10W 90/736, H10W 72/627Filed as Infineon Technologies AG2026-02-23Thorsten Scharf | pending |
| ATOM TRAP DEVICES INCLUDING STRUCTURED ELECTRODE LAYERSG21K 1/20, G21K 1/30, B82Y 10/00Filed as Infineon Technologies Austria AG2026-02-23Fabian Anmasser | pending |
| PHASE CALIBRATION FOR CAPACITANCE TOUCH SENSING DEVICEG06F 3/04164, G06F 3/0418, G06F 3/044, G06F 3/0446, G06F 3/0412Filed as Infineon Technologies Americas Corp.2026-02-23Viktor Kremin | pending |
| RANGING DEVICEG01S 13/0209, G01S 13/10, G01S 13/48, G01S 7/023, G01S 7/282, G01S 7/292, G01S 7/2921, G01S 7/2923, G01S 7/2925, G01S 7/32, G01S 7/40, G01S 7/41, G01S 13/003, G01S 13/103, G01S 13/20, G01S 13/76, G01S 13/765, G01S2013/462Filed as Infineon Technologies AG2026-02-23Leo Happ Botler | pending |
| BATTERY CLUSTER CONTROLH02J 7/40, G06F 13/4282, H02J 7/50, H02J 7/54, H02J 7/855, G06F 1/263, G06F2213/0002, H02M 7/49Filed as Infineon Technologies Americas Corp.2026-02-23Mark Healy | pending |
| ETHERNET COLLISION DETECTIONH04L 12/40084, H04L 12/413, H04L 69/323, H04L 12/40032, H04L 12/5601, H04L 69/324, H04L 69/40, H04L2012/5679, H04L2012/5681Filed as Infineon Technologies AG2026-02-23Longli Yu | pending |
| DEVICE INCLUDING BOARD MEMBER AND MANUFACTURING METHODSH10W 70/68, H05K 1/114, H10D 80/20, H10W 70/681, H10W 74/114, H10W 70/635, H10W 70/65, H10W 76/01, H10W 74/00, H10W 74/014, H10W 70/657, H10W 74/111, H10W 70/60, H10W 70/62, H05K 1/11, H05K 1/181, H05K 3/0047, H05K 3/0097, H05K 3/42, H05K2201/09563, H05K2201/10522Filed as Infineon Technologies AG2026-02-23Chee Yang Ng | pending |
| DEVICE AND METHOD FOR DETECTING MAGNETIC FIELDSG01R 33/07, H10N 52/80, G01R 15/202, G01R 19/00, G01R 33/0005, G01R 33/0206, G01R 33/072, G01R 33/075, G01R 33/077Filed as Infineon Technologies AG2026-02-19Udo AUSSERLECHNER | pending |
| HIERARCHICALLY CONFIGURED INTERCONNECT-BASED ACCESS MECHANISMG06F 21/604, G06F 21/606, G06F 13/28, G06F 21/85Filed as Infineon Technologies AG2026-02-18Frank Hellwig | pending |
| ASYMMETRIC RISC-V CORES WITH VECTOR EXTENSION (RVV) CLUSTERG06F 9/30036, G06F 9/3885, G06F 9/30181Filed as Infineon Technologies AG2026-02-18Muhammad Hassan | pending |
| PARALLEL ELECTRIC PATHS WITH ELECTRONIC DEVICES AND CURRENT LIMITING CIRCUITSH02H 9/02, H02H 9/025, H02H 1/0007, H02H 7/205Filed as Infineon Technologies AG2026-02-17Walter Johann SLAMNIG | pending |
| ELECTRIC FUSE MEMORY AND POWER SWITCH CIRCUIT ARRANGEMENTG11C 17/16, G11C 17/18Filed as Infineon Technologies Austria AG2026-02-17Guillermo Alejandro Conde Guerra | pending |
| SYNTHESIZED OBJECTS IN RADAR DATA FOR TRAINING OR VALIDATING OF MACHINE-LEARNING MODELG06N 20/00, G06F 18/214, G01S 7/417, G01S 7/4052, G01S 13/42, G01S 13/89Filed as Infineon Technologies AG2026-02-17Mojdeh Golagha | pending |
| Power Semiconductor Device Having a Field Plate Structure and Method of Producing the Power Semiconductor DeviceH10D 64/111, H10D 62/105, H10D 12/441, H10D 64/01, H10D 30/0291, H10D 30/60, H10D 30/665, H10D 12/032, H10D 8/411, H10D 64/112, H10D 64/115, H10D 62/112, H10D 12/411Filed as Infineon Technologies AG2026-02-13Frank Dieter Pfirsch | pending |
| SEMICONDUCTOR SUBSTRATE HAVING A HYBRID ALIGNMENT STRUCTUREG03F 7/70633, G03F 7/70683, G03F 9/7003, G03F 9/7076, G03F 9/7084Filed as Infineon Technologies AG2026-02-13Joerg Ortner | pending |
| METHOD OF SPLITTING A SEMICONDUCTOR SUBSTRATE AND COOLING PLATE APPARATUSH10P 54/00, H05K 7/20254, H10W 40/47, H10P 72/04, H10P 72/0432Filed as Infineon Technologies AG2026-02-13Tom Galle | pending |
| METHODS FOR OPERATING A POWER CONVERTER, CONTROLLER FOR A POWER CONVERTER, AND POWER CONVERTERH02M 3/33576, H02M 3/33592, H02M 1/0009, H02M 1/0058, H02M 3/33523, H02M 3/33584, Y02B 70/10Filed as Infineon Technologies Austria AG2026-02-12Marcus SCHÄMANN | pending |
| MANUFACTURING METHOD FOR A MICRO DISPLAYH10K 59/131, H10K 59/1315, H10K 59/1201, H10W 72/9445, H10W 72/01971, H10W 72/01951, H10W 72/019, H10W 72/936Filed as Infineon Technologies AG2026-02-12Matthias Markert | pending |
| TOUCH SCREEN SCANNING USING A COMBINATION OF MULTI-FREQUENCY AND MULTI-PHASE ELECTRODE EXCITATIONFiled as INFINEON TECHNOLOGIES AMERICAS CORP.2026-02-12ROMAN OGIRKO | pending |
| RIVET FOR USE IN SEMICONDUCTOR MODULE ARRANGEMENT, METHOD FOR PRODUCING A RIVET, AND METHOD FOR CONNECTING RIVET TO A SUBSTRATEF16B 19/1054, B21J 15/02, B21J 15/027, B21J 15/36Filed as Infineon Technologies AG2026-02-11Lukas Meis | pending |
| METHOD FOR OPERATING AN ELECTRIC CIRCUITH03K 17/08122, H03K2017/0806, H03K2217/0027, H03K2217/0063, H03K2217/0072, H03K2217/0081Filed as Infineon Technologies AG2026-02-11Klaus Hoermaier | pending |
| RESONANT POWER CONVERTERH02M 3/01, H02M 3/158, H02M 7/4815, H02M 3/33573, H02M 1/0058, H02M 3/33571, H02M 1/0095, H02M 1/08, H02M 3/1582, H02M 3/33584, H02M 7/4807, H02M 7/487, Y02B 70/10Filed as Infineon Technologies Austria AG2026-02-11Osama ABDEL-RAHMAN | pending |
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