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Applied Materials Inc Patents
What Applied Materials Inc has filed at the patent office — applications as well as grants, because a filing is on the record eighteen months before anyone has to say what it was for.
AMAT on carbonthat →Filings on file
82
Granted
0
Still pending
82
Filed under
5 names
82 filings
Newest filing first. A pending application has no patent number yet, and most never get one.
| Invention | Patent |
|---|---|
| APPARATUS AND METHOD FOR SENSING RF SIGNALS FROM RF PLASMA PROCESSING EQUIPMENTG01N 21/66, H01J 37/32082, H01J 37/32935, G01R 29/08, H01J 37/244, H01J 37/32972, H01J2237/24564, H05H 1/0062Filed as Applied Materials, Inc.2026-06-23Michael HOPKINS | pending |
| TITANIUM NITRIDE GAPFILL PROCESSES FOR SEMICONDUCTOR STRUCTURESH10P 14/418, H10D 30/014, H10D 30/6757, H10D 64/01, H10D 62/121, H10D 30/019, H10D 30/501, H10D 30/6735, H10W 20/057, H10W 20/0765Filed as Applied Materials, Inc.2026-06-23Yongjing Lin | pending |
| CONTACT RESISTANCE REDUCTION FOR DIRECT BACKSIDE CONTACTH10D 84/038, H10D 64/0112, H10D 84/0186, H10D 84/85, H10D 30/6757, H10D 30/019, H10D 30/501, H10D 64/251, H10D 30/6735, H10D 84/017, H10D 30/6729, H10D 84/0149, H10W 20/033, H10W 20/481, H10W 20/047, H10W 20/20, H10D 64/01125Filed as Applied Materials, Inc.2026-06-22Jae Young Lee | pending |
| PROCESS FOR MANUFACTURING A SILICON CARBIDE COATED BODYC04B 41/4531, C04B 41/5059, C23C 16/325, C04B 35/522, C04B 38/00, C04B 38/0096, C04B 41/009, C04B 41/45, C04B 41/87, C04B2111/00431, C04B2235/72, C04B2235/724, C04B2235/77, C23C 16/045, C23C 16/455, C23C 16/4581Filed as Applied Materials, Inc.2026-06-22Peter J. GUERCIO | pending |
| CHAMBER KITS, SYSTEMS, AND METHODS FOR CALIBRATING TEMPERATURE SENSORS FOR SEMICONDUCTOR MANUFACTURINGG01J 5/80, C23C 16/46, C23C 16/52, C30B 25/10, C30B 25/12, C30B 25/16, G01J 5/0007Filed as Applied Materials, Inc.2026-06-19Zhepeng CONG | pending |
| PRE-CLEAN CHAMBER ASSEMBLY ARCHITECTURE FOR IMPROVED SERVICEABILITYH10P 72/7602, H10P 72/0402, H10P 72/0454, H10P 72/0462, H10P 72/0464, H10P 72/0406Filed as Applied Materials, Inc.2026-06-19Songjae LEE | pending |
| ROTARY ELECTRICAL FEEDTHROUGH INTEGRATION FOR PROCESS CHAMBERH10P 72/722, H10P 72/7626, C23C 14/505, H10P 72/7624, H10P 72/7618, C23C 16/4586, H01J 37/32715Filed as Applied Materials, Inc.2026-06-18ANANTHA SUBRAMANI | pending |
| METHOD TO IMPROVE INTERCONNECT COEFFICIENT OF THERMAL EXPANSIONH10W 20/056, H10W 20/425, H10W 20/033, H10W 20/081, H10W 20/4424, H10P 72/0468, H10P 70/27, H10P 72/0452, H10W 40/258, H10W 20/055, H10W 20/062Filed as Applied Materials, Inc.2026-06-17Tyler Sherwood | pending |
