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Diodes Inc Patents

What Diodes Inc has filed at the patent office — applications as well as grants, because a filing is on the record eighteen months before anyone has to say what it was for.

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Filings on file
53
Granted
8
Still pending
45
Filed under
2 names

53 filings

Newest filing first. A pending application has no patent number yet, and most never get one.

InventionPatent
Power Semiconductor Apparatus and Bonding Method ThereofH10W 72/073, H10P 58/20, H10P 52/00, H10P 72/7416, H10P 72/7422, H10P 72/7438, H10P 54/00, H10P 50/24, H10W 72/07338, H10W 90/732, H10P 72/744, H10W 90/00, H10W 46/503, H10P 72/7402, H10P 72/74, H10P 72/7432, H10P 54/40, H10P 72/7412, H10W 42/121Filed as Diodes Incorporated2026-04-27Duane Wilcoxenpending
Power Semiconductor Apparatus and Bonding Method ThereofH10W 72/0198, H10W 20/0526, H10W 20/033, H10W 90/734, H10P 14/6342Filed as Diodes Incorporated2026-04-17Duane Wilcoxenpending
LED Current Overshoot Reduction Apparatus and MethodH05B 45/50, H05B 45/345, H05B 47/20, H05B 45/40, H05B 45/397, H05B 45/37, H05B 47/25, H05B 45/325, H05B 47/165, H02M 1/08, H03K 17/166Filed as Diodes Incorporated2026-04-13Dongjie Chengpending
Power Semiconductor Apparatus and Bonding Method ThereofH10W 42/121, H10W 20/0526, H10W 20/033, H10W 90/00, H10W 72/0198, H10W 90/734, H10P 14/6342Filed as Diodes Incorporated2026-03-20Duane Wilcoxenpending
LED Current Overshoot Reduction Apparatus and MethodH05B 45/54, H02M 1/0025, H05B 45/397, H05B 45/345, H05B 45/325, H02M 1/15, H03K 17/166Filed as Diodes Incorporated2026-02-26Dongjie Chengpending
Apparatus and Method for Reducing Stand-by Power Consumption in Isolated Power Conversion SystemH02M 1/0032, H02M 1/0035, H02M 3/33507, H02M 3/33523, H02M 1/0019, H02M 1/092, H02M 3/335, H02M 3/33592, Y02B 70/10Filed as Diodes Incorporated2025-12-16Feng-Jung Huangpending
Vertical Semiconductor Device and Manufacturing Method ThereforH10D 30/668, H10D 30/0297, H10D 64/117, H10D 62/058, H10D 64/513, H10D 62/127, H10D 64/518, H10D 64/2527, H10D 30/0295, H10D 62/393Filed as Diodes Incorporated2025-10-23Ta-Chuan KUOpending
Semiconductor Device and Process for Making SameH10D 84/221, H10D 8/60, H10D 84/038, H10W 10/014, H10D 8/605, H10D 8/051, H10D 64/23, H10W 10/17, H10W 74/131, H10W 10/011, H10W 10/10Filed as Diodes Incorporated2025-10-21Kuo-Liang Chaopending
Oscillator Apparatus and Control MethodH03B 5/24, H03K 3/0231, H03K 3/03, H03B2201/011, H03K 3/0315, H03L 7/099Filed as Diodes Incorporated2025-10-15Yen-Chang Tungpending
Oscillator Apparatus and Control MethodH03B 5/24, H03K 3/0231, H03K 3/03, H03B2201/011, H03K 3/0315, H03L 7/099Filed as Diodes Incorporated2025-10-15Yen-Chang Tungpending
Vertical Power Semiconductor Device and Manufacturing Method ThereofH10D 64/252, H10D 30/0291, H10W 20/43, H10D 12/441, H10D 62/157, H10D 64/01, H10D 62/154, H10D 30/66, H10D 62/153, H10D 62/127, H10D 64/2527, H10D 64/516, H10D 62/8325, H10D 62/393, H10D 62/01, H10W 20/0698, H10W 20/42, H10W 20/056Filed as Diodes Incorporated2025-09-18Jie LIpending