| MULTI-ZONE HEATER WITH MINIMUM RF LOSSH10P 72/722, H01J 37/32724, H10P 72/0602, H10P 72/0432, H10P 72/72, H10P 76/00Filed as Applied Materials, Inc.2026-06-16Jian LI | pending |
| SUBSTRATE CARRIERB65G 54/02, B65G2201/0297Filed as Applied Materials, Inc.2026-06-15Bhaskar PRASAD | pending |
| PROCESS AND APPARATUS TO REMOVE METAL-CONTAINING FILMS FROM A CHAMBERC23F 1/44, H01J 37/3244, H01J 37/32862, H10P 72/0421, C23C 16/45565, C23F 4/00, H01J 37/32357, H01J2237/334Filed as Applied Materials, Inc.2026-06-12KELVIN CHAN | pending |
| HIGHER PRESSURE PURGE FOR IMPURITY REDUCTION IN RADICAL TREATMENT CHAMBERH01J 37/32522, H01J 37/32834, H10W 20/425, H10W 20/031, H10P 95/00, H10W 20/064, H01J 37/32357, H01J 37/32449, H01J 37/32743, H01J 37/32899, H01J2237/1825, H01J2237/336Filed as Applied Materials, Inc.2026-06-10Pradeep Sampath KUMAR | pending |
| POLY-SILICON BASED WORD LINE FOR 3D MEMORYH10B 43/27, H10F 39/016, H10B 43/50, H10B 43/40, H10B 41/27, H10P 14/6684, H10P 72/00Filed as Applied Materials, Inc.2026-06-09Chang Seok Kang | pending |
| MONOLITHIC MODULAR HIGH-FREQUENCY PLASMA SOURCEH01J 37/3211, H01J 37/32431, H05H 1/4652, H01J 37/321, H01J 37/32119, H01J 37/32238, H01J2237/332, H01J2237/3321Filed as Applied Materials, Inc.2026-06-05THAI CHENG CHUA | pending |
| CHEMICAL MECHANICAL POLISHING TEMPERATURE SCANNING APPARATUS FOR TEMPERATURE CONTROLB24B 37/015, B24B 37/105, H10P 72/0428, B24B 37/042, B24B 37/22, B24B 37/34, B24B 49/14, B24B 53/017, B24B 55/02Filed as Applied Materials, Inc.2026-06-04Hari Soundararajan | pending |
| ALLOY MICROSTRUCTURE FORMATION FOR CHAMBER COMPONENTSB22F 1/16, C22C 1/0416, B33Y 10/00, B33Y 80/00, B22F 10/62, B22F 10/18, B22F 10/25, B22F 10/28, B22F 7/02, B22F2003/242, B22F2007/068, B22F2301/052, B22F2304/10, B32B 15/016, C23C 16/403, C23C 16/4404, C23C 16/45525, C23C 16/45555, C23C 16/45565, B22F2998/10, B22F2999/00, C22C 1/05, B22F2207/11, B22F2207/01Filed as APPLIED MATERIALS, INC.2026-06-04Chien-Min Liao | pending |
| METHOD TO IMPROVE DISPLAY EFFICIENCY AND UNIFORMITY OF AR WAVEGUIDEG02B 27/0172, G02B 1/002, G02B 1/10, G02B 1/115, G02B 5/1809, G02B 6/0016, G02B 6/0038, G02B 6/4212, G02B2027/0112Filed as Applied Materials, Inc.2026-06-03Jinxin FU | pending |
| ELECTROSTATIC END EFFECTOR FOR MANUFACTURING SYSTEM ROBOTH10P 72/3302, H10P 72/7602, H10P 72/7614, H10P 72/722, H10P 72/72, H10P 72/7616, B25J 11/0095, B25J 15/0014, B25J 15/0019, B25J 15/0085Filed as APPLIED MATERIALS, INC.2026-06-02Rajkumar Thanu | pending |
| MULTI-LEVEL MACHINE LEARNING FOR PREDICTIVE AND PRESCRIPTIVE APPLICATIONSC12M 41/48, G16B 40/00, C12M 23/08, C12M 41/38, C12M 41/46Filed as Applied Materials, Inc.2026-06-01Lucas Richard Vann | pending |
| METHODS AND MECHANISMS FOR MEASURING PATTERNED SUBSTRATE PROPERTIES DURING SUBSTRATE MANUFACTURINGG06N 20/00, H10P 72/0604, G06N 20/20, G06N 20/10, G06N 3/09, G06N 3/0895, G06F 18/21, G06N 3/0499, G06N 3/0464, H10P 74/203, H10P 74/23, H10P 72/0402, C23C 16/52, G01B 11/0625, G06N 3/084, G06N 3/088Filed as Applied Materials, Inc.2026-06-01Ping-Yu Chou | pending |
| METALENS STACK ON WAVEGUIDE COMBINERS FOR AR/VR GLASSESG02B 27/0172, G02B 27/4272, G02B 1/002, G02B 3/0062, G02B 5/1819, G02B 27/106, G02B2027/0174, G02B2027/0178, G02B2207/101Filed as Applied Materials, Inc.2026-05-26Jinxin FU | pending |
| REAL-TIME DETECTION OF PARTICULATE MATTER DURING DEPOSITION CHAMBER MANUFACTURINGH10P 74/203, G01N 15/0211, H01J 37/32972, H01J 37/3476, G01N 15/075, G01N 15/1433, H10P 74/238, C23C 14/34, C23C 14/54, C23C 14/564, C23C 16/4401, C23C 16/52, G01N 15/0227, G01N 15/06, G01N 15/1459, G01N 21/01, G01N 21/51, G01N2015/0026, G01N2015/0222, G01N2015/0238, G01N2015/025, G01N2015/1486, G01N2015/1493, H01J 37/32477, H01J2237/3321Filed as Applied Materials, Inc.2026-05-26Mehdi Vaez-Iravani | pending |
| WAFER EDGE PROFILE CONTROL USING CONNECTED EDGE RING HARDWAREH01J 37/32642, H01J 37/3435, H01J 37/347, H01J2237/2007, H01J2237/3323Filed as Applied Materials, Inc.2026-05-22Andreas SCHMID | pending |
| SYSTEM AND METHOD FOR AUTO CORRECTION OF SUBSTRATE MISALIGNMENTH10P 72/0402, H10P 72/0606, C23C 16/46, H10P 72/0604, H10P 72/7624, H10P 72/0436, H10P 72/53, C23C 16/4408, C23C 16/4583, C23C 16/4585, C23C 16/52Filed as Applied Materials, Inc.2026-05-19Zhepeng CONG | pending |
| METHODS OF FORMING COVER LENS STRUCTURES FOR DISPLAY DEVICES, AND RELATED APPARATUS AND DEVICESG02B 1/14, G02B 1/18, C23C 14/024, C23C 14/06, C23C 16/0245, C23C 16/0272, C23C 16/345, C23C 16/401, C23C 16/402, C23C 16/50, C23C 16/505, C23C 16/509, C23C 16/56, G02B 1/11Filed as Applied Materials, Inc.2026-05-18Helinda NOMINANDA | pending |
| MATERIAL PROCESSING BY TURBO BURST ULTRAFAST LASER PULSEB23K 26/0624, B23K 26/364, B23K 26/53, B23K2103/54, B23K 26/0648, C03B 33/0222Filed as Applied Materials, Inc.2026-05-13S. Abbas HOSSEINI | pending |
| METHOD OF REDUCING METAL GATE RESISTANCE FOR NEXT GENERATION NMOS DEVICE APPLICATIONH10D 64/01, H10D 64/667, H10D 64/662, H10D 30/6735, H10P 14/43, H10P 14/418, H10D 64/0113Filed as Applied Materials, Inc.2026-05-12Srinivas Gandikota | pending |