Semiconductor Structure and Manufacturing Method ThereofH10D 84/811, H10D 89/611, H10D 8/045, H10D 62/60, H10D 64/661, H10D 30/63, H10D 84/0109, H10D 62/153, H10D 89/911, H10D 64/513, H10D 62/127, H10D 8/411, H10D 84/143, H10D 62/124, H10D 30/668, H10D 30/0297, H10D 30/025Filed as Diodes Incorporated2025-08-20Ta-Chuan KUOpending
Reconfigurable Power Conversion Apparatus and Control MethodH02M 1/0054, H02M 1/088, H02M 3/157, H02M 1/327, H02M 1/0032, H02M 1/0035, H02M 1/0038, H02M 1/0058, H02M 1/08, H02M 3/158, H02M 3/1584, H02M 3/1588, H03K 17/122, Y02B 70/10Filed as Diodes Incorporated2025-07-31Sisan Shenpending
Semiconductor Structure and Manufacturing Method ThereofH10D 30/63, H10D 30/0297, H10D 62/60, H10D 62/102, H10D 62/153, H10D 64/513, H10D 62/127, H10D 64/2527, H10D 64/62, H10D 30/0212, H10D 62/124, H10D 30/668, H10D 30/025, H10D 64/0112Filed as Diodes Incorporated2025-07-30Ta-Chuan KUOpending
Quartz Crystal Resonator and Manufacturing Method ThereofH10N 30/853, H03H 3/02, H10N 30/088, H03H 3/04, H03H 9/02023, H03H 9/02102, H03H 9/19, H03H2003/022, H03H2003/0407Filed as Diodes Incorporated2025-07-18Po-Yang Su12733403
Low Saturation Voltage BJT with Enhanced Packing FlexibilityH10D 62/126, H10D 64/231, H10W 20/484, H10D 10/058, H10D 10/421, H10D 62/133, H10D 10/40, H10D 64/281, H10W 20/43, H10W 20/435Filed as Diodes Incorporated2025-06-24Matthew Mottpending
LEADFRAMEH10W 90/00, H10W 70/411, H10W 70/048, H10W 90/811, H10W 72/9445, H10W 70/424, H10W 90/756, H10W 74/014, H10W 72/5473, H10W 74/111, H10W 72/5449Filed as Diodes Incorporated2025-05-21Li-Ju Huangpending
METHOD FOR OPERATING POWER CONVERTER, SEMICONDUCTOR CHIP AND POWER CONVERTERH02M 1/342, H02M 1/0058, H02M 3/33569Filed as Diodes Incorporated2025-05-21Feng-Jung Huangpending
Electrostatic Discharge Protection Structure, Semiconductor Power Device and Manufacturing Method ThereofH10D 89/611, H10D 84/148, H10D 30/668, H10D 30/0297Filed as Diodes Incorporated2025-05-07Ta-Chuan KUOpending
Electrostatic Discharge Protection Structure, Semiconductor Power Device and Manufacturing Method ThereofH10D 89/611, H10D 84/148, H10D 30/668, H10D 30/0297Filed as Diodes Incorporated2025-05-05Ta-Chuan KUOpending
LINEAR REDRIVER WITH TUNABLE LOW FREQUENCY AND HIGH FREQUENCY ZERO AT EQUALIZER STAGEFiled as DIODES INCORPORATED2025-03-26TONY YEUNGpending
Trench Semiconductor Structure and Manufacturing Method ThereofH10D 84/146, H10D 30/668, H10D 64/117, H10D 84/0109, H10D 84/811, H10D 30/0297Filed as Diodes Incorporated2025-03-18Ta-Chuan Kuopending
METHOD AND SYSTEM FOR TRANSISTOR WITH COMBINED SOURCE AND WELL CONTACTH10D 30/658, H10D 64/257, H10D 64/667, H10D 30/65, H10D 30/0289, H10D 62/021, H10D 62/058, H10D 30/0281, H10D 30/657, H10D 30/0285, H10D 64/62, H10D 30/0221, H10D 64/254, H10D 30/603, H10D 64/665, H10D 64/668, H10W 20/40, H10P 52/40, H10W 20/076Filed as Diodes Incorporated2025-02-28Jennifer A. Driscollpending
Semiconductor Structures and Manufacturing Methods ThereofH10P 30/2044, H10P 30/22, H10D 62/106, H10D 62/111, H10D 62/8325, H10D 62/393, H10D 12/031, H10P 76/4085Filed as Diodes Incorporated2025-02-12Jie LIpending
Semiconductor Structures and Manufacturing Methods ThereofH10P 30/2044, H10P 30/22, H10D 62/106, H10D 62/111, H10D 62/8325, H10D 62/393, H10D 12/031, H10P 76/4085Filed as Diodes Incorporated2025-02-12Jie LIpending