| BATCH PROCESSING APPARATUS, SYSTEMS, AND RELATED METHODS AND STRUCTURES FOR EPITAXIAL DEPOSITION OPERATIONSH10P 72/0402, C30B 35/005, H10P 72/7604, H10P 14/20, H10P 72/0434, H10P 72/0602, H10P 72/33, H10P 72/0432, H10P 14/24, H10P 14/3411, H10P 72/0431, C23C 16/4412, C23C 16/455, C23C 16/45502, C23C 16/46, C30B 25/14Filed as Applied Materials, Inc.2026-05-11Mr. Manjunath SUBBANNA | pending |
| METHOD AND SYSTEM FOR CREATING A STITCHED DESIGN FILEG03F 7/70475, G03F 7/706833, G03F 7/70625, G03F 7/70633, G03F 7/70683, G03F 9/7046, G03F 9/7088Filed as Applied Materials, Inc.2026-05-07Yongan XU | pending |
| BATCH PROCESSING APPARATUS, SYSTEMS, AND RELATED METHODS AND STRUCTURES FOR EPITAXIAL DEPOSITION OPERATIONSH10P 72/0402, C30B 35/005, H10P 72/7604, H10P 14/20, H10P 72/0434, H10P 72/0602, H10P 72/33, H10P 72/0432, H10P 14/24, H10P 14/3411, H10P 72/0431, C23C 16/4412, C23C 16/455, C23C 16/45502, C23C 16/46, C30B 25/14Filed as Applied Materials, Inc.2026-05-07Errol Antonio C. SANCHEZ | pending |
| RF BLOCKER FOR UNIFORMITY CONTROLH01J 37/3211, H01J 37/32651, H01J 37/321, H01J 37/32174, H01J2237/3323, H01J2237/3365Filed as Applied Materials, Inc.2026-05-06Vikram M. Bhosle | pending |
| SYSTEMS, APPARATUS, AND METHODS FOR MONITORING PLATE TEMPERATURE FOR SEMICONDUCTOR MANUFACTURINGG01J 5/0879, H10P 72/0602, G01J 5/0007, G01J 5/0801, H10P 72/0436, C23C 16/458, C23C 16/46, C23C 16/52, C30B 25/08, C30B 25/105, C30B 25/16Filed as Applied Materials, Inc.2026-05-05Zhepeng CONG | pending |
| SYSTEM AND METHOD FOR NON-INVASIVE SENSING OF RADIO-FREQUENCY CURRENT SPECTRA FLOWING IN A PLASMA PROCESSING CHAMBERG01R 23/16, H01J 37/32917, H01J 37/32935, H01J 37/32972, C23C 14/52, G01R 1/203, G01R 19/0061, G01R 19/15, G01R 19/28, G01R 23/20, G01R 29/08, H01J 37/32082, H01J 37/3299, H01J2237/24564, H01J2237/3321, H01J2237/334Filed as Applied Materials, Inc.2026-05-01David GAHAN | pending |
| METHODS FOR ATOMIC LAYER DEPOSITION OF SiCO(N) USING HALOGENATED SILYLAMIDESC23C 16/401, C23C 16/45553, C23C 16/345, C23C 16/36, C23C 16/45527, C23C 16/45536, C23C 16/4554, C23C 16/45542Filed as Applied Materials, Inc.2026-04-27Bhaskar Jyoti Bhuyan | pending |
| METHOD AND APPARATUS FOR GENERATING PLASMA WITH ION BLOCKER PLATEH01J 37/32082, H01J 37/32422, H01J2237/332Filed as Applied Materials, Inc.2026-04-21Kallol Bera | pending |
| GAS DISTRIBUTION ASSEMBLIES FOR SEMICONDUCTOR DEVICESH01J 37/32495, H10P 72/0402, H01J 37/3244, H01J 37/32449, H01J2237/332Filed as Applied Materials, Inc.2026-04-20Sanjeev Baluja | pending |
| LOW TEMPERATURE N-TYPE CONTACT EPI FORMATIONH10D 64/01, H10P 50/268, H10P 14/43, H10D 30/024, H10D 64/62, H10D 30/6737, H10D 84/0149, H10D 62/83, H10D 30/6743, H10P 14/271, H10W 20/033, H10P 14/3241, H10P 14/3442, H10P 50/266, H10P 14/3454, H10P 14/38, H10P 50/242, H10D 64/0113, H10P 14/3411, B82Y 10/00, C23C 16/0227, C23C 16/24, C23C 16/52, C23C 16/56Filed as Applied Materials, Inc.2026-04-17Nicolas Breil | pending |
| LINER TO FORM COMPOSITE HIGH-K DIELECTRICH10D 1/716, H10D 1/68, H10B 12/00, H10B 12/03Filed as Applied Materials, Inc.2026-04-17Fredrick Fishburn | pending |
| SYSTEM TO COLLECT, RECOVER AND RECYCLE CHEMICAL EXHAUST FROM SEMICONDUCTOR PROCESSING CHAMBERSB01D 5/0036, B01D 8/00, B01D 53/002, H10P 72/0402, B01D 39/2062, B01D 53/75, B01D2221/14, B01D2257/108, B01D2257/11, B01D2258/0216, C23C 16/4412, Y10S 55/15Filed as Applied Materials, Inc.2026-04-17Andrea Leoncini | pending |
| MULTI-THRESHOLD VOLTAGE INTEGRATION SCHEME FOR SEMICONDUCTOR DEVICESH10D 84/0181, H10D 64/685, H10D 64/691, H10D 84/85, H10D 64/118, H10D 64/01, H10D 84/83138, H10D 30/60, H10D 84/038, H10D 84/0179, H10D 84/851Filed as Applied Materials, Inc.2026-04-16Srinivas Gandikota | pending |
| METHODS OF DEPOSITING SiCON WITH C, O AND N COMPOSITIONAL CONTROLH10P 14/6922, H10P 14/6927, C23C 16/308, H10P 14/6681, H10P 14/6686, H10P 14/6336, H10P 14/6339, H10P 14/6682, C23C 16/4554, C23C 16/45553Filed as Applied Materials, Inc.2026-04-16Mark Saly | pending |
| SUPPORT LAYER FOR SMALL PITCH FILLH10B 12/34, H10B 12/488, H10B 12/053Filed as Applied Materials, Inc.2026-04-09Fredrick Fishburn | pending |
| HIGH THROUGHPUT POLISHING MODULES AND MODULAR POLISHING SYSTEMSH10P 72/3304, B24B 37/10, B24B 37/30, H10P 52/402, H10P 72/0472, H10P 72/3314, H10P 72/0462, B24B 27/0023, B24B 27/0069, B24B 27/0076, B24B 37/042, B24B 37/34, B24B 37/345, B24B 51/00, B24B 55/06Filed as Applied Materials, Inc.2026-04-09Jagan RANGARAJAN | pending |
| Surface Treatment For Selective DepositionC23C 16/02, C23C 16/04, H01J 37/32009, H10W 20/034, H10W 20/057, H10W 20/084, H10W 20/096, H10W 20/438, H10P 72/0454, H10P 14/40, H10W 20/056, C23C 16/045, C23C 16/34, C23C 16/45525, C23C 16/45553, H01J2237/3321, H01J2237/335Filed as Applied Materials, Inc.2026-04-06Carmen Leal Cervantes | pending |
| SELECTIVE TANTALUM NITRIDE DEPOSITION FOR BARRIER APPLICATIONSH10P 14/69433, C23C 16/04, H10P 50/287, H10W 20/034, H10P 14/61, H10W 20/0765, H10P 14/432, H10P 14/6514, H10P 95/00, H10P 14/683, H10P 70/27, H10W 20/076, H10P 14/6339, H10P 14/6682, H10P 70/234, C23C 16/0245, C23C 16/0272, C23C 16/308, C23C 16/34, C23C 16/45525Filed as Applied Materials, Inc.2026-04-06Aaron Dangerfield | pending |