Semiconductor Structures and Manufacturing Methods ThereofH10P 30/2044, H10P 30/22, H10D 62/106, H10D 62/111, H10D 62/8325, H10D 62/393, H10D 12/031, H10P 76/4085Filed as Diodes Incorporated2025-02-12Jie LIpending
Semiconductor Structures and Manufacturing Methods ThereofH10P 30/2044, H10P 30/22, H10D 62/106, H10D 62/111, H10D 62/8325, H10D 62/393, H10D 12/031, H10P 76/4085Filed as Diodes Incorporated2025-02-12Jie LIpending
Semiconductor Structures and Manufacturing Methods ThereofH10P 30/2044, H10P 30/22, H10D 62/106, H10D 62/111, H10D 62/8325, H10D 62/393, H10D 12/031, H10P 76/4085Filed as Diodes Incorporated2025-02-12Jie LIpending
Semiconductor Structures and Manufacturing Methods ThereofH10P 30/2044, H10P 30/22, H10D 62/106, H10D 62/111, H10D 62/8325, H10D 62/393, H10D 12/031, H10P 76/4085Filed as Diodes Incorporated2025-02-12Jie LIpending
Trench Semiconductor Structure and Manufacturing Method ThereofH10D 64/117, H10D 30/0297, H10D 8/00, H10D 84/141, H10D 84/811, H10D 64/513, H10D 62/127, H10D 64/2527, H10D 30/668, H10D 62/393Filed as Diodes Incorporated2025-02-11Tachuan Kuopending
Clock Signal Skew Calibration Apparatus and Control MethodG06F 1/10, H03K 5/1565, G06F 1/08, H04L 7/0337Filed as Diodes Incorporated2025-01-10Yu-Wei Linpending
DYNAMIC CONTROL OF OUTPUT DRIVER IN A SWITCHING AMPLIFIERH03F 3/183, H03F 3/2171, H03F 1/3205, H03F 3/2173, H03F2200/03, H03F2200/372, H03F2203/45248Filed as Diodes Incorporated2024-12-31Rohit Arorapending
Power Semiconductor Apparatus and Bonding Method ThereofH10P 72/74, H10W 20/0526, H10W 20/033, H10W 72/073, H10W 72/0198, H10P 72/7432, H10P 72/7448, H10W 72/30, H10P 72/745, H10W 90/734, H10P 14/6342, H10P 72/7434Filed as Diodes Incorporated2024-12-28Duane Wilcoxenpending
BOOTSTRAP CAPACITOR REFRESH CONTROL APPARATRUS AND METHODFiled as DIODES INCORPORATED2024-12-20FENG-JUNG HUANGpending
METHOD AND SYSTEM FOR TRANSISTOR WITH COMBINED SOURCE AND WELL CONTACTFiled as Diodes Incorporated2024-12-19Jennifer A. Driscollpending
Semiconductor Structure and Manufacturing Method ThereofH10D 30/655, H10D 62/107, H10D 62/8325, H10P 30/2042, H10D 62/106, H10D 84/151, H10D 30/0281, H10D 62/105, H10D 12/031, H10P 30/21Filed as Diodes Incorporated2024-12-12Ching-Wen Wang12262550
LED Color and Brightness Control Apparatus and MethodH05B 45/20, H05B 45/44, H05B 45/395, H05B 45/397, H05B 45/46, H05B 45/345, H05B 47/155, H05B 45/325, H05B 45/10Filed as Diodes Incorporated2024-12-10Dongjie Cheng12707546
Vertical Power Semiconductor Device and Manufacturing Method ThereofH10D 64/252, H10D 30/0291, H10W 20/43, H10D 12/441, H10D 62/157, H10D 64/01, H10D 62/154, H10D 30/66, H10D 62/153, H10D 62/127, H10D 64/2527, H10D 64/516, H10D 62/8325, H10D 62/393, H10D 62/01, H10W 20/0698, H10W 20/42, H10W 20/056Filed as Diodes Incorporated2024-12-04Jie LI12471347
Bootstrap Capacitor Refresh Control Apparatus and MethodH02M 1/0032, H02M 1/08, H02M 3/158, H02M 1/0006, H02M 3/07, H02M 3/155Filed as Diodes Incorporated2024-11-25Feng-Jung Huangpending
DATA CORRECTION AND PHASE OPTIMIZATION IN HIGH-SPEED RECEIVERSG01R 31/318552, H04L 25/0292, H04L 25/03146, G01R 31/31727, G06F 11/07, H04L 1/0091, H04L 7/0025, H04L 7/0058, H04L 7/033, H04L 25/0272, H04L 25/03267, H04L 25/03273, H04L 25/03878Filed as Diodes Incorporated2024-11-21Yu-Wei Lin12754237