| Remote Surface Wave Propagation for Semiconductor ChamberH01J 37/32082, H01J 37/32192, H01J 37/32348, H05H 1/4615, H01J 37/32357, H01J 37/3244, H01J 37/32715, H01J 37/32733, H01J2237/06375, H01J2237/2007, H05H 1/18, H05H 1/46Filed as Applied Materials, Inc.2026-04-03Yang YANG | pending |
| Substrate Processing Chamber with Plasma ConfinementH01J 37/32623, H01J 37/32633, H01J 37/32651, H01J2237/3323, H01J2237/3343Filed as Applied Materials, inc.2026-04-01Yogananda Vishwanath SARODE | pending |
| AIR-GAP ENCAPSULATION OF NANOSTRUCTURED OPTICAL DEVICESG02B 1/002, G02B 3/08, C03C 15/00, G02B 5/1809, G02B 5/1871, G02B2207/101Filed as Applied Materials, Inc.2026-03-30Sage Toko Garrett DOSHAY | pending |
| LOW REFLECTIVITY HIGH EFFICIENCY INPUT COUPLERS FOR GHOST MITIGATIONG02B 27/0172, G02B2027/012Filed as Applied Materials, Inc.2026-03-27Simon LORENZO | pending |
| ALIGNER STATION WITH LIFTING MECHANISMB25J 11/0095, H01J 37/32807, H01J 37/244, H01J 37/32642, H01J 37/32889, H01J2237/24578Filed as Applied Materials, Inc.2026-03-26Michael Carl Hankes | pending |
| FILTER ISOLATION FOR REDUCED STARTUP TIME IN LOW RELATIVE HUMIDITY EQUIPMENT FRONT END MODULEB01D 46/12, B01D 46/42, B01D 46/0002, B01D 46/46, B01D2271/02Filed as Applied Materials, Inc.2026-03-25Steven Trey Tindel | pending |
| EQUIPMENT PARAMETER MANAGEMENT AT A MANUFACTURING SYSTEM USING MACHINE LEARNINGG06N 20/00, G06N 3/0464, G06N 3/09, G05B 13/0265, G05B 13/042, G05B2219/45031, G06N 3/084Filed as Applied Materials, Inc.2026-03-25Tsung-Liang Chen | pending |
| AUTOMATED SWITCHING BETWEEN WAFER PATTERN SPECIFIC DIFFUSERSC25D 5/022, H10P 14/47Filed as Applied Materials, Inc.2026-03-23Paul R. MCHUGH | pending |
| WATER-BASED, HIGH-EFFICIENCY CHEMICAL REAGENT FOR SUBSTRATE SURFACE PARTICLE REMOVALB08B 3/08, H10P 70/20, H10P 70/237, H10P 70/277, B08B 3/041, B08B 3/123Filed as Applied Materials, Inc.2026-03-20Hong YAN | pending |
| PROTECTION TREATMENTS FOR SURFACES OF SEMICONDUCTOR FABRICATION EQUIPMENTC25D 11/18, H01J 37/32495, C23C 16/403, C23C 16/4404, C23C 16/45525, C23C 28/042, C23C 28/046, C25D 11/04, H01J 37/32467Filed as Applied Materials, Inc.2026-03-20Katherine Woo | pending |
| BOTTOM PURGE FOR SEMICONDUCTOR PROCESSING SYSTEMH10P 72/0402, H10P 72/3311, H10P 72/7621, H10P 72/3302, H10P 72/3312, H10P 72/7602, H10P 72/0464, H10P 72/0454, H10P 72/0462, H10P 72/0451, C23C 16/45519, C23C 16/54Filed as Applied Materials, Inc.2026-03-19Nitin Pathak | pending |
| HIGH HEAT LOSS HEATER AND ELECTROSTATIC CHUCK FOR SEMICONDUCTOR PROCESSINGC23C 16/4586, H01J 37/32724, H10P 72/72, C23C 16/4581, C23C 16/463, C23C 16/5096, H01J 37/32495, H01J 37/32568Filed as Applied Materials, Inc.2026-03-19Jian Li | pending |
| BACKUP ABATEMENT REACTOR FOR A PROCESSING TOOLH01J 37/32844, H01J 37/32449, H01J2237/022Filed as Applied Materials, Inc.2026-03-18Ju Hyung LEE | pending |
| A METHOD TO IMPROVE INTERCONNECT RELIABILITY FOR A MICROELECTRIC DEVICEFiled as APPLIED MATERIALS, INC.2026-03-16YANG ZHOU | pending |
| RESISTIVITY-CONTROLLED DIELECTRIC MATERIALS FOR SUBSTRATE SUPPORTS WITH IMPROVED HIGH TEMPERATURE CHUCKINGH01J 37/32724, H10P 72/722, H10P 72/0432, H10P 72/72, H10P 72/7616, H01J2237/2001, H01J2237/2007, H01J2237/332Filed as Applied Materials, Inc.2026-03-13Amir H. Tavakoli | pending |
| NON-DESTRUCTIVE CLASSIFICATION OF SPECIMENS BASED ON ENERGY SIGNATURE MEASUREMENTSG01N 23/2252, G01N2223/079, G01N2223/305, G01N2223/316, G01N2223/345Filed as Applied Materials Israel Ltd.2026-03-12Doron Girmonsky | pending |
| PEDESTAL HEATER SUPPORT STRUCTUREFiled as APPLIED MATERIALS, INC.2026-03-11FRANK CHENG | pending |
| 2D FIBER ARRAY PACKAGING FOR OPTICAL INTERFACESFiled as APPLIED MATERIALS, INC.2026-03-11JINXIN FU | pending |
| FLUORIDE COATING TO IMPROVE CHAMBER PERFORMANCEH01J 37/32495, C23C 14/06, C23C 16/30, C23C 16/4404, C23C 16/45525, C23C 16/45529Filed as Applied Materials, Inc.2026-03-10Jennifer Y. Sun | pending |
| CLEANCOAT AND RELATED METHODS FOR SUBSTRATE PROCESSING CHAMBERSFiled as APPLIED MATERIALS, INC.2026-03-10HE LI | pending |
| APPARATUS AND TECHNIQUES FOR SUBSTRATE PROCESSING USING INDEPENDENT ION SOURCE AND RADICAL SOURCEH01J 37/304, H01J 37/20, H01J2237/201, H01J2237/202, H01J2237/303, H01J2237/30472, H01J2237/3142, H01J2237/3151, H01J2237/31701Filed as APPLIED Materials, Inc.2026-03-10Anthony Renau | pending |
| CLEANCOAT AND RELATED METHODS FOR SUBSTRATE PROCESSING CHAMBERSH01J 37/32862, H10P 72/7616, B08B 7/0035, C23C 16/14, C23C 16/4404, C23C 16/4405, C23C 16/50, H01J 37/3244, H01J 37/32486, H01J2237/3321Filed as Applied Materials, Inc.2026-03-10He LI | pending |
| RUTHENIUM SEEDING FOR CORROSION FREE MOLYBDENUM GROWTHFiled as APPLIED MATERIALS, INC.2026-03-10RUINAN ZHOU | pending |
| METHODS OF DEPOSITING SILICON-CONTAINING DIELECTRIC LAYERS FOR SEMICONDUCTOR DEVICESFiled as APPLIED MATERIALS, INC.2026-03-10ZHIJIE CHUA | pending |
| RUTHENIUM SEEDING FOR CORROSION FREE MOLYBDENUM GROWTHH10W 20/045, H10W 20/057, H10W 20/4446, C23C 16/0227, C23C 16/0281, C23C 16/045, C23C 16/45525Filed as Applied Materials, Inc.2026-03-09Ruinan Zhou | pending |