TRENCHED SCHOTTKY STRUCTURE HAVING A DOPED REGION LOCATED AT A CENTRAL POSITION BETWEEN FIRST TRENCH AND SECOND TRENCH STRUCTURESH10D 8/605, H10D 62/8325, H10D 62/106, H10D 64/117, H10D 8/051Filed as Diodes Incorporated2024-11-19Tao Longpending
Power Semiconductor Structure and Manufacturing Method ThereofH10D 8/60, H10P 14/40, H10D 62/106, H10D 62/126, H10D 8/051, H10D 62/107, H10D 8/01, H10D 64/62, H10D 64/64, H10D 64/011Filed as Diodes Incorporated2024-11-13Li-Hsien CHOUpending
Trench Semiconductor Structure and Manufacturing Method ThereofH10D 84/146, H10D 64/513, H10D 64/252, H10D 64/256, H10D 12/481, H10D 64/117, H10D 84/811, H10D 8/60, H10D 62/127, H10D 64/2527, H10D 64/20, H10D 30/0295, H10D 30/668, H10D 30/0297Filed as Diodes Incorporated2024-11-13Ta-Chuan KUOpending
Power Semiconductor Packaging and Manufacturing Method ThereofH10D 62/102, H10D 8/60, H10W 70/658, H10D 62/106, H10D 8/051, H10D 10/221, H10D 62/8325, H10D 48/01, H10W 70/685, H10W 20/20, H10W 70/662, H10W 70/68Filed as Diodes Incorporated2024-11-07Chih-Hsiang HSUpending
METHOD OF MANUFACTURING A TRENCH MOS RECTIFIER WITH A TERMINATION STRUCTUREH10D 8/605, H10W 42/00, H10D 8/045, H10D 62/126, H10D 84/221, H10D 64/117, H10D 8/051, H10D 62/107, H10D 62/128, H10D 8/422Filed as Diodes Incorporated2024-10-30Tao Longpending
BUCK-BOOST POWER CONVERTER AND CONTROL METHODFiled as DIODES INCORPORATED2024-10-24HAO-MING CHENpending
POWER SEMICONDUCTOR APPARATUS AND BONDING METHOD THEREOFFiled as DIODES INCORPORATED2024-10-18DUANE WILCOXENpending
Line Scan Imaging Device, Calibration Method and Control Board for Image StitchingH04N 23/76, H04N 23/56, H04N 23/74, H04N 25/701, H04N 17/002Filed as Diodes Incorporated2024-09-25Wei Jen Wangpending
Buck-Boost Power Converter and Control MethodH02M 1/0009, H02M 3/1582, H02M 1/0025, H02M 1/0093Filed as Diodes Incorporated2024-09-18Hao-Ming Chenpending
Gate Drive Apparatus and Control MethodH02M 1/08, H03K 17/04, H03K 17/04123, H03K 17/693, H10D 84/811, H02M 7/537, H03K 17/063, H03K2017/6875, H03K2217/0036, H03K2217/0063, H03K2217/0081Filed as Diodes Incorporated2024-09-16Chiao-Shun CHUANG12525977
Gate Drive Apparatus and Control MethodH02M 1/08, H03K 17/04, H03K 17/04123, H03K 17/693, H10D 84/811, H02M 7/537, H03K 17/063, H03K2017/6875, H03K2217/0036, H03K2217/0063, H03K2217/0081Filed as Diodes Incorporated2024-09-16Chiao-Shun CHUANG12549181
Power Semiconductor Apparatus and Bonding Method ThereofH10P 72/74, H10W 20/0526, H10W 20/033, H10W 72/073, H10W 72/0198, H10P 72/7432, H10P 72/7448, H10W 72/30, H10P 72/745, H10W 90/734, H10P 14/6342, H10P 72/7434Filed as Diodes Incorporated2024-09-11Duane Wilcoxen12308337
LED CURRENT OVERSHOOT REDUCTION APPARATUS AND METHODFiled as DIODES INCORPORATED2024-09-11DONGJIE CHENGpending

Filings are matched to the company by applicant name, so a subsidiary filing under its own name is only here if that name resolves to this company. The applicant is printed as filed, which makes a wrong match visible. A patent is not a product: most applications are never granted, and most grants are never built.

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