| METHODS OF FORMATION OF A SIGE/SI SUPERLATTICEH10D 62/8164, H10P 14/2905, H10P 14/3252, H10D 30/751, H10D 62/8171, H10P 14/3211, H10P 14/2926, H10P 14/24, H10P 14/3411, C23C 16/0209, C23C 16/24, C23C 16/45523, C30B 25/02, C30B 25/165, C30B 29/06, C30B 29/68Filed as Applied Materials, Inc.2026-03-09John TOLLE | pending |
| METHODS OF MANUFACTURING PLASMA GENERATING CELLS FOR A PLASMA SOURCEG01F 1/56, H01J 9/027, H05H 1/2418, H10W 20/087, B81B 7/0058, B81B 7/0061, B81B2201/0292, B81B2203/04, B81B2207/093, B81C 1/00301, B81C 1/00309, B81C2203/019, B81C2203/035, B81C2203/036, B81C2203/054, C23C 16/45504, C23C 16/45544, C23C 16/45557, C23C 16/45561, G01F 1/688, G01F 1/76, G01F 15/14, G01F 15/18, H01J 37/3244, H01J2237/24585, H05H 1/2406Filed as APPLIED MATERIALS, INC.2026-03-09David John Jorgensen | pending |
| BEZEL-LESS CAMERA AND SENSOR HOLEH10K 59/121, H10K 59/60, H10K 59/131, H10K 59/1201, H10K 59/65, H10K 59/122, H10K 59/70, H10K 59/123Filed as Applied Materials, Inc.2026-03-06Chung-chia CHEN | pending |
| MOISTURE BLOCKING STRUCTURES FOR ANODE PROTECTIONFiled as APPLIED MATERIALS, INC.2026-03-05YU-HSIN LIN | pending |
| ORGANIC LIGHT EMITTING MATERIAL PATTERNING FOR DOT TYPE CONFIGURATIONFiled as APPLIED MATERIALS, INC.2026-03-05YU-HSIN LIN | pending |
| SPIN-DRY CHAMBER FOR CLEANING VARIOUS SIZED SUBSTRATESFiled as APPLIED MATERIALS, INC.2026-03-05JASON A. RYE | pending |
| LED PANEL WITH CONTACT DEFINE LAYERFiled as APPLIED MATERIALS, INC.2026-03-04HYUNSUNG BANG | pending |
| SEMICONDUCTOR PROCESSING CHAMBER ADAPTERH10P 72/0421, H01J 37/32357, H01J 37/32082, H01J 37/3244, H01J 37/32449Filed as Applied Materials, Inc.2026-03-04Son T. Nguyen | pending |
| AMPOULE FOR A SEMICONDUCTOR MANUFACTURING PRECURSORC23C 16/4481, C23C 16/45561Filed as Applied Materials, Inc.2026-03-04William J. Durand | pending |
| BIPOLAR ELECTROSTATIC CHUCK ELECTRODE DESIGNSH10P 72/722, H01J 37/32724, H10P 72/72, C23C 16/4586, H01J 37/32082, H01J 37/32541, H01J 37/32568, H01J 37/32577, H01J 37/32715, H01J2237/2007, H01J2237/332Filed as Applied Materials, Inc.2026-03-04Jian Li | pending |
| MULTI-PORT CROSS FLOW SYSTEMH01J 37/32449, H01J 37/32834, H01J 37/32862, C23C 16/4412, C23C 16/4558, H01J2237/3321Filed as Applied Materials, Inc.2026-03-03Rupankar Choudhury | pending |
| EVAPORATION SYSTEM AND DEVICE STRUCTURE FOR LEAKAGE CURRENT MITIGATION OF ADVANCED OLED DEVICEFiled as APPLIED MATERIALS, INC.2026-03-03TAKASHI ANJIKI | pending |
